公开(公告)号：US06667546B2

公开(公告)日：2003-12-23

申请号：US10039884

申请日：2002-01-03

申请人： Chien-Ping Huang ,  Eric Ko ,  Chih-Ming Huang

发明人： Chien-Ping Huang ,  Eric Ko ,  Chih-Ming Huang

IPC分类号： H01L2310

CPC分类号： H01L24/85 ,  H01L23/3128 ,  H01L23/552 ,  H01L24/37 ,  H01L24/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/91 ,  H01L2224/05554 ,  H01L2224/371 ,  H01L2224/40095 ,  H01L2224/40225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48233 ,  H01L2224/49175 ,  H01L2224/73221 ,  H01L2224/8485 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10161 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2924/00012

摘要： A ball grid array semiconductor package is proposed, wherein at least a chip is mounted on a substrate, and signal pads on the chip are electrically connected to signal fingers on the substrate by bonding wires. A power plate and a ground plate are each attached at two ends thereof respectively to predetermined positions on the chip and substrate, without interfering with the bonding wires. No power ring or ground ring is necessarily formed on the substrate, thereby reducing restriction on trace routability of the substrate. Further, with no provision of power wires or ground wires, short circuit of the bonding wires is less likely to occur, and thus production yield is enhanced. In addition, the power plate and ground plate provide shielding effect for protecting the chip against external electric-magnetic interference, and are partly in direct contact with the atmosphere for improving heat dissipating efficiency of the semiconductor package.

摘要翻译： 提出了一种球栅阵列半导体封装，其中至少芯片安装在基板上，并且芯片上的信号焊盘通过接合线与基板上的信号指状电连接。 功率板和接地板分别在其两端分别连接到芯片和基板上的预定位置，而不会妨碍接合线。 在基板上不必形成功率环或接地环，从而减少对基板的微量可路由性的限制。 此外，由于不设置电源线或接地线，因此不太可能发生接合线的短路，从而提高了生产率。 此外，功率板和接地板提供屏蔽效果，用于保护芯片免受外部电磁干扰，并且部分地与大气直接接触，以提高半导体封装的散热效率。

公开(公告)号：US08198689B2

公开(公告)日：2012-06-12

申请号：US12769041

申请日：2010-04-28

申请人： Chang-Yueh Chan ,  Chien-Ping Huang ,  Chun-Chi Ke ,  Chun-An Huang ,  Chih-Ming Huang

发明人： Chang-Yueh Chan ,  Chien-Ping Huang ,  Chun-Chi Ke ,  Chun-An Huang ,  Chih-Ming Huang

IPC分类号： H01L23/485

CPC分类号： H01L21/02 ,  B81B7/007 ,  B81B2207/07 ,  H01L23/52 ,  H01L29/84 ,  H01L2224/02166 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2924/1461 ,  H01L2924/00014 ,  H01L2924/00

摘要： Proposed is a package structure having a micro-electromechanical (MEMS) element, including a chip having a plurality of electrical connecting pads and a MEMS element formed thereon; a lid disposed on the chip for covering the MEMS element; a stud bump disposed on each of the electrical connecting pads; an encapsulant formed on the chip with part of the stud bumps being exposed from the encapsulant; and a metal conductive layer formed on the encapsulant and connected to the stud bumps. The invention is characterized by completing the packaging process on the wafer directly to enable thinner and cheaper package structures to be fabricated within less time. This invention further provides a method for fabricating the package structure as described above.

摘要翻译： 提出具有微机电（MEMS）元件的封装结构，其包括具有多个电连接焊盘和形成在其上的MEMS元件的芯片; 设置在所述芯片上用于覆盖所述MEMS元件的盖; 设置在每个电连接焊盘上的螺柱凸块; 形成在芯片上的密封剂，其中一部分柱状凸块从密封剂暴露出来; 以及金属导电层，形成在密封剂上并连接到凸块上。 本发明的特征在于直接完成晶片上的封装工艺，以便在更短的时间内制造更薄和更便宜的封装结构。 本发明还提供如上所述的用于制造封装结构的方法。

公开(公告)号：US20090294959A1

公开(公告)日：2009-12-03

申请号：US12315787

申请日：2008-12-04

申请人： Cheng-Chia Chiang ,  Chin-Huang Chang ,  Chien-Ping Huang ,  Chih-Ming Huang ,  Jung-Pin Huang

