公开(公告)号：US06297267B1

公开(公告)日：2001-10-02

申请号：US09529405

申请日：2000-04-26

申请人： Kouji Hattori ,  Naoaki Fujii ,  Akira Tanaka ,  Fujiko Takamura

发明人： Kouji Hattori ,  Naoaki Fujii ,  Akira Tanaka ,  Fujiko Takamura

IPC分类号： A61K3142

CPC分类号： C07D413/04 ,  C07D263/32 ,  Y02P20/55

摘要： A compound of the formula: wherein R1 is a hydrogen atom or a carboxy protective group, R2, R5, R6 and R7 are each a hydrogen atom or a hydroxy group, R3 and R4 are each a hydrogen atom, or are combined together to form an epoxy group or a single bond. R8 and R9 are each an optionally substituted aryl group, and X is a single bond or a methylene group, in addition to the above definitions. R2 and R3 may be combined together to form a single bond; provided that when R2, R5, R6 and R7 are each a hydrogen atom, then R3 and R4 are combined together to form an epoxy group; when R3 and R4 are combined together to form a single bond, then at least one of R2, R5, R6 and R7 is a hydroxy group and the others are hydrogen; and when R3 and R4 are each a hydrogen atom, then at least one of R2, R5, R6 and R7 is a hydroxy group and the others are hydrogen, and X is a methylene group, or its salt.

摘要翻译： 下式的化合物：其中R 1是氢原子或羧基保护基，R 2，R 5，R 6和R 7各自是氢原子或羟基，R 3和R 4各自是氢原子，或者组合在一起形成 环氧基或单键。 除上述定义之外，R 8和R 9各自为任选取代的芳基，X为单键或亚甲基。 R2和R3可以组合在一起形成单键; 条件是当R 2，R 5，R 6和R 7各自为氢原子时，则R 3和R 4组合在一起形成环氧基; 当R3和R4组合在一起形成单键时，R 2，R 5，R 6和R 7中的至少一个是羟基，而其余的是氢; 当R 3和R 4各自为氢原子时，R 2，R 5，R 6和R 7中的至少一个为羟基，其余为氢，X为亚甲基或其盐。

公开(公告)号：US5164400A

公开(公告)日：1992-11-17

申请号：US552127

申请日：1990-07-13

申请人： Masaaki Matsuo ,  Takashi Manabe ,  Hiroyuki Okumura ,  Hiroshi Matsuda ,  Naoaki Fujii

发明人： Masaaki Matsuo ,  Takashi Manabe ,  Hiroyuki Okumura ,  Hiroshi Matsuda ,  Naoaki Fujii

IPC分类号： C12N9/99 ,  A61K31/475 ,  A61K31/545 ,  A61P3/06 ,  A61P43/00 ,  C07D20060101 ,  C07D471/06 ,  C07D498/06 ,  C07D513/06 ,  C07F7/18

CPC分类号： C07D471/06 ,  C07D513/06 ,  C07F7/1856 ,  Y02P20/55

摘要： The invention relates to a compound of the formula: ##STR1## in which R.sup.1 and R.sup.2 are each hydrogen or lower alkyl,R.sup.3 is aryl or unsaturated, 5- or 6-membered heterocyclic group containing a sulfur atom, each of which may be substituted by one or more substituent(s) selected from the group consisting of halogen, hydroxy, lower alkyl, aryloxy, trihalo(lower)alkyl, lower alkoxy and mono- or di(lower)alkylamino,R.sup.4 is hydrogen, halogen or lower alkyl,A is methylene, methine, oxa, thia, sulfinyl or sulfonyl,Y is vinylene or ethylene.Z is a group of the formula: ##STR2## wherein R.sup.5 is carboxy or protected carboxy, andR.sup.6 is hydrogen or hydroxy-protective group, andthe line is of a single or double bond, or a pharmaceutically acceptable salt thereof, useful as a 3-hydroxy-3-methylglutaryl-coenzyme A reductase inhibitor.

