公开(公告)号：US11084143B2

公开(公告)日：2021-08-10

申请号：US15873834

申请日：2018-01-17

Applicant: Applied Materials, Inc.

Inventor： Daniel Redfield

IPC: B24D11/00 ,  B29C64/112 ,  B29C64/393 ,  B33Y30/00 ,  B33Y80/00 ,  B33Y50/02 ,  B33Y10/00 ,  B29C64/282 ,  B29C64/40 ,  C09G1/16 ,  B24B37/20 ,  B29L31/00

Abstract: A method of fabricating a polishing pad using an additive manufacturing system includes depositing successive layers by droplet ejection to form the polishing pad. The polishing pad includes a polishing surface having one or more partitions separated by one or more grooves. Depositing a layer of the successive layers includes dispensing first regions corresponding to edges of the one or more partitions by a first droplet ejection process. After curing the first regions, a second region corresponding to interior of the one or more partitions is dispensed between the edges by a different second droplet ejection process.

公开(公告)号：US11059149B2

公开(公告)日：2021-07-13

申请号：US15873799

申请日：2018-01-17

Applicant: Applied Materials, Inc.

Inventor： Daniel Redfield ,  Jason Garcheung Fung ,  Mayu Felicia Yamamura

IPC: B24D11/00 ,  B29C64/112 ,  B29C64/393 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y80/00 ,  B33Y50/02 ,  B29C64/282 ,  B29C64/40 ,  C09G1/16 ,  B24B37/20 ,  B29L31/00

Abstract: Data indicative of a desired shape of the polishing pad to be fabricated by droplet ejection by the additive manufacturing system is received. The data includes a desired shape defining a desired profile including a polishing surface having one or more partitions separated by one or more grooves on the polishing pad. Data indicative of distortions from the desired profile caused by dispensing of layers by droplet ejection by the additive manufacturing system is generated. Data indicative of an initial layer to dispense by droplet ejection is generated to at least partially compensate for the distortions from the desired profile. The initial layer is dispensed on a support by droplet ejection. Overlying layers are dispensed on the initial layer by droplet ejection by the additive manufacturing system to form the polishing pad.

公开(公告)号：US10773509B2

公开(公告)日：2020-09-15

申请号：US15452053

申请日：2017-03-07

Applicant: Applied Materials, Inc.

Inventor： Hou T. Ng ,  Nag B. Patibandla ,  Rajeev Bajaj ,  Daniel Redfield ,  Ashwin Chockalingam ,  Mayu Yamamura ,  Mario Cornejo

IPC: B33Y10/00 ,  G03F7/00 ,  G03F7/20 ,  B33Y30/00 ,  B33Y80/00 ,  B24B37/22 ,  B29K105/00

Abstract: A method and apparatus for manufacturing polishing articles used in polishing processes are provided. In one implementation, a method of forming a polishing pad is provided. The method comprises depositing an uncured first layer of a pad forming photopolymer on a substrate. The method further comprises positioning a first optical mask over the first layer of the uncured pad forming photopolymer. The first optical mask includes a patterned sheet of material having at least one aperture. The method further comprises exposing the uncured first layer of the pad forming photopolymer to electromagnetic radiation to selectively polymerize exposed portions of the uncured first layer of the pad forming photopolymer to form pad-supporting structures within the first layer of pad forming photopolymer.

公开(公告)号：US10537974B2

公开(公告)日：2020-01-21

申请号：US15876436

申请日：2018-01-22

Applicant: Applied Materials, Inc.

Inventor： Rajeev Bajaj ,  Kasiraman Krishnan ,  Mahendra C. Orilall ,  Daniel Redfield ,  Fred C. Redeker ,  Nag B. Patibandla ,  Gregory E. Menk ,  Jason G. Fung ,  Russell Edward Perry ,  Robert E. Davenport

IPC: B24D18/00 ,  B24B37/26 ,  B24B37/24 ,  B33Y80/00 ,  B24B37/20 ,  B24B37/22 ,  B29C64/112

Abstract: Embodiments of the disclosure generally provide polishing pads includes a composite pad body and methods for forming the polishing pads. One embodiment provides a polishing pad including a composite pad body. The composite pad body includes one or more first features formed from a first material or a first composition of materials, and one or more second features formed from a second material or a second composition of materials, wherein the one or more first features and the one or more second features are formed by depositing a plurality of layers comprising the first material or first composition of materials and second material or second composition of materials.