发明人： Cheng-Chia Chiang ,  Chin-Huang Chang ,  Chien-Ping Huang ,  Chih-Ming Huang ,  Jung-Pin Huang

IPC分类号： H01L23/522 ,  H01L23/532 ,  H01L23/28 ,  H01L23/31

CPC分类号： H01L23/4334 ,  H01L21/486 ,  H01L23/31 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/49827 ,  H01L24/97 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/97 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/15311 ,  H01L2924/157 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2224/81

摘要： A semiconductor package device, a semiconductor package structure, and fabrication methods thereof are provided, which mainly includes disposing a plurality of semiconductor chips on a wafer formed with TSVs (Through Silicon Vias) and electrically connecting the semiconductor chips to the TSVs; encapsulating the semiconductor chips with an encapsulant; and disposing a hard component on the encapsulant. The hard component ensures flatness of the wafer during a solder bump process and provides support to the wafer during a singulation process such that the wafer can firmly lie on a singulation carrier, thereby overcoming the drawbacks of the prior art, namely difficulty in mounting of solder bumps, and difficulty in cutting of the wafer.

摘要翻译： 提供了一种半导体封装器件，半导体封装结构及其制造方法，其主要包括在形成有TSV（透硅通孔）的晶片上设置多个半导体芯片，并将半导体芯片与TSV电连接; 用密封剂封装半导体芯片; 并将硬组分设置在密封剂上。 硬组件确保了在焊料凸块工艺期间晶片的平整度，并且在单独化处理期间提供对晶片的支撑，使得晶片可以牢固地位于单个载体上，从而克服现有技术的缺点，即难以安装焊料 碰撞，切割晶片难度大。

公开(公告)号：US20090093089A1

公开(公告)日：2009-04-09

申请号：US12241847

申请日：2008-09-30

申请人： Chien-Ping Huang ,  Chih-Ming Huang

发明人： Chien-Ping Huang ,  Chih-Ming Huang

IPC分类号： H01L21/02

CPC分类号： H01L23/3677 ,  H01L21/4871 ,  H01L21/561 ,  H01L23/3107 ,  H01L23/3128 ,  H01L23/367 ,  H01L23/3733 ,  H01L23/4334 ,  H01L23/49548 ,  H01L23/49816 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/16225 ,  H01L2224/16245 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48247 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/15311 ,  H01L2924/351 ,  Y10T29/49126 ,  H01L2224/85 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A heat dissipating semiconductor package and a fabrication method thereof are provided. A semiconductor chip is mounted on a chip carrier. A heat sink is mounted on the chip, and includes an insulating core layer, a thin metallic layer formed on each of an upper surface and a lower surface of the insulating core layer and a thermal via hole formed in the insulating core layer. A molding process is performed to encapsulate the chip and the heat sink with an encapsulant to form a package unit. A singulation process is performed to peripherally cut the package unit. A part of the encapsulant above the thin metallic layer on the upper surface of the heat sink is removed, such that the thin metallic layer on the upper surface of the heat sink is exposed, and heat generated by the chip can be dissipated through the heat sink.

摘要翻译： 提供散热半导体封装及其制造方法。 半导体芯片安装在芯片载体上。 散热器安装在芯片上，并且包括绝缘芯层，形成在绝缘芯层的上表面和下表面中的每一个上的薄金属层和形成在绝缘芯层中的热通孔。 进行成型工艺以用密封剂封装芯片和散热器以形成封装单元。 执行单个处理以周边地切割包装单元。 在散热器的上表面上的薄金属层上方的一部分密封剂被去除，使得散热器上表面上的薄金属层被暴露，并且由芯片产生的热量可以通过热量散发 水槽。

公开(公告)号：US20090057799A1

公开(公告)日：2009-03-05

申请号：US12229651

申请日：2008-08-26

申请人： Chang-Yueh Chan ,  Chih-Ming Huang ,  Chien-Ping Huang ,  Chin-Huang Chang ,  Cheng-Hsu Hsiao

发明人： Chang-Yueh Chan ,  Chih-Ming Huang ,  Chien-Ping Huang ,  Chin-Huang Chang ,  Cheng-Hsu Hsiao

IPC分类号： H01L31/00 ,  H01L21/00

CPC分类号： H01L31/0203 ,  H01L31/02164 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/1815 ,  H01L2924/00014 ,  H01L2924/00

