公开(公告)号：US20170018539A1

公开(公告)日：2017-01-19

申请号：US15279043

申请日：2016-09-28

申请人： Bridgelux, Inc.

发明人： R. Scott West

IPC分类号： H01L25/075 ,  H01L33/62 ,  H01L33/50 ,  H01L33/46 ,  H01L33/60

CPC分类号： H01L25/0753 ,  H01L33/46 ,  H01L33/502 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/181 ,  H01L2933/0025 ,  H01L2933/0058 ,  H01L2933/0066 ,  H01L2924/00 ,  H01L2924/00012

摘要： A layer of Highly Reflective (HR) material is deposited by jetting microdots of the HR material in liquid form onto a substrate and then allowing the HR material to harden. In one example, the HR layer is the HR layer of a white LED assembly. The HR layer is jetted onto the substrate around LED dice of the assembly after die attach and wire bonding have been completed. The HR material can be made to flow laterally so that areas of the substrate under wire bonds are coated with HR material, so that HR material contacts side edges of the LED dice, and so that HR material contacts the inside side edge of a retaining ring. By jetting the HR material in this way, the amount of substrate that is not covered with HR material is reduced, thereby improving the light efficiency of the resulting LED assembly.

摘要翻译： 通过将液体形式的HR材料的微粒喷射到基底上，然后使HR材料硬化来沉积一层高反射（HR）材料。 在一个示例中，HR层是白色LED组件的HR层。 在芯片附着和引线接合完成之后，将HR层喷射到组件的LED芯片周围的基板上。 可以使HR材料横向流动，使得在线接合处的基底区域涂覆有HR材料，使得HR材料接触LED骰子的侧边缘，并且使得HR材料接触保持环的内侧边缘 。 通过以这种方式喷射HR材料，减少了不被HR材料覆盖的基板的量，从而提高了所得LED组件的光效率。

公开(公告)号：US09468052B2

公开(公告)日：2016-10-11

申请号：US14847819

申请日：2015-09-08

申请人： Bridgelux, Inc.

发明人： Michael Neal Gershowitz ,  R. Scott West ,  Babak Imangholi

IPC分类号： H01L29/18 ,  H01L33/00 ,  H05B33/08 ,  H01L25/16 ,  F21V23/02 ,  H05B37/02 ,  F21V23/00 ,  F21V29/70 ,  H01L25/075 ,  H01L33/48 ,  H01L33/50 ,  H01L33/54 ,  H01L33/62 ,  H05K1/14 ,  H05K3/00 ,  F21Y101/00

CPC分类号： H05B33/0815 ,  F21K9/20 ,  F21V23/006 ,  F21V23/02 ,  F21V29/70 ,  F21Y2101/00 ,  F21Y2105/10 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L25/167 ,  H01L33/486 ,  H01L33/507 ,  H01L33/54 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/73265 ,  H01L2924/181 ,  H05B33/0824 ,  H05B33/0827 ,  H05B33/083 ,  H05B33/0842 ,  H05B33/0845 ,  H05B33/0884 ,  H05B33/089 ,  H05B37/0272 ,  H05K1/142 ,  H05K3/0061 ,  H05K2201/10106 ,  H01L2924/00014 ,  H01L2924/00012

摘要： An LAM/ICM assembly comprises an integrated control module (ICM) and an LED array member (LAM). The ICM includes interconnect through which power from outside the assembly is received. In a first novel aspect, active circuitry is embedded in the ICM. In one example, the circuitry monitors LED operation, controls and supplies power to the LEDs, and communicates information into and out of the assembly. In a second novel aspect, a lighting system comprises an AC-to-DC converter and a LAM/ICM assembly. The AC-to-DC converter outputs a substantially constant current or voltage. The magnitude of the current or voltage is adjusted by a signal output from the LAM/ICM. In a third novel aspect, the ICM includes a switching DC-to-DC converter. An AC-to-DC power supply supplies a roughly regulated supply voltage. The switching converter within the LAM/ICM receives the roughly regulated voltage and supplies a regulated LED drive current to its LEDs.

公开(公告)号：US09439299B2

公开(公告)日：2016-09-06

申请号：US14229903

申请日：2014-03-29

申请人： Bridgelux, Inc.

