HIGH PERFORMANCE MEMORY MODULE WITH REDUCED LOADING

    公开(公告)号:US20210216238A1

    公开(公告)日:2021-07-15

    申请号:US17214770

    申请日:2021-03-26

    Abstract: An apparatus is described. The apparatus includes a register clock driver (RCD) semiconductor chip having first inputs to receive first command and address (CA) signals from a first sub-channel and first outputs to drive first and second instances of the CA information that are decoded from the first CA signals. The RCD semiconductor chip has second inputs to receive second command and address (CA) signals from a second sub-channel. The RCD semiconductor chip has a multiplexer having a first input channel to receive the first CA signals and a second input channel to receive the second CA signals. The RCD semiconductor chip has second outputs to drive third and fourth instances of the first CA information or first and second instances of the second CA information that are decoded from the second CA signals depending on which of the first and second input channels of the multiplexer is selected.

    SYNCHRONOUS DYNAMIC RANDOM ACCESS MEMORY (SDRAM) DUAL IN-LINE MEMORY MODULE (DIMM) HAVING INCREASED PER DATA PIN BANDWIDTH

    公开(公告)号:US20210005234A1

    公开(公告)日:2021-01-07

    申请号:US17030107

    申请日:2020-09-23

    Abstract: An apparatus is described. The apparatus includes logic circuitry to multiplex on a data bus a first data burst, a second data burst, a third data burst and a fourth data burst having different respective base target addresses that respectively target a first memory rank, a second memory rank, a third memory rank and a fourth memory rank. A first data transfer for the first data burst occurs on a first edge of a first pulse of a data strobe signal for the data bus and a second data transfer for the second data burst occurs on a second edge of the first pulse of the data strobe signal. A third data transfer for the third data burst occurs on a first edge of a second pulse of the data strobe signal for the data bus and a fourth data transfer for the fourth data burst occurs on a second edge of the second pulse. The second pulse immediately follows the first pulse on the data strobe signal. The first memory rank, the second memory rank, the third memory rank and the fourth memory rank are on a same memory module.

    DYNAMIC RANDOM ACCESS MEMORY BUILT-IN SELF-TEST POWER FAIL MITIGATION

    公开(公告)号:US20200176072A1

    公开(公告)日:2020-06-04

    申请号:US16781502

    申请日:2020-02-04

    Inventor: Bill NALE

    Abstract: Self-test and repair of memory cells is performed in a memory integrated circuit by two separate processes initiated by a memory controller communicatively coupled to the memory integrated circuit. To ensure that the repair process is completed in the event of an unexpected power failure, a first process is initiated by the memory controller to perform a memory Built-in SelfTest (mBIST) in the memory integrated circuit and a second process is initiated by the memory controller after the mBIST has completed to perform repair of faulty memory cells detected during the MBIST process. The memory controller does not initiate the repair process if a power failure has been detected. In addition, a repair time associated with the repair process is selected such that the repair time is sufficient to complete the repair process while power is stable, if a power failure occurs after the repair process has been started.

    INTERNAL ERROR CHECKING AND CORRECTION (ECC) WITH EXTRA SYSTEM BITS

    公开(公告)号:US20180210787A1

    公开(公告)日:2018-07-26

    申请号:US15540798

    申请日:2017-05-02

    Abstract: A memory subsystem includes a data bus to couple a memory controller to one or more memory devices. The memory controller and one or more memory devices transfer data for memory access operations. The data transfer includes the transfer of data bits and associated check bits over a transfer cycle burst. The memory devices include internal error checking and correction (ECC) separate from the system ECC managed by the memory controller. With a 2N transfer cycle for 2̂N data bits for a memory device, the memory devices can provide up to 2N memory locations for N+1 internal check bits, which can leave up to (2N minus (N+1)) extra bits to be used by the system for more robust ECC.

    READ DELIVERY FOR MEMORY SUBSYSTEM WITH NARROW BANDWIDTH REPEATER CHANNEL

    公开(公告)号:US20170285941A1

    公开(公告)日:2017-10-05

    申请号:US15089455

    申请日:2016-04-01

    Abstract: A system includes a repeater architecture for reads where memory connects to a host for with one bandwidth, and repeats the channel with a lower bandwidth. A memory circuit includes a first group of read signal lines to couple point-to-point between a first group of memory devices and a host device. The memory circuit includes a second, smaller group of read signal lines to couple point-to-point between the first group of memory devices and a second group of memory devices, to extend the memory channel to the second group of memory devices. The memory circuit includes a repeater to share read bandwidth between the first and second groups of memory devices, with up to a portion of the bandwidth for reads to the second group of memory devices, and at least an amount equal to the bandwidth less the portion for reads to the first group of memory devices.

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