公开(公告)号：US08507940B2

公开(公告)日：2013-08-13

申请号：US12879584

申请日：2010-09-10

Applicant: Chen-Hua Yu ,  Hung-Pin Chang ,  Yung-Chi Lin ,  Chia-Lin Yu ,  Jui-Pin Hung ,  Chien Ling Hwang

Inventor： Chen-Hua Yu ,  Hung-Pin Chang ,  Yung-Chi Lin ,  Chia-Lin Yu ,  Jui-Pin Hung ,  Chien Ling Hwang

IPC: H01L33/00

CPC classification number: H01L21/76898 ,  H01L21/3065 ,  H01L21/486 ,  H01L21/6835 ,  H01L21/76843 ,  H01L21/76876 ,  H01L21/76877 ,  H01L21/76879 ,  H01L23/147 ,  H01L23/481 ,  H01L23/49827 ,  H01L24/29 ,  H01L24/48 ,  H01L24/49 ,  H01L24/97 ,  H01L33/005 ,  H01L33/0054 ,  H01L33/486 ,  H01L33/62 ,  H01L33/641 ,  H01L33/644 ,  H01L33/647 ,  H01L2221/68345 ,  H01L2221/68359 ,  H01L2224/16 ,  H01L2224/32225 ,  H01L2224/32506 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48233 ,  H01L2224/49113 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/04941 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2933/0066 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: The package substrates with through silicon plugs (or vias) described above provide lateral and vertical heat dissipation pathways for semiconductor chips that require thermal management. Designs of through silicon plugs (TSPs) with high duty ratios can most effectively provide heat dissipation. TSP designs with patterns of double-sided combs can provide high duty ratios, such as equal to or greater than 50%. Package substrates with high duty ratios are useful for semiconductor chips that generate large amount of heat. An example of such semiconductor chip is a light-emitting diode (LED) chip.

Abstract translation: 具有上述通孔硅封装（或通孔）的封装衬底为需要热管理的半导体芯片提供侧向和垂直散热​​路径。 具有高占空比的通过硅插头（TSP）的设计可以最有效地提供散热。 具有双面梳状图案的TSP设计可以提供等于或大于50％的高占空比。 具有高占空比的封装衬底对于产生大量热量的半导体芯片是有用的。 这种半导体芯片的例子是发光二极管（LED）芯片。

公开(公告)号：US20130122689A1

公开(公告)日：2013-05-16

申请号：US13298014

申请日：2011-11-16

Applicant: Chung Yu Wang ,  Jui-Pin Hung ,  Chih-Hao Chen ,  Chun-Hsing Su ,  Yi-Chao Mao ,  Kung-Chen Yeh ,  Yi-Lin Tsai ,  Ying-Tz Hung ,  Chin-Fu Kao ,  Shih-Yi Syu ,  Chin-Chuan Chang ,  Hsien-Wen Liu ,  Long Hua Lee

Inventor： Chung Yu Wang ,  Jui-Pin Hung ,  Chih-Hao Chen ,  Chun-Hsing Su ,  Yi-Chao Mao ,  Kung-Chen Yeh ,  Yi-Lin Tsai ,  Ying-Tz Hung ,  Chin-Fu Kao ,  Shih-Yi Syu ,  Chin-Chuan Chang ,  Hsien-Wen Liu ,  Long Hua Lee

IPC: H01L21/78

CPC classification number: H01L21/6835 ,  H01L21/6836 ,  H01L21/78 ,  H01L24/94 ,  H01L24/97 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/50 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68368 ,  H01L2221/68381 ,  H01L2224/11002 ,  H01L2224/13025 ,  H01L2224/1403 ,  H01L2224/14181 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/15311 ,  H01L2924/18161 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2224/11 ,  H01L2924/00

Abstract: A method includes performing a dicing on a composite wafer including a plurality of dies, wherein the composite wafer is bonded on a carrier when the step of dicing is performed. After the step of dicing, the composite wafer is mounted onto a tape. The carrier is then de-bonded from the composite wafer and the first tape.

Abstract translation: 一种方法包括在包括多个管芯的复合晶片上执行切割，其中当执行切割步骤时，复合晶片结合在载体上。 在切割步骤之后，将复合晶片安装在带上。 然后将载体从复合晶片和第一带去粘合。

公开(公告)号：US08179748B2

公开(公告)日：2012-05-15

申请号：US11929144

申请日：2007-10-30

Applicant: Jui-Pin Hung

Inventor： Jui-Pin Hung

IPC: G11B21/08

CPC classification number: G11B17/047 ,  G11B17/056

Abstract: A limit switch controlling method and apparatus used in an optical drive are disclosed. When the optical drive is executing a tray-in/tray-out action or a move-sled home action, a detect-tray-in-switch pin, a detect-tray-out-switch pin, or a detect-sled-limit-switch pin of a controlling chip is used to receive a signal from a limit switch. When the optical drive is not executing the tray-in/tray-out action or the move-sled-home action, the detect-tray-in-switch pin, the-detect tray-out-switch pin, or the detect-sled-limit-switch pin of the controlling chip is used as an I/O port.

Abstract translation: 公开了一种在光驱中使用的限位开关控制方法和装置。 当光盘驱动器正在执行托盘进/托盘输出动作或移动回家动作时，检测托盘开关管脚，检测托盘输出开关引脚或检测限位开关 控制芯片的开关管脚用于从限位开关接收信号。 当光盘驱动器未执行托盘进/托盘输出动作或移动回家动作时，检测托盘开关管脚，检测托盘输出开关管脚或检测托架 控制芯片的限位开关引脚用作I / O端口。

公开(公告)号：US20090142903A1

公开(公告)日：2009-06-04

申请号：US12054097

申请日：2008-03-24

Applicant: Chen-Hua Yu ,  Jui-Pin Hung ,  Weng-Jin Wu ,  Jean Wang ,  Wen-Chih Chiou

Inventor： Chen-Hua Yu ,  Jui-Pin Hung ,  Weng-Jin Wu ,  Jean Wang ,  Wen-Chih Chiou

IPC: H01L21/30 ,  B29C65/00

CPC classification number: H01L25/50 ,  H01L21/67051 ,  H01L24/28 ,  H01L24/75 ,  H01L24/83 ,  H01L24/94 ,  H01L2224/8301 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/8385 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01094 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15788 ,  H01L2924/19042 ,  Y10T156/14 ,  H01L2924/00

Abstract: The present disclosure provides a bonding apparatus. The bonding apparatus includes a cleaning module designed for cleaning chips; and a chip-to-wafer bonding chamber configured to receive the chips from the cleaning module and designed for bonding the chips to a wafer.

Abstract translation: 本公开提供了一种接合装置。 接合装置包括设计用于清洁芯片的清洁模块; 以及芯片到晶片接合室，其被配置为从所述清洁模块接收所述芯片并被设计用于将所述芯片接合到晶片。