发明人： Robert Tudhope ,  R. Scott West

IPC分类号： F21K99/00 ,  F21V13/04 ,  H05K3/32 ,  F21V23/00 ,  F21V5/08 ,  F21V29/70 ,  F21V31/00 ,  F21Y101/02 ,  F21V7/05 ,  F21Y105/00 ,  H05K1/02 ,  H05K1/14

CPC分类号： H05K3/32 ,  F21K9/00 ,  F21K9/90 ,  F21V5/08 ,  F21V7/05 ,  F21V13/04 ,  F21V23/005 ,  F21V29/70 ,  F21V31/005 ,  F21Y2101/00 ,  F21Y2105/10 ,  F21Y2115/10 ,  H05K1/0203 ,  H05K1/141 ,  H05K1/142 ,  H05K2201/048 ,  H05K2201/10106 ,  Y02B20/72 ,  Y10T29/4913

摘要： A low-profile lighting module with light-emitting diodes (LEDs) has a water-tight seal between a molded-plastic cover and a printed circuit board (PCB). A substrate with the LEDs fits up into an indentation in the lower surface of the PCB. Landing pads on the top of the substrate attach to contact pads in the indentation that are extensions of a conductor of the PCB which is electrically coupled through the landing pads to the LEDs. A lens with a curved optical portion surrounded by a flat lip fits into another indentation on the upper surface of the PCB. A highly reflective sheet is disposed between the planar lower surface of the lens and bottom of the indentation in the upper surface. A double-sided adhesive sheet is disposed under the inside surface of the molded-plastic cover and over both the upper surface of the PCB and the flat lip of the lens.

摘要翻译： 具有发光二极管（LED）的低调照明模块在模制塑料盖和印刷电路板（PCB）之间具有防水密封。 具有LED的衬底在PCB的下表面中嵌合成凹陷。 衬底顶部的着陆垫附着在凹槽中的接触垫上，PCB中的导体的延伸部分通过着陆焊盘电耦合到LED。 具有由平坦唇部包围的弯曲光学部分的透镜装配到PCB的上表面上的另一个凹陷中。 高反射性片材设置在透镜的平面下表面和上表面的凹陷的底部之间。 双面粘合片设置在模制塑料盖的内表面下方，并且在PCB的上表面和透镜的平唇之间。

公开(公告)号：US20160197061A1

公开(公告)日：2016-07-07

申请号：US15067145

申请日：2016-03-10

申请人： Bridgelux, Inc.

发明人： R. Scott West ,  Tao Tong ,  Mike Kwon ,  Michael Solomensky

IPC分类号： H01L25/075 ,  H01L33/64 ,  H01L33/62

CPC分类号： H01L25/0753 ,  H01L33/486 ,  H01L33/505 ,  H01L33/54 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H01L33/64 ,  H01L33/642 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/49113 ,  H01L2224/73265 ,  H01L2924/07811 ,  H01L2933/0041 ,  H01L2933/005 ,  H01L2933/0058 ,  H01L2933/0066 ,  H01L2933/0075 ,  H01L2924/00014 ,  H01L2924/00

摘要： Standardized photon building blocks are packaged in molded interconnect structures to form a variety of LED array products. No electrical conductors pass between the top and bottom surfaces of the substrate upon which LED dies are mounted. Microdots of highly reflective material are jetted onto the top surface. Landing pads on the top surface of the substrate are attached to contact pads disposed on the underside of a lip of the interconnect structure. In a solder reflow process, the photon building blocks self-align within the interconnect structure. Conductors in the interconnect structure are electrically coupled to the LED dies in the photon building blocks through the contact pads and landing pads. Compression molding is used to form lenses over the LED dies and leaves a flash layer of silicone covering the landing pads. The flash layer laterally above the landing pads is removed by blasting particles at the flash layer.

摘要翻译： 标准化的光子构建块被封装在模制的互连结构中以形成各种LED阵列产品。 没有电导体穿过安装有LED管芯的基板的顶表面和底表面之间。 高反射材料的微点喷射到顶面上。 衬底顶表面上的着陆垫连接到布置在互连结构的唇缘下侧的接触垫。 在焊料回流工艺中，光子构建块在互连结构内自对准。 互连结构中的导体通过接触焊盘和着陆焊盘电耦合到光子构建块中的LED管芯。 压缩成型用于在LED管芯上形成透镜，并留下覆盖着色焊盘的硅胶闪光层。 通过在闪光层处的喷砂颗粒去除着陆垫上方的闪光层。

公开(公告)号：US09065024B2

公开(公告)日：2015-06-23

申请号：US13866562

申请日：2013-04-19

申请人： Bridgelux, Inc.

