公开(公告)号：US20170103972A1

公开(公告)日：2017-04-13

申请号：US15288501

申请日：2016-10-07

Applicant: NICHIA CORPORATION

Inventor： Motokazu YAMADA ,  Yuichi YAMADA

IPC: H01L25/075 ,  F21V9/08 ,  F21V23/00 ,  H01L33/50 ,  H01L33/60 ,  H01L33/54 ,  H01L33/58 ,  F21V7/00 ,  H01L33/62

CPC classification number: H01L25/0753 ,  F21V7/00 ,  F21V9/08 ,  F21V23/002 ,  F21Y2115/10 ,  G02F1/133603 ,  G02F1/133605 ,  G02F2001/133614 ,  H01L33/46 ,  H01L33/505 ,  H01L33/507 ,  H01L33/54 ,  H01L33/56 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/16225 ,  H01L2924/181 ,  H01L2924/00012

Abstract: A light-emitting device includes a base including a conductive wiring; a light-emitting element mounted on the base and configured to emit light; a light reflective film provided on an upper surface of the light-emitting element; and a encapsulant covering the light-emitting element and the light reflective film. A ratio (H/W) of a height (H) of the encapsulant to a width (W) of a bottom surface of the encapsulant is less than 0.5.

公开(公告)号：US20160197250A1

公开(公告)日：2016-07-07

申请号：US15067631

申请日：2016-03-11

Applicant: NICHIA CORPORATION

Inventor： Motokazu YAMADA

IPC: H01L33/56 ,  H01L33/62 ,  H01L33/08

CPC classification number: H01L33/56 ,  F21S4/24 ,  F21V21/0808 ,  F21Y2103/10 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L33/08 ,  H01L33/44 ,  H01L33/54 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/73204 ,  H01L2224/73265 ,  H05K1/189 ,  H05K3/0061 ,  H05K2201/10106 ,  H01L2924/00014

Abstract: A light emitting device includes a flexible substrate, at least one light emitting element, a sealing resin and an adhesion layer. The flexible substrate includes a flexible base member and a plurality of wiring portions disposed on one surface of the base member. At least one light emitting element is arranged on a first surface of the flexible substrate and electrically connected to the wiring portions. The sealing resin seals the light emitting element. The adhesion layer is arranged on a second surface of the flexible substrate different from the first surface of the flexible substrate. The adhesion layer has a non-adhesive region corresponding at least to a region on the first surface where the at least one light emitting element is arranged. The non-adhesive region is covered with a non-adhesive layer.

Abstract translation: 发光器件包括柔性衬底，至少一个发光元件，密封树脂和粘合层。 柔性基板包括柔性基底构件和设置在基底构件的一个表面上的多个布线部分。 至少一个发光元件布置在柔性基板的第一表面上并电连接到布线部分。 密封树脂密封发光元件。 粘合层布置在柔性基板的与柔性基板的第一表面不同的第二表面上。 粘合层具有至少对应于第一表面上布置有至少一个发光元件的区域的非粘合区域。 非粘合剂区域被非粘合剂层覆盖。

公开(公告)号：US20150084073A1

公开(公告)日：2015-03-26

申请号：US14565045

申请日：2014-12-09

Applicant: NICHIA CORPORATION

Inventor： Motokazu YAMADA ,  Tadaaki MIYATA ,  Naoki MORI

IPC: H01L33/48 ,  H01L33/62 ,  H01L33/60 ,  H01L27/15

CPC classification number: H01L33/56 ,  F21S4/22 ,  F21Y2101/00 ,  F21Y2103/00 ,  F21Y2103/10 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L27/15 ,  H01L33/32 ,  H01L33/483 ,  H01L33/507 ,  H01L33/54 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/16225 ,  H01L2224/73204 ,  H05K1/111 ,  H05K1/189 ,  H05K2201/09363 ,  H05K2201/10106

Abstract: A light emitting device includes a light emitting element and a substrate including a flexible base, a plurality of wiring portions, a groove portion, and a reflective layer. The flexible base extends in a first direction corresponding to a longitudinal direction of the substrate. The wiring portions are arranged on the flexible base. The groove portion is formed between the wiring portions spaced apart from each other. The groove portion includes a first groove portion extending in a second direction intersecting the first direction. The reflective layer is arranged on the plurality of wiring portions. The light emitting element is disposed near the reflective layer and electrically connected to the plurality of wiring portions. The light emitting element is spaced apart from the first groove portion.