摘要： A sensor semiconductor device and a method for fabricating the same are provided. At least one sensor chip is mounted and electrically connected to a lead frame. A first and a second encapsulation molding processes are sequentially performed to form a transparent encapsulant for encapsulating the sensor chip and a part of the lead frame and to form a light-impervious encapsulant for encapsulating the transparent encapsulant. The transparent encapsulant has a light-pervious portion formed at a position corresponding to and above a sensor zone of the sensor chip. The light-pervious portion is exposed from the light-impervious encapsulant. Light may penetrate the light-pervious portion, without using an additional cover board, thereby reducing manufacturing steps and costs. The above arrangement avoids prior-art problems of poor reliability caused by a porous encapsulant and poor signal reception caused by interference of ambient light entering into a conventional chip only encapsulated by a transparent encapsulant.

摘要翻译： 提供一种传感器半导体器件及其制造方法。 至少一个传感器芯片被安装并电连接到引线框架。 依次执行第一和第二封装成型工艺以形成用于封装传感器芯片和引线框架的一部分的透明密封剂，并形成用于封装透明密封剂的不透光密封剂。 透明密封剂具有形成在对应于传感器芯片的传感器区域上方的位置处的透光部分。 透光部分从不透光的密封剂暴露出来。 光可以穿透透光部分，而不使用附加的盖板，从而减少制造步骤和成本。 上述布置避免了由多孔密封剂引起的可靠性差的现有技术问题，以及由仅通过透明密封剂封装的传统芯片的环境光的干扰引起的差信号接收。

公开(公告)号：US20080283982A1

公开(公告)日：2008-11-20

申请号：US12152802

申请日：2008-05-15

申请人： Chung-Lun Liu ,  Chin-Huang Chang ,  Chien-Ping Huang ,  Chang-Yueh Chan ,  Chih-Ming Huang

发明人： Chung-Lun Liu ,  Chin-Huang Chang ,  Chien-Ping Huang ,  Chang-Yueh Chan ,  Chih-Ming Huang

IPC分类号： H01L21/58 ,  H01L23/495

CPC分类号： H05K1/141 ,  H01L23/3121 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49861 ,  H01L24/48 ,  H01L24/81 ,  H01L24/85 ,  H01L24/97 ,  H01L25/0655 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/81801 ,  H01L2224/85 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K3/3421 ,  H05K3/3436 ,  H05K2201/1034 ,  H05K2201/10659 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： The present invention proposes a multi-chip semiconductor device having leads and a method for fabricating the same. The method includes the steps of: providing a substrate having a plurality of connection pads disposed on a surface thereof; mounting a plurality of semiconductor chips on the surface of the substrate, and electrically connecting the semiconductor chips to the surface of the substrate; forming an encapsulant on the substrate to encapsulate the semiconductor chips and expose the connection pads to form a package unit; and providing a lead frame having a plurality of leads, and electrically connecting the connection pads exposed from the package unit to the leads of the lead frame to form a multi-chip semiconductor device having leads, thereby forming a multi-chip semiconductor device having leads. By the multi-chip semiconductor device and the method for fabricating the same as proposed in the present invention, problems like poor reliability caused by stress induced by several types of materials in a semiconductor package into which a substrate and leads are integrated, moisture absorption by an encapsulated substrate, and cracks developed as a result of moisture absorption by the substrate can be avoided.

摘要翻译： 本发明提出一种具有引线的多芯片半导体器件及其制造方法。 该方法包括以下步骤：提供具有设置在其表面上的多个连接焊盘的基板; 将多个半导体芯片安装在所述基板的表面上，并且将所述半导体芯片电连接到所述基板的表面; 在衬底上形成密封剂以封装半导体芯片并暴露连接焊盘以形成封装单元; 并且提供具有多个引线的引线框架，并且将从封装单元暴露的连接焊盘电连接到引线框架的引线以形成具有引线的多芯片半导体器件，从而形成具有引线的多芯片半导体器件 。 通过本发明中提出的多芯片半导体器件及其制造方法，由半导体封装中由几种材料引起的应力引起的可靠性差的问题，其中衬底和引线被集成到其中，由于 可以避免被封装的基材和由于基材吸湿而显影的裂纹。