发明人： Tao Tong ,  Wenhui Zhang ,  R. Scott West

IPC分类号： H01L33/58 ,  H01L33/50 ,  H01L25/075 ,  H01L33/54

CPC分类号： H01L33/507 ,  H01L25/0753 ,  H01L33/50 ,  H01L33/505 ,  H01L33/54 ,  H01L33/60 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2933/0041 ,  H01L2933/0058 ,  H01L2933/0066 ,  H01L2924/00

摘要： An LED device with improved angular color performance has a silicone lens shaped as a portion of a sphere. The lens is molded over an array of LED dies disposed on the upper surface of a substrate. Phosphor particles are disbursed throughout the material used to mold the lens. The distance between farthest apart edges of the LED dies is more than half of the length that the lens extends over the surface of the substrate. The distance from the top of the lens dome to the surface of the substrate is between 57% and 73% of the radius of the sphere. Shaping the lens as the top two thirds of a hemisphere reduces the non-uniformity in the emitted color such that neither of the CIE color coordinates x or y of the color changes more than 0.004 over all emission angles relative to the surface of the substrate.

摘要翻译： 具有改进的角度颜色性能的LED装置具有形状为球体的一部分的硅氧烷透镜。 透镜被模制在设置在基板的上表面上的LED管芯阵列上。 在用于模制透镜的整个材料中分发荧光体颗粒。 LED管芯的最远分开的边缘之间的距离大于透镜在衬底表面上延伸的长度的一半。 从透镜圆顶顶部到基板表面的距离在球体半径的57％至73％之间。 将透镜整形为半球的前三分之二减少发射颜色的不均匀性，使得颜色的CIE色坐标x或y在相对于衬底表面的所有发射角度上都不超过0.004。

公开(公告)号：US20150054406A1

公开(公告)日：2015-02-26

申请号：US14530042

申请日：2014-10-31

申请人： Bridgelux, Inc.

发明人： Michael Neal Gershowitz ,  R. Scott West ,  Babak Imangholi

IPC分类号： H05B33/08 ,  H05B37/02 ,  F21K99/00 ,  F21V29/00

CPC分类号： H05B33/0815 ,  F21K9/20 ,  F21V23/006 ,  F21V23/02 ,  F21V29/70 ,  F21Y2101/00 ,  F21Y2105/10 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L25/167 ,  H01L33/486 ,  H01L33/507 ,  H01L33/54 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/73265 ,  H01L2924/181 ,  H05B33/0824 ,  H05B33/0827 ,  H05B33/083 ,  H05B33/0842 ,  H05B33/0845 ,  H05B33/0884 ,  H05B33/089 ,  H05B37/0272 ,  H05K1/142 ,  H05K3/0061 ,  H05K2201/10106 ,  H01L2924/00014 ,  H01L2924/00012

摘要： An LAM/ICM assembly comprises an integrated control module (ICM) and an LED array member (LAM). The ICM includes interconnect through which power from outside the assembly is received. In a first novel aspect, active circuitry is embedded in the ICM. In one example, the circuitry monitors LED operation, controls and supplies power to the LEDs, and communicates information into and out of the assembly. In a second novel aspect, a lighting system comprises an AC-to-DC converter and a LAM/ICM assembly. The AC-to-DC converter outputs a substantially constant current or voltage. The magnitude of the current or voltage is adjusted by a signal output from the LAM/ICM. In a third novel aspect, the ICM includes a switching DC-to-DC converter. An AC-to-DC power supply supplies a roughly regulated supply voltage. The switching converter within the LAM/ICM receives the roughly regulated voltage and supplies a regulated LED drive current to its LEDs.

公开(公告)号：US08941129B1

公开(公告)日：2015-01-27

申请号：US14046459

申请日：2013-10-04

申请人： Bridgelux, Inc.