公开(公告)号：US20140288077A1

公开(公告)日：2014-09-25

申请号：US14130885

申请日：2012-07-05

申请人： Naoaki Fujii ,  Marcelo Actis ,  Chandanamali Punchihewa ,  Michele Connelly ,  Sean Wu

发明人： Naoaki Fujii ,  Marcelo Actis ,  Chandanamali Punchihewa ,  Michele Connelly ,  Sean Wu

IPC分类号： C07C235/46 ,  C07F15/00 ,  C07D241/08 ,  C07D295/16 ,  C07C275/24 ,  C07C311/04

CPC分类号： C07C235/46 ,  A61K31/282 ,  A61K31/535 ,  C07C275/24 ,  C07C311/04 ,  C07D233/34 ,  C07D235/08 ,  C07D241/08 ,  C07D241/36 ,  C07D261/10 ,  C07D295/16 ,  C07D295/185 ,  C07D295/26 ,  C07D307/14 ,  C07D413/00 ,  C07F15/0093

摘要： In one aspect, the invention relates to substituted 4-phenoxyphenol analogs, derivatives thereof, and related compounds, which are useful as inhibitors of proliferating cell nuclear antigen (PCNA); synthetic methods for making the compounds; pharmaceutical compositions comprising the compounds; and methods of treating hyperproliferative disorders associated with PCNA using the compounds and compositions. This abstract is intended as a scanning tool for purposes of searching in the particular art and is not intended to be limiting of the present invention.

摘要翻译： 一方面，本发明涉及可用作增殖细胞核抗原（PCNA）抑制剂的取代的4-苯氧基苯酚类似物，其衍生物和相关化合物。 制备化合物的合成方法; 包含该化合物的药物组合物; 以及使用所述化合物和组合物治疗与PCNA相关的过度增殖性疾病的方法。 该摘要旨在作为用于在特定技术中进行搜索的扫描工具，而不意在限制本发明。

公开(公告)号：US08336205B2

公开(公告)日：2012-12-25

申请号：US13209052

申请日：2011-08-12

申请人： Hironori Tanaka ,  Kazuhiro Yoshikawa ,  Naoaki Fujii ,  Atsunari Yamashita

发明人： Hironori Tanaka ,  Kazuhiro Yoshikawa ,  Naoaki Fujii ,  Atsunari Yamashita

IPC分类号： H01K3/10

CPC分类号： H05K1/185 ,  H01L24/19 ,  H01L24/82 ,  H01L2223/54426 ,  H01L2224/04105 ,  H01L2224/32225 ,  H01L2224/82039 ,  H01L2224/82047 ,  H01L2224/83132 ,  H01L2224/92144 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2924/3511 ,  H05K1/036 ,  H05K1/188 ,  H05K3/426 ,  H05K3/427 ,  H05K3/4602 ,  H05K3/4611 ,  H05K2201/0352 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/0969 ,  H05K2201/09918 ,  H05K2201/10636 ,  Y02P70/611 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/49146 ,  Y10T29/49165

摘要： A printed wiring board is manufactured by a method in which a base substrate having a first insulation layer, a second insulation layer, and a conductive film is provided. An electronic component is placed on the first insulation layer at a position determined based on an alignment mark. After the electronic component is enclosed inside an opening of the second insulation layer, a via hole exposing a terminal of the electronic component is formed at a position determined based on the alignment mark, which is used to determine the position of the electronic component. A via conductor is formed in the via hole, and a conductive layer is formed on the conductive film and patterned to form a conductive circuit connected to the via conductor.

摘要翻译： 通过提供具有第一绝缘层，第二绝缘层和导电膜的基底基板的方法制造印刷线路板。 在基于对准标记确定的位置处将电子部件放置在第一绝缘层上。 在将电子部件封闭在第二绝缘层的开口内之后，在基于对准标记确定的位置处形成暴露电子部件的端子的通孔，该位置用于确定电子部件的位置。 通孔导体形成在通孔中，导电层形成在导电膜上并被图案化以形成连接到通孔导体的导电电路。

公开(公告)号：US20110289773A1

公开(公告)日：2011-12-01

申请号：US13209052

申请日：2011-08-12

申请人： Hironori Tanaka ,  Kazuhiro Yoshikawa ,  Naoaki Fujii ,  Atsunari Yamashita

发明人： Hironori Tanaka ,  Kazuhiro Yoshikawa ,  Naoaki Fujii ,  Atsunari Yamashita

IPC分类号： H05K3/30

CPC分类号： H05K1/185 ,  H01L24/19 ,  H01L24/82 ,  H01L2223/54426 ,  H01L2224/04105 ,  H01L2224/32225 ,  H01L2224/82039 ,  H01L2224/82047 ,  H01L2224/83132 ,  H01L2224/92144 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2924/3511 ,  H05K1/036 ,  H05K1/188 ,  H05K3/426 ,  H05K3/427 ,  H05K3/4602 ,  H05K3/4611 ,  H05K2201/0352 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/0969 ,  H05K2201/09918 ,  H05K2201/10636 ,  Y02P70/611 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/49146 ,  Y10T29/49165