Abstract translation: 发光器件包括发光元件和包括柔性基底，多个布线部分，凹槽部分和反射层的基底。 柔性基部沿对应于基板纵向的第一方向延伸。 布线部分布置在柔性基座上。 沟槽部分形成在彼此间隔开的布线部分之间。 槽部包括沿与第一方向交叉的第二方向延伸的第一槽部。 反射层设置在多个布线部分上。 发光元件设置在反射层附近并电连接到多个布线部分。 发光元件与第一槽部间隔开。

公开(公告)号：US20150069453A1

公开(公告)日：2015-03-12

申请号：US14483349

申请日：2014-09-11

Applicant: NICHIA CORPORATION

Inventor： Motokazu YAMADA

IPC: H01L33/62 ,  H01L33/20

CPC classification number: H01L33/62 ,  H01L25/0753 ,  H01L2924/0002 ,  H05K1/189 ,  H05K2201/0397 ,  H05K2201/09272 ,  H05K2201/10106 ,  H01L2924/00

Abstract: A flexible substrate member which can prevent breakage due to bending, regardless of a shape of a metal pattern, and a light emitting device which employs the flexible substrate. The flexible substrate member includes a plurality of metal wirings disposed on an insulating substrate which are spaced apart from each other via a groove portion. The groove portion includes an intersection region where a first groove portion and a second groove portion are intersected. The metal wirings includes a first metal wiring and a second metal wiring which are demarcated via the first groove portion in the intersection region, and a third metal wiring which is demarcated via the second groove portion with respect to the first metal wiring and the second metal wiring. The third metal wiring includes a projection which projects on an extension line of the first groove portion.

Abstract translation: 可以防止由于弯曲而导致的破坏的柔性基板部件，而与金属图案的形状无关，以及采用柔性基板的发光装置。 柔性基板构件包括设置在绝缘基板上的多个金属布线，其通过凹槽部彼此间隔开。 槽部包括第一槽部和第二槽部相交的交叉部。 金属配线包括通过交叉区域中的第一槽部分划定的第一金属布线和第二金属布线，以及相对于第一金属布线和第二金属布线经由第二槽部分划定的第三金属布线 接线。 第三金属配线包括在第一槽部的延长线上突出的突起。

公开(公告)号：US20140299974A1

公开(公告)日：2014-10-09

申请号：US14316485

申请日：2014-06-26

Applicant: Nichia Corporation

Inventor： Isamu NIKI ,  Motokazu YAMADA ,  Masahiko SANO ,  Shuji SHIOJI

IPC: H01L33/16

CPC classification number: H01L33/16 ,  H01L21/02378 ,  H01L21/0254 ,  H01L21/02647 ,  H01L33/007 ,  H01L33/20 ,  H01L33/22 ,  H01L33/24 ,  H01L33/26 ,  H01L33/32 ,  H01L2933/0083 ,  Y10T428/24355 ,  Y10T428/24479

Abstract: A semiconductor light emitting device including a substrate, an electrode and a light emitting region is provided. The substrate may have protruding portions formed in a repeating pattern on substantially an entire surface of the substrate while the rest of the surface may be substantially flat. The cross sections of the protruding portions taken along planes orthogonal to the surface of the substrate may be semi-circular in shape. The cross sections of the protruding portions may in alternative be convex in shape. A buffer layer and a GaN layer may be formed on the substrate.

Abstract translation: 提供了包括基板，电极和发光区域的半导体发光器件。 基板可以具有在基板的基本上整个表面上以重复图案形成的突出部分，而表面的其余部分可以基本上是平坦的。 沿着与基板的表面正交的平面截取的突出部分的横截面可以是半圆形的。 突出部分的横截面可以是凸起的形状。 可以在衬底上形成缓冲层和GaN层。

公开(公告)号：US20140231835A1

公开(公告)日：2014-08-21

申请号：US14184842

申请日：2014-02-20

Applicant: NICHIA CORPORATION

Inventor： Motokazu YAMADA

IPC: H01L33/08

CPC classification number: F21K9/90 ,  F21V31/005 ,  F21Y2103/10 ,  F21Y2115/10 ,  G02F1/133603 ,  H05K1/144 ,  H05K1/189 ,  H05K2201/09063 ,  H05K2201/10106 ,  H05K2201/2054

Abstract: A stacked assembly of light emitting devices includes a first light emitting device, a second light emitting device and a sealing member. The first light emitting device includes a first substrate member extending in a longitudinal direction and defining a plurality of through-holes, and a plurality of first light emitting elements arranged on the first substrate member. The second light emitting device is arranged to overlap with the first light emitting device. The second light emitting device includes a second substrate member extending in the longitudinal direction, and a plurality of second light emitting elements arranged on the second substrate and exposed respectively through the through-holes. The sealing member seals the first light emitting elements and the second light emitting elements.

