摘要:
Disclosed herein is a light emitting device including an LED die and a photopolymerizable composition comprising a silicon-containing resin comprising silicon-bonded hydrogen and aliphatic unsaturation, and from about 0.5 to about 30 parts per million of a platinum catalyst. The photopolymerizable composition may be free of catalyst inhibitor. Also disclosed herein are methods of making the light emitting device.
摘要:
Provided is a laminated body comprising a substrate to be ground and a support, where the substrate may be ground to a very small (thin) thickness and can then be separated from the support without damaging the substrate. One embodiment is a laminated body comprising a substrate to be ground, a curable silicone adhesive layer in contact with the substrate to be ground, a photothermal conversion layer comprising a light absorbing agent and a heat decomposable resin, and a light transmitting support. After grinding the substrate surface which is opposite that in contact with the adhesive layer, the laminated body is irradiated through the light transmitting layer and the photothermal conversion layer decomposes to separate the substrate and the light transmitting support.
摘要:
A method of making a light emitting device is disclosed. The method includes providing a light emitting diode; providing an optical element; attaching the optical element to the light emitting diode with a photopolymerizable composition, the photopolymerizable composition comprising a silicon-containing resin and a metal-containing catalyst, wherein the silicon-containing resin comprises silicon-bonded hydrogen and aliphatic unsaturation; and applying actinic radiation having a wavelength of 700 nm or less to initiate hydrosilylation within the silicon-containing resin.
摘要:
A hydrophilic polymer composition is described comprising thermoplastic of thermoset polymer, and a fluorochemical additive dispersed therein. The hydrophilic composition is useful, for example, in medical and surgical drapes.
摘要:
A process for the addition of compounds containing silicon-bonded hydrogen to compounds containing aliphatic unsaturation and compositions suitable for said process. The process is activated by actinic radiation and is conducted in the presence of a platinum complex having one diolefin group that is eta-bonded to the platinum atom and two aryl groups that are sigma-bonded to the platinum atom and a free-radical photoinitiator that is capable of absorbing actinic radiation such that the hydrosilation reaction is initiated upon exposure to actinic radiation. The invention also provides compositions for use in the aforementioned process.
摘要:
A pressure-sensitive adhesive that can adhere aggressively to both polar and nonpolar substrates and has good internal strength at high temperatures is provided by heat or radiation curing a blend of an ethylenically-unsaturated .alpha.-olefin polymer, a crosslinker having at least 2 hydrosilyl groups, and a hydrosilation catalyst. A preferred hydrosilane crosslinker has the formula ##STR1## wherein R is an alkyl group having 1-6 carbon atoms, and n' is a number in the range of 2 to 35.
摘要:
A pressure-sensitive adhesive that can adhere aggressively to both polar and nonpolar substrates and has good internal strength at high temperatures is provided by heat or radiation curing a blend of an ethylenically-unsaturated .alpha.-olefin polymer, a crosslinker having at least 2 hydrosilyl groups, and a hydrosilation catalyst. A preferred hydrosilane crosslinker has the formula ##STR1## wherein R is an alkyl group having 1-6 carbon atoms, and n' is a number in the range of 2 to 35.
摘要:
A light emitting device that includes a light emitting diode and a multilayer encapsulant is disclosed. The multilayer encapsulant includes a first encapsulant in contact with the light emitting diode and a photopolymerizable composition in contact with the first encapsulant. The first encapsulant may be a silicone gel, silicone gum, silicone fluid, organosiloxane, polysiloxane, polyimide, polyphosphazene, sol-gel composition, or another photopolymerizable composition. The photopolymerizable compositions include a silicon-containing resin and a metal-containing catalyst, the silicon-containing resin comprising silicon-bonded hydrogen and aliphatic unsaturation. Actinic radiation having a wavelength of 700 nm or less can be applied to initiate hydrosilylation within the silicon-containing resins.
摘要:
A curable composition comprises (a) at least one polydiorganosiloxane, fluorinated polydiorganosiloxane, or combination thereof comprising reactive silane functionality comprising at least two hydroxysilyl moieties; (b) at least one polydiorganosiloxane, fluorinated polydiorganosiloxane, or combination thereof comprising reactive silane functionality comprising at least two hydrosilyl moieties; and (c) at least one base selected from amidines, guanidines, phosphazenes, proazaphosphatranes, and combinations thereof; wherein at least one of the components (a) and (b) has an average reactive silane functionality of at least three.
摘要:
Disclosed herein is a method of making a light emitting device having an LED die and a molded encapsulant made by polymerizing at least two polymerizable compositions. The method includes: (a) providing an LED package having an LED die disposed in a reflecting cup, the reflecting cup filled with a first polymerizable composition such that the LED die is encapsulated; (b) providing a mold having a cavity filled with a second polymerizable composition; (c) contacting the first and second polymerizable compositions; (d) polymerizing the first and second polymerizable compositions to form first and second polymerized compositions, respectively, wherein the first and second polymerized compositions are bonded together; and (e) optionally separating the mold from the second polymerized composition. Light emitting devices prepared according to the method are also described.