摘要： A printed wiring board is manufactured by a method in which a base substrate having a first insulation layer, a second insulation layer, and a conductive film is provided. An electronic component is placed on the first insulation layer at a position determined based on an alignment mark. After the electronic component is enclosed inside an opening of the second insulation layer, a via hole exposing a terminal of the electronic component is formed at a position determined based on the alignment mark, which is used to determine the position of the electronic component. A via conductor is formed in the via hole, and a conductive layer is formed on the conductive film and patterned to form a conductive circuit connected to the via conductor.

摘要翻译： 通过提供具有第一绝缘层，第二绝缘层和导电膜的基底基板的方法制造印刷线路板。 在基于对准标记确定的位置处将电子部件放置在第一绝缘层上。 在将电子部件封闭在第二绝缘层的开口内之后，在基于对准标记确定的位置处形成暴露电子部件的端子的通孔，该位置用于确定电子部件的位置。 通孔导体形成在通孔中，导电层形成在导电膜上并被图案化以形成连接到通孔导体的导电电路。

公开(公告)号：US08024858B2

公开(公告)日：2011-09-27

申请号：US12351954

申请日：2009-01-12

申请人： Hironori Tanaka ,  Kazuhiro Yoshikawa ,  Naoaki Fujii ,  Atsunari Yamashita

发明人： Hironori Tanaka ,  Kazuhiro Yoshikawa ,  Naoaki Fujii ,  Atsunari Yamashita

IPC分类号： H01K3/10

CPC分类号： H05K1/185 ,  H01L24/19 ,  H01L24/82 ,  H01L2223/54426 ,  H01L2224/04105 ,  H01L2224/32225 ,  H01L2224/82039 ,  H01L2224/82047 ,  H01L2224/83132 ,  H01L2224/92144 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2924/3511 ,  H05K1/036 ,  H05K1/188 ,  H05K3/426 ,  H05K3/427 ,  H05K3/4602 ,  H05K3/4611 ,  H05K2201/0352 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/0969 ,  H05K2201/09918 ,  H05K2201/10636 ,  Y02P70/611 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/49146 ,  Y10T29/49165

摘要： A printed wiring board is manufactured by a method in which a base substrate having a first insulation layer, a second insulation layer, and a conductive film is provided. An electronic component is placed on the first insulation layer at a position determined based on an alignment mark. After the electronic component is enclosed inside an opening of the second insulation layer, a via hole exposing a terminal of the electronic component is formed at a position determined based on the alignment mark, which is used to determine the position of the electronic component. A via conductor is formed in the via hole, and a conductive layer is formed on the conductive film and patterned to form a conductive circuit connected to the via conductor.

摘要翻译： 通过提供具有第一绝缘层，第二绝缘层和导电膜的基底基板的方法制造印刷线路板。 在基于对准标记确定的位置处将电子部件放置在第一绝缘层上。 在将电子部件封闭在第二绝缘层的开口内之后，在基于对准标记确定的位置处形成暴露电子部件的端子的通孔，该位置用于确定电子部件的位置。 通孔导体形成在通孔中，导电层形成在导电膜上并被图案化以形成连接到通孔导体的导电电路。

公开(公告)号：US20100155129A1

公开(公告)日：2010-06-24

申请号：US12713274

申请日：2010-02-26

申请人： Yoichiro KAWAMURA ,  Shigeki Sawa ,  Katsuhiko Tanno ,  Hironori Tanaka ,  Naoaki Fujii

发明人： Yoichiro KAWAMURA ,  Shigeki Sawa ,  Katsuhiko Tanno ,  Hironori Tanaka ,  Naoaki Fujii

IPC分类号： H05K1/11 ,  H05K3/00

CPC分类号： H05K3/3478 ,  H01L21/4853 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49822 ,  H01L24/16 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11334 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2224/81192 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01047 ,  H01L2924/01061 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01088 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H05K3/3452 ,  H05K2201/0191 ,  H05K2201/099 ,  H05K2203/041 ,  H05K2203/0557 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49165 ,  H01L2924/00 ,  H01L2224/05599

摘要： A printed wiring board