Abstract translation: 发光器件的堆叠组件包括第一发光器件，第二发光器件和密封元件。 第一发光器件包括沿纵向方向延伸并限定多个通孔的第一衬底构件和布置在第一衬底构件上的多个第一发光元件。 第二发光器件被布置成与第一发光器件重叠。 第二发光器件包括沿纵向方向延伸的第二衬底构件和布置在第二衬底上的多个第二发光元件，并分别暴露于通孔中。 密封件密封第一发光元件和第二发光元件。

公开(公告)号：US20140008694A1

公开(公告)日：2014-01-09

申请号：US13936399

申请日：2013-07-08

Applicant: NICHIA CORPORATION

Inventor： Motokazu YAMADA ,  Tadaaki MIYATA ,  Naoki MORI

IPC: H01L33/48

CPC classification number: H01L33/56 ,  F21S4/22 ,  F21Y2101/00 ,  F21Y2103/00 ,  F21Y2103/10 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L27/15 ,  H01L33/32 ,  H01L33/483 ,  H01L33/507 ,  H01L33/54 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/16225 ,  H01L2224/73204 ,  H05K1/111 ,  H05K1/189 ,  H05K2201/09363 ,  H05K2201/10106

Abstract: A light emitting device that includes a substrate, a light emitting element and a sealing resin member. The substrate includes a flexible base, a plurality of wiring portions and a groove portion between the plurality of wiring portions. The flexible base extends in a first direction corresponding to a longitudinal direction of the substrate and the plurality of wiring portions are arranged on the base. The light emitting element is disposed on the substrate and electrically connected to the plurality of wiring portions. The sealing resin member seals the light emitting element and a part of the substrate. The sealing resin member is spaced apart from a first groove portion of the groove portion, the first groove portion extending in a second direction intersecting the first direction.

Abstract translation: 一种发光器件，包括衬底，发光元件和密封树脂构件。 基板包括柔性基座，多个布线部分和多个布线部分之间的槽部分。 柔性基部沿着与基板的纵向方向对应的第一方向延伸，并且多个布线部分布置在基部上。 发光元件设置在基板上并电连接到多个布线部分。 密封树脂构件密封发光元件和基板的一部分。 密封树脂部件与槽部的第一槽部分隔开，第一槽部沿与第一方向交叉的第二方向延伸。

公开(公告)号：US20230096212A1

公开(公告)日：2023-03-30

申请号：US18050896

申请日：2022-10-28

Applicant: NICHIA CORPORATION

Inventor： Motokazu YAMADA ,  Yuichi YAMADA ,  Shinsaku IKUTA ,  Takeshi TAMURA

IPC: H01L33/60 ,  F21V3/06 ,  H01L33/54 ,  F21Y115/10 ,  F21Y105/16

Abstract: An LED package includes a light source, a light transmissive member, and a light reflecting layer. The light source includes a resin package, a light emitting element and a wavelength conversion material. The resin package includes first and second leads and a resin member. The resin package defines a recess having a bottom face defined by portions of the first and second leads, and a portion of the resin member, and a lateral wall defined by a portion of the resin member. The light emitting element is disposed on or above the bottom face in the recess. The wavelength conversion material is disposed in the recess. The light transmissive member is disposed on or above the light source. The light reflecting layer is disposed on or above the light transmissive member at least on an upper side along an optical axis of the light emitting element.

公开(公告)号：US20210310632A1

公开(公告)日：2021-10-07

申请号：US17353348

申请日：2021-06-21

Applicant: NICHIA CORPORATION

Inventor： Yuichi YAMADA ,  Motokazu YAMADA

IPC: F21V7/00 ,  F21K9/64 ,  H01L33/46 ,  H01L33/48 ,  H01L25/075 ,  H01L33/50 ,  H01L33/60 ,  H01L33/62 ,  H01L33/54 ,  F21V9/30 ,  F21V17/00

Abstract: A light emitting device includes: a base; a light emitting element; a light reflective film located on an upper surface of the light emitting element; and a encapsulant. A ratio of a maximum width (Wmax) of the encapsulant with respect to a maximum width of the light emitting element, in a side view, is 2 or more. An outer shape of a part of the encapsulant located within a range of elevation angles that is in a range of 10° to 50° from a center of a mounting region at an upper surface of the base on which the light emitting element is mounted is formed to have a curved surface. A ratio (r/Wmax) of a radius of curvature (r) of the curved surface with respect to the maximum width (Wmax) of the encapsulant, in a side view, is in a range of 0.25 to 0.50.

公开(公告)号：US20210167263A1

公开(公告)日：2021-06-03

申请号：US17103719

申请日：2020-11-24

Applicant: NICHIA CORPORATION

Inventor： Motokazu YAMADA ,  Yuichi YAMADA ,  Shinsaku IKUTA ,  Takeshi TAMURA

IPC: H01L33/60 ,  F21V3/06 ,  H01L33/54

Abstract: A light emitting device includes a substrate, a light source, a cover member, a light transmissive member disposed on or above the light source, a light reflecting layer disposed on or above the light transmissive member, and a light transmissive cover member. The cover member is made of a resin material containing a light reflecting substance and covers a lateral face of the light source. The light transmissive cover member covers at least a lateral face of the light transmissive member and includes an annular lens part. A thickness of a portion of the light transmissive cover member disposed above a perimeter of the light reflecting layer is larger than a thickness of a portion of the light transmissive cover member disposed above a portion of the light reflecting layer where an optical axis of the light emitting element passes through.