摘要:
A sensor semiconductor device is proposed. A plurality of metal bumps and a sensor chip are mounted on a substrate. A dielectric layer and a circuit layer are formed on the substrate, wherein the circuit layer is electrically connected to the metal bumps and the sensor chip. Thus, the sensor chip is electrically connected to the substrate via the circuit layer and the metal bumps. The dielectric layer is formed with an opening for exposing a sensor region of the sensor chip. A light-penetrable lid covers the opening of the dielectric layer, such that light is able to penetrate the light-penetrable lid to reach the sensor region and activate the sensor chip. A plurality of solder balls are mounted on a surface of the substrate free of mounting the sensor chip, for electrically connecting the sensor chip to an external device.
摘要:
A sensor module structure and a method for fabricating the same are proposed. A chip carrier module plate including a plurality of chip carriers is provided, each chip carrier having a first surface and a second surface. At least one semiconductor chip is mounted on and electrically connected to the first surface of each of the chip carriers. An encapsulation body is formed for completely encapsulating the semiconductor chips and the first surfaces of the chip carriers. A singulation process is performed to form individual package units integrated with the semiconductor chips. A sensor chip, a corresponding lens kit and a flexible printed circuit (FPC) board are attached to the second surface of each of the chip carriers, wherein the sensor chip and the FPC board are electrically connected to the chip carrier. This provides the sensor module structure fabricated with simple processes, low costs and high yields.
摘要:
A semiconductor package and a fabrication method of the same are proposed. A chip formed with a plurality of electrode pads on an active surface thereof, and a substrate having a first surface, a corresponding second surface and at least one opening penetrating therethrough are provided. A part of the electrode pads of the chip are electrically connected to the second surface of the substrate by bonding wires passing through the opening of the substrate, and the rest of the electrode pads of the chip are electrically connected to the first surface of the substrate by conductive bumps. A molding process is performed to form a first encapsulant on the first surface of the substrate for encapsulating the chip and form a second encapsulant on the second surface of the substrate for encapsulating the bonding wires. A plurality of solder balls are implanted on the second surface of the substrate.
摘要:
A photosensitive semiconductor package with a support member and its fabrication method are provided. The support member having a receiving space is placed on an upper surface of a substrate. An encapsulation body is formed on the substrate and bonded with an outer wall of the support member. At least one chip is mounted on a predetermined area of the substrate exposed via the receiving space, and is electrically connected to the substrate. A light-permeable lid is attached to the support member and the encapsulation body to seal the receiving space. A plurality of solder balls or contact lands are formed on a lower surface of the substrate. By provision of the support member, there is no need to use an insert mold, such that the substrate would not be damaged by the insert mold, and bond fingers on the substrate would not be contaminated by the insert mold.
摘要:
A fabrication method of a semiconductor package with a photosensitive chip is provided. A substrate having a core is prepared. An interposer is mounted on the substrate, with a peripheral portion of the substrate exposed from the interposer. A molding process is performed and the substrate is clamped between an upper mold and a lower mold, with the interposer received in an upwardly-recessed cavity of the upper mold. A molding compound is injected into the upwardly-recessed cavity to form a dam on the peripheral portion of the substrate. Then the upper and lower molds and the interposer are removed from the substrate to expose area covered by the interposer on the substrate. At least one photosensitive chip is mounted on the exposed area of the substrate. A lid seals the dam such that the chip is received in a space defined by the substrate, the dam and the lid.
摘要:
A ball grid array semiconductor package is proposed, wherein at least a chip is mounted on a substrate, and signal pads on the chip are electrically connected to signal fingers on the substrate by bonding wires. A power plate and a ground plate are each attached at two ends thereof respectively to predetermined positions on the chip and substrate, without interfering with the bonding wires. No power ring or ground ring is necessarily formed on the substrate, thereby reducing restriction on trace routability of the substrate. Further, with no provision of power wires or ground wires, short circuit of the bonding wires is less likely to occur, and thus production yield is enhanced. In addition, the power plate and ground plate provide shielding effect for protecting the chip against external electric-magnetic interference, and are partly in direct contact with the atmosphere for improving heat dissipating efficiency of the semiconductor package.
摘要:
A heat dissipating semiconductor package and a fabrication method thereof are provided. A semiconductor chip is mounted on a chip carrier. A heat sink is mounted on the chip, and includes an insulating core layer, a thin metallic layer formed on each of an upper surface and a lower surface of the insulating core layer and a thermal via hole formed in the insulating core layer. A molding process is performed to encapsulate the chip and the heat sink with an encapsulant to form a package unit. A singulation process is performed to peripherally cut the package unit. A part of the encapsulant above the thin metallic layer on the upper surface of the heat sink is removed, such that the thin metallic layer on the upper surface of the heat sink is exposed, and heat generated by the chip can be dissipated through the heat sink.
摘要:
Proposed is a package structure having a micro-electromechanical (MEMS) element, including a chip having a plurality of electrical connecting pads and a MEMS element formed thereon; a lid disposed on the chip for covering the MEMS element; a stud bump disposed on each of the electrical connecting pads; an encapsulant formed on the chip with part of the stud bumps being exposed from the encapsulant; and a metal conductive layer formed on the encapsulant and connected to the stud bumps. The invention is characterized by completing the packaging process on the wafer directly to enable thinner and cheaper package structures to be fabricated within less time. This invention further provides a method for fabricating the package structure as described above.
摘要:
A semiconductor package and a fabrication method thereof are provided in which a dielectric material layer formed with a plurality of openings is used and a solder material is applied into each of the openings. A first copper layer and a second copper layer are in turn deposited over the dielectric material layer and solder materials, and the first and second copper layers are patterned to form a plurality of conductive traces each of which has a terminal coated with a metal layer. A chip is mounted on the conductive traces and electrically connected to the terminals by bonding wires, with the dielectric material layer and solder materials being exposed to the outside. This package structure can flexibly arrange the conductive traces and effectively shorten the bonding wires, thereby improve trace routability and quality of electrical connection for the semiconductor package.