发明人： Michael Neal Gershowitz ,  R. Scott West ,  Babak Imangholi

IPC分类号： H01L29/18 ,  H01L33/00 ,  H01L25/16

CPC分类号： H05B33/0815 ,  F21K9/20 ,  F21V23/006 ,  F21V23/02 ,  F21V29/70 ,  F21Y2101/00 ,  F21Y2105/10 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L25/167 ,  H01L33/486 ,  H01L33/507 ,  H01L33/54 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/73265 ,  H01L2924/181 ,  H05B33/0824 ,  H05B33/0827 ,  H05B33/083 ,  H05B33/0842 ,  H05B33/0845 ,  H05B33/0884 ,  H05B33/089 ,  H05B37/0272 ,  H05K1/142 ,  H05K3/0061 ,  H05K2201/10106 ,  H01L2924/00014 ,  H01L2924/00012

摘要： An LAM/ICM assembly comprises an integrated control module (ICM) and an LED array member (LAM). The ICM includes interconnect through which power from outside the assembly is received. In a first novel aspect, active circuitry is embedded in the ICM. In one example, the circuitry monitors LED operation, controls and supplies power to the LEDs, and communicates information into and out of the assembly. In a second novel aspect, a lighting system comprises an AC-to-DC converter and a LAM/ICM assembly. The AC-to-DC converter outputs a substantially constant current or voltage. The magnitude of the current or voltage is adjusted by a signal output from the LAM/ICM. In a third novel aspect, the ICM includes a switching DC-to-DC converter. An AC-to-DC power supply supplies a roughly regulated supply voltage. The switching converter within the LAM/ICM receives the roughly regulated voltage and supplies a regulated LED drive current to its LEDs.

摘要翻译： LAM / ICM组件包括集成控制模块（ICM）和LED阵列构件（LAM）。 ICM包括从组件外部接收电力的互连。 在第一个新颖的方面，有源电路嵌入在ICM中。 在一个示例中，电路监视LED操作，控制并向LED供电，并将信息传入和传出组件。 在第二个新颖的方面，照明系统包括AC-DC转换器和LAM / ICM组件。 AC-DC转换器输出基本恒定的电流或电压。 通过从LAM / ICM输出的信号来调节电流或电压的幅度。 在第三个新颖的方面，ICM包括开关DC-DC转换器。 AC到DC电源提供大致稳定的电源电压。 LAM / ICM内的开关转换器接收大致调节的电压，并向其LED提供调节的LED驱动电流。

公开(公告)号：US08803180B2

公开(公告)日：2014-08-12

申请号：US14060860

申请日：2013-10-23

申请人： Bridgelux, Inc.

发明人： R. Scott West ,  Tao Tong ,  Mike Kwon

IPC分类号： H01L33/56 ,  H01L33/58 ,  B24C1/04 ,  B24C3/32 ,  B24C1/00 ,  H01L25/075 ,  H01L33/54

CPC分类号： H01L33/56 ,  B24C1/003 ,  B24C1/04 ,  B24C3/322 ,  H01L25/0753 ,  H01L33/54 ,  H01L33/58 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2933/0033 ,  H01L2933/005 ,  H01L2924/00 ,  H01L2924/00014

摘要： Using compression molding to form lenses over LED arrays on a metal core printed circuit board leaves a flash layer of silicone covering the contact pads that are later required to connect the arrays to power. A method for removing the flash layer involves blasting particles of sodium bicarbonate at the flash layer. A nozzle is positioned within thirty millimeters of the top surface of the flash layer. The stream of air that exits from the nozzle is directed towards the top surface at an angle between five and thirty degrees away from normal to the top surface. The particles of sodium bicarbonate are added to the stream of air and then collide into the top surface of the silicone flash layer until the flash layer laterally above the contact pads is removed. The edge of silicone around the cleaned contact pad thereafter contains a trace amount of sodium bicarbonate.

摘要翻译： 使用压缩成型在金属芯印刷电路板上的LED阵列上形成透镜，留下覆盖接触焊盘的硅胶闪光层，这些接触焊盘将阵列连接到电源。 去除闪蒸层的方法包括在闪蒸层处喷射碳酸氢钠颗粒。 喷嘴位于闪光层顶表面三十毫米内。 从喷嘴出来的空气流以垂直于顶表面的五至三十度之间的角度指向顶表面。 将碳酸氢钠颗粒加入到空气流中，然后碰撞到硅氧烷闪蒸层的顶表面，直到去除接触垫横向上方的闪蒸层。 清洁的接触垫周围的硅树脂的边缘其后含有痕量的碳酸氢钠。