公开(公告)号：US20070164386A1

公开(公告)日：2007-07-19

申请号：US11648045

申请日：2006-12-28

申请人： Cheng-Yi Chang ,  Chien-Ping Huang ,  Yu-Po Wang ,  Chih-Ming Huang ,  Cheng-Hsu Hsiao

发明人： Cheng-Yi Chang ,  Chien-Ping Huang ,  Yu-Po Wang ,  Chih-Ming Huang ,  Cheng-Hsu Hsiao

IPC分类号： H01L31/0203 ,  H01L21/56

CPC分类号： H01L27/14687 ,  H01L24/97 ,  H01L27/14618 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/8592 ,  H01L2224/97 ,  H01L2924/01033 ,  H01L2924/15311 ,  H01L2924/16195 ,  H01L2224/85 ,  H01L2924/00014

摘要： A semiconductor device and the fabrication method thereof are provided. The fabrication method includes providing a substrate module plate having a plurality of substrates; attaching at least one sensor chip to each of the substrates of the substrate module plate; electrically connecting each of the sensor chips to each of the substrates through bonding wires; forming an insulating layer between each sensor chip on the substrate module plate, wherein the height of the insulating layers are not greater than the thickness of the sensor chips so as to prevent flash from the insulating layers from contaminating the sensor chips; forming an adhesive lip on the insulating layer or forming a second insulating layer followed by forming the adhesive layer, wherein the adhesive layer or the second insulating layer is higher than the highest loop-height of the bonding wires; adhering a light transmitting cover to each adhesive layer to cover the sensor chip; and cutting the substrate module plate to separate the substrates to form a plurality of semiconductor devices each integrated with at least one sensor chip. As the adhesive layers are not in contact with the bonding wires, the problems of damaging or breaking the bonding wires can be prevented in the process of adhering the light transmitting cover.

摘要翻译： 提供半导体器件及其制造方法。 该制造方法包括提供具有多个基板的基板模块板; 将至少一个传感器芯片附接到所述基板模块板的每个基板; 通过接合线将每个传感器芯片电连接到每个基板; 在衬底模块板上的每个传感器芯片之间形成绝缘层，其中绝缘层的高度不大于传感器芯片的厚度，以防止来自绝缘层的闪光污染传感器芯片; 在所述绝缘层上形成粘合剂唇缘或形成第二绝缘层，接着形成所述粘合剂层，其中所述粘合剂层或所述第二绝缘层高于所述接合线的最高环高度; 将透光盖粘附到每个粘合剂层以覆盖传感器芯片; 以及切割所述基板模块板以分离所述基板以形成多个半导体器件，每个半导体器件与至少一个传感器芯片集成。 由于粘合层不与接合线接触，所以在粘接透光罩的过程中可以防止损坏或断裂接合线的问题。

公开(公告)号：US20070145561A1

公开(公告)日：2007-06-28

申请号：US11643147

申请日：2006-12-20

申请人： Fang-Lin Tsai ,  Ho-Yi Tsai ,  Chih-Ming Huang ,  Chien-Ping Huang

发明人： Fang-Lin Tsai ,  Ho-Yi Tsai ,  Chih-Ming Huang ,  Chien-Ping Huang

IPC分类号： H01L23/02

CPC分类号： H01L23/3121 ,  H01L2924/0002 ,  H01L2924/19041 ,  H01L2924/3025 ,  H05K3/284 ,  H05K3/3442 ,  H05K3/3452 ,  H05K2201/0989 ,  H05K2201/10636 ,  Y02P70/611 ,  H01L2924/00

摘要： An electronic carrier board and a package structure thereof are provided. The electronic carrier board includes a carrier, at least one pair of bond pads formed on the carrier, and a protective layer covering the carrier. The protective layer is formed with openings for exposing the bond pads. A groove is formed between the paired bond pads and has a length larger than a width of an electronic component mounted on the paired bond pads. The groove is adjacent to one of the paired bond pads and communicates with a corresponding one of the openings where this bond pad is exposed. Accordingly, a clearance between the electronic component and the electronic carrier board can be effectively filled with an insulating resin for encapsulating the electronic component, thereby preventing voids and undesirable electrical bridging between the paired bond pads from occurrence.

