摘要:
An apparatus is disclosed which can shape fruits and root and tuberous vegetables. The shaping apparatus is operated in such a manner that: when root and tuberous vegetable or fruit is placed in a cutting blade case and rotated, the object is spirally tracked and the spirally tracked object is removed from the lower side of the cutting blade case, so that the spirally tracked object is picked up by an additional stick and then ornamented into various forms. The shaping apparatus allows fruits and root and tuberous vegetables to be easily treated in a variety of ways, as per the second process, thereby enhancing the product value of processed foodstuffs produced from the first process.
摘要:
A method for forming a contact plug in a semiconductor device includes providing a substrate having an insulation layer. A hard mask pattern is formed over the insulation layer. The insulation layer is etched using the hard mask pattern to form a contact hole. A plug material is formed over the hard mask pattern to fill the contact hole. The insulation layer, the hard mask pattern, and the plug material are polished at substantially the same time such that a seam generated in the contact hole while forming the plug material is not exposed.
摘要:
An error control coding (ECC) circuit includes a first decoder, a second decoder, and a controller. The first decoder receives encoded data comprising a first parity and a second parity. The first decoder decodes the encoded data to a first code by using the first parity. The second decoder is connected to the first decoder. The second decoder is configured to decode the encoded data when the first decoder is deactivated and decode the first code using the second parity when the first decoder is deactivated. The controller transmits a control signal to the first decoder and the second decoder to control the first decoder and the second decoder.
摘要:
A contact portion of wiring and a method of manufacturing the same are disclosed. A contact portion of wiring according to an embodiment includes: a substrate; a conductive layer disposed on the substrate; an interlayer insulating layer disposed on the conductive layer and having a contact hole; a metal layer disposed on the conductive layer and filling the contact hole; and a transparent electrode disposed on the interlayer insulating layer and connected to the metal layer, wherein the interlayer insulating layer includes a lower insulating layer and an upper insulating layer disposed on the lower insulating layer, the lower insulating layer is undercut at the contact hole, and the metal layer fills in the portion where the lower insulating layer is undercut.
摘要:
A method and system for managing social brokering services in an online social network has developed that is comprising: social network database storing member information, human network information by member information on basis of a social network, and Needs information; an application server converting written Needs request into Needs information and storing it as said social network database after making payment of charges for use when the written Needs request for solving problems is inputted from Social Brokering Users, acting as members, providing Needs proposal with Social Brokering Users when the written Needs proposal is conveyed from Social Brokers, members, making payment of the amount according to types of dealing, like purchase, sales, exchange, etc., and contracts upon establishing contracts between Social Brokering Users and Social Brokers, and transferring the payment amount upon completing the contract; a Needs server delivering undelivered Needs information to the first human connection according to human network information of Social Brokering Users or Social Forwarders by searching Needs information stored in said social network database; and a payment server processing charges for use and payment when payment is executed in said application server. According to the present invention, it is possible to describe the problem and set up the amount of compensation in case that it is required to resolve various visible and invisible problems each member obtains; to overcome problems of trust and reliance by utilizing connection among people as brokers for assisting settlement of problems in the process of being delivered in accordance with a human network in the online social network if the step of delivering human connection among people is set up, and the amount of compensation(costs for dealing, and brokerage) and charges for use are paid; to support prompt settlement of problems for active anticipation of people, who have an ability to solve problems, from others; to provide costs for solving problems and brokerage in accordance with market forces for people who solve problems and to make the economical compensation granted by distributing brokerage with Needs forwarders in the middle step of human connection; and to form mutual relation during resolving problems.
摘要:
An apparatus is disclosed which can shape fruits and root and tuberous vegetables. The shaping apparatus is operated in such a manner that: when root and tuberous vegetable or fruit is placed in a cutting blade case and rotated, the object is spirally tracked and the spirally tracked object is removed from the lower side of the cutting blade case, so that the spirally tracked object is picked up by an additional stick and then ornamented into various forms. The shaping apparatus allows fruits and root and tuberous vegetables to be easily treated in a variety of ways, as per the second process, thereby enhancing the product value of processed foodstuffs produced from the first process.
摘要:
A package stack may include a first package and a second package. The first package may have an IC chip with an active surface and a back surface. The active surface may be connected to a first major surface of a first circuit substrate. The second package may include a second IC chip with an active surface and a back surface. The back surface of the second IC chip may be attached to a first major surface of a second circuit substrate and the active surface of the second IC chip may be electrically connected to the first major surface of the second circuit substrate. The first package may be stacked on the second package so that the active surface of the second package may be electrically connected to a second major surface of the first circuit substrate of the first package. A method may involve providing a first package having a first IC chip and a first circuit substrate and providing a second package having a second IC chip and a second circuit substrate. The first and the second packages may be stacked so that the active surface of the second IC may face and be electrically connected to a major surface of the first circuit substrate.
摘要:
A semiconductor chip package may include one or more conductive patterns provided on a front surface of a wafer. An encapsulation layer may cover at least the front surface of the wafer. Chip plugs may be electrically connected to the conductive patterns, and may be embedded in a rear surface of the wafer. External connection terminals may be electrically connected to the chip plugs, and may be provided on the rear surface of the wafer.
摘要:
A method of forming solder balls may involve forming bumps through wire boding on land patterns of a circuit substrate. Solder cream may be applied to the bumps through screen printing. The solder cream may be melted via reflow to form solder balls in which the bumps are embedded.
摘要:
Disclosed is a hybrid excavator which reduces the impact generated at the start of the operation of the boom cylinder, or the like, of a hybrid excavator. The hybrid excavator according to the present invention comprises: a hydraulic pump motor connected to an electric motor and operated in the forward or reverse direction; a hydraulic cylinder connected to the hydraulic pump motor and operated in an expanding manner; a first and second hydraulic valve installed in a first and second passage, respectively, between the hydraulic pump motor and the hydraulic cylinder, for blocking the first and second passages when switched by an external control signal; a third hydraulic valve installed in the connecting path connected to first and second dividing passages.