公开(公告)号：US20180339401A1

公开(公告)日：2018-11-29

申请号：US15873799

申请日：2018-01-17

Applicant: Applied Materials, Inc.

Inventor： Daniel Redfield ,  Jason Garcheung Fung ,  Mayu Felicia Yamamura

IPC: B24D11/00 ,  B29C64/112 ,  B29C64/393 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y80/00 ,  B33Y50/02

Abstract: Data indicative of a desired shape of the polishing pad to be fabricated by droplet ejection by the additive manufacturing system is received. The data includes a desired shape defining a desired profile including a polishing surface having one or more partitions separated by one or more grooves on the polishing pad. Data indicative of distortions from the desired profile caused by dispensing of layers by droplet ejection by the additive manufacturing system is generated. Data indicative of an initial layer to dispense by droplet ejection is generated to at least partially compensate for the distortions from the desired profile. The initial layer is dispensed on a support by droplet ejection. Overlying layers are dispensed on the initial layer by droplet ejection by the additive manufacturing system to form the polishing pad.

公开(公告)号：US09832816B2

公开(公告)日：2017-11-28

申请号：US14258410

申请日：2014-04-22

Applicant: Applied Materials, Inc.

Inventor： Kin Pong Lo ,  Paul Brillhart ,  Balasubramanian Ramachandran ,  Satheesh Kuppurao ,  Daniel Redfield ,  Joseph M. Ranish ,  James Francis Mack ,  Kailash Kiran Patalay ,  Michael Olsen ,  Eddie Feigel ,  Richard Halpin ,  Brett Vetorino

IPC: G02B5/08 ,  H05B3/00 ,  H01L21/67

CPC classification number: H05B3/0047 ,  H01L21/67115

Abstract: Embodiments of the disclosure generally relate to a reflector for use in a thermal processing chamber. In one embodiment, the thermal processing chamber generally includes an upper dome, a lower dome opposing the upper dome, the upper dome and the lower dome defining an internal volume of the processing chamber, a substrate support disposed within the internal volume, and a reflector positioned above and proximate to the upper dome, wherein the reflector has a heat absorptive coating layer deposited on a side of the reflector facing the substrate support.

公开(公告)号：US20250121472A1

公开(公告)日：2025-04-17

申请号：US18486094

申请日：2023-10-12

Applicant: Applied Materials, Inc.

Inventor： Liu Jiang ,  Prayudi Lianto ,  Santosh Kumar Rath ,  Nina Bao ,  Muhammad Adli Danish ,  Aniruddh Khanna ,  Pin Gian Gan ,  Mohammad Faizal Bin Aermie Ang ,  Mayu Yamamura ,  Sivapackia Ganapathiappan ,  Daniel Redfield ,  El Mehdi Bazizi ,  Yen-Chu Yang ,  Pang Yen Ong ,  Rajeev Bajaj

IPC: B24B37/26 ,  B24B37/22 ,  B24D18/00

Abstract: Printable resin precursor compositions and polishing articles including printable resin precursors are provided that are particularly suited for polishing substrates utilized in hybrid bonding applications. Methods and articles may include a plurality of first polishing elements, where at least one of the plurality of first polymer layers forms the polishing surface; and one or more second polishing elements, where at least a region of each of the one or more second polishing elements is disposed between at least one of the plurality of first polishing elements and a supporting surface of the polishing pad. One or more first polishing elements have a Shore D hardness of greater than 60, one or more second polishing elements have a Shore D hardness of from about 20 to less than 60, and the polishing article has a total Shore D hardness of greater than or about 50.

公开(公告)号：US11986922B2

公开(公告)日：2024-05-21

申请号：US16731492

申请日：2019-12-31

Applicant: Applied Materials, Inc.