摘要翻译： 提供电子载体板及其封装结构。 电子载板包括载体，形成在载体上的至少一对接合焊盘和覆盖载体的保护层。 保护层形成有用于暴露接合焊盘的开口。 在成对的接合焊盘之间形成有一个沟槽，其长度大于安装在成对接合焊盘上的电子部件的宽度。 该沟槽与一对接合焊盘相邻，并与该接合焊盘露出的相应的一个开口连通。 因此，电子部件和电子载体板之间的间隙可以有效地填充用于封装电子部件的绝缘树脂，从而防止成对焊盘之间的空隙和不期望的电桥发生。

公开(公告)号：US20070138632A1

公开(公告)日：2007-06-21

申请号：US11642439

申请日：2006-12-19

申请人： Fang-Lin Tsai ,  Ho-Yi Tsai ,  Chih-Ming Huang ,  Chien-Ping Huang ,  Cheng-Hsu Hsiao

发明人： Fang-Lin Tsai ,  Ho-Yi Tsai ,  Chih-Ming Huang ,  Chien-Ping Huang ,  Cheng-Hsu Hsiao

IPC分类号： H01L23/34

CPC分类号： H05K3/3452 ,  H05K3/284 ,  H05K3/303 ,  H05K2201/0989 ,  H05K2201/10636 ,  H05K2201/10727 ,  H05K2201/2036 ,  Y02P70/611 ,  Y02P70/613

摘要： An electronic carrier board and a package structure thereof are provided. The electronic carrier board includes a carrier, at least one pair of bond pads formed on the carrier, and a protective layer covering the carrier. An opening is formed in the protective layer to expose at least three sides of each of the paired bond pads. The protective layer includes at least one independent residual portion located in the opening and between the paired bond pads, such that an electronic component is mounted on the independent residual portion and electrically connected to the bond pads. A groove without a dead space is formed between the electronic component and the carrier, such that a molding compound for encapsulating the electronic component can flow through the groove to fill the opening and a space under the electronic component and encapsulate the at least three sides of each of the bond pads.

摘要翻译： 提供电子载体板及其封装结构。 电子载板包括载体，形成在载体上的至少一对接合焊盘和覆盖载体的保护层。 在保护层中形成开口以暴露每个配对接合焊盘的至少三个侧面。 保护层包括至少一个独立的残留部分，位于开口内和成对的接合焊盘之间，使得电子部件安装在独立的残留部分上并电连接到接合焊盘。 在电子部件和载体之间形成没有死空间的凹槽，使得用于封装电子部件的模制化合物可以流过凹槽以填充开口和电子部件下方的空间，并将至少三个侧面 每个接合垫。

公开(公告)号：US20060267125A1

公开(公告)日：2006-11-30

申请号：US11162135

申请日：2005-08-30

申请人： Chien-Ping Huang ,  Chih-Ming Huang ,  Cheng-Yi Chang

发明人： Chien-Ping Huang ,  Chih-Ming Huang ,  Cheng-Yi Chang

IPC分类号： H01L29/84

CPC分类号： H01L27/14683 ,  H01L27/14618 ,  H01L2224/24226

摘要： A sensor semiconductor device and a method for fabricating the same are proposed. A sensor chip is mounted on a substrate, and a dielectric layer and a circuit layer are formed on the substrate, wherein the circuit layer is electrically connected to the substrate and the sensor chip. The dielectric layer is formed with an opening for exposing a sensor region of the sensor chip. A light-penetrable lid covers the opening of the dielectric layer, such that light is able to penetrate the light-penetrable lid to reach the sensor region and activate the sensor chip. The sensor chip can be electrically connected to an external device via a plurality of solder balls implanted on a surface of the substrate not for mounting the sensor chip. Therefore, the sensor semiconductor device is fabricated in a cost-effective manner, and circuit cracking and a know good die (KGD) problem are prevented.

摘要翻译： 提出了一种传感器半导体器件及其制造方法。 传感器芯片安装在基板上，并且在基板上形成电介质层和电路层，其中电路层电连接到基板和传感器芯片。 电介质层形成有用于暴露传感器芯片的传感器区域的开口。 透光盖子覆盖电介质层的开口，使得光线能够穿透透光盖子到达传感器区域并激活传感器芯片。 传感器芯片可以通过植入在基板的表面上的多个焊球电连接到外部设备，而不用于安装传感器芯片。 因此，传感器半导体器件以成本有效的方式制造，并且防止了电路破裂和知道的裸芯片（KGD）问题。