Inventor： Jason G. Fung ,  Rajeev Bajaj ,  Daniel Redfield ,  Aniruddh Jagdish Khanna ,  Mario Cornejo ,  Gregory E. Menk ,  John Watkins

IPC: B29C64/00 ,  B24B37/26 ,  B24B49/00 ,  B24B49/10 ,  B24B49/14 ,  B24B49/16 ,  B33Y10/00 ,  B33Y80/00 ,  H01L21/306 ,  H01L21/66 ,  H01L21/67 ,  B29L31/00

CPC classification number: B24B37/26 ,  B24B49/003 ,  B24B49/10 ,  B24B49/14 ,  B24B49/16 ,  B33Y10/00 ,  B33Y80/00 ,  H01L21/30625 ,  H01L21/67075 ,  H01L21/67253 ,  H01L21/67294 ,  H01L22/20 ,  B29K2995/0003 ,  B29K2995/0005 ,  B29L2031/736 ,  H01L22/12 ,  H01L22/26

Abstract: Chemical mechanical polishing (CMP) apparatus and methods for manufacturing CMP apparatus are provided herein. CMP apparatus may include polishing pads, polishing head retaining rings, and polishing head membranes, among others, and the CMP apparatus may be manufactured via additive manufacturing processes, such as three dimensional (3D) printing processes. The CMP apparatus may include wireless communication apparatus components integrated therein. Methods of manufacturing CMP apparatus include 3D printing wireless communication apparatus into a polishing pad and printing a polishing pad with a recess configured to receive a preformed wireless communication apparatus.

公开(公告)号：US11964359B2

公开(公告)日：2024-04-23

申请号：US16661400

申请日：2019-10-23

Applicant: Applied Materials, Inc.

Inventor： Ashwin Chockalingham ,  Mahendra C. Orilall ,  Mayu Yamamura ,  Boyi Fu ,  Rajeev Bajaj ,  Daniel Redfield

IPC: B33Y80/00 ,  B24B37/20 ,  B24B37/22 ,  B24B37/24 ,  B24B37/26 ,  B24D18/00 ,  H01L21/306

CPC classification number: B24B37/20 ,  B24B37/22 ,  B24B37/24 ,  B24B37/26 ,  B24D18/0045 ,  B33Y80/00 ,  H01L21/30625

Abstract: Implementations described herein generally relate to polishing articles and methods of manufacturing polishing articles used in polishing processes and cleaning processes. More particularly, implementations disclosed herein relate to composite polishing articles having graded properties. In one implementation, a polishing article is provided. The polishing article comprises one or more exposed first regions formed from a first material and having a first zeta potential and one or more second exposed regions formed from a second material and having a second zeta potential, wherein the first zeta potential is different from the second zeta potential.

公开(公告)号：US11851570B2

公开(公告)日：2023-12-26

申请号：US16668961

申请日：2019-10-30

Applicant: Applied Materials, Inc.

Inventor： Uma Sridhar ,  Sivapackia Ganapathiappan ,  Ashwin Chockalingam ,  Yingdong Luo ,  Daniel Redfield ,  Rajeev Bajaj ,  Nag B. Patibandla ,  Hou T. Ng ,  Sudhakar Madhusoodhanan

IPC: B29C64/112 ,  C09D11/38 ,  B24B37/24 ,  C09D11/107 ,  C09D11/101 ,  B33Y80/00 ,  B33Y70/00 ,  B29L31/00 ,  B29K33/00 ,  B33Y10/00

CPC classification number: C09D11/38 ,  B24B37/245 ,  B33Y70/00 ,  B33Y80/00 ,  C09D11/101 ,  C09D11/107 ,  B29C64/112 ,  B29K2033/08 ,  B29L2031/736 ,  B33Y10/00

Abstract: Polishing articles and methods of manufacturing polishing articles used in polishing processes and cleaning processes are provided. More particularly, implementations disclosed herein relate to composite polishing articles having tunable properties such as hydrophilicity and zeta potential. 3D printed chemical-mechanical planarization (CMP) pads composed of UV curable acrylic chemistry are generally hydrophobic in nature. Such hydrophobic behavior affects the wetting properties with abrasive-based polishing slurries such as ceria-base slurries. However, in order to increase the planarization and removal rate while decreasing defects, hydrophilic pads are preferred. In addition, it is desirable that the zeta potential (Zp) of the pads be tunable over a wide range of conditions at different pH values. Implementations of the present disclosure include methods for increasing the hydrophilicity and tuning the Zp of the pads with anionic additives and pads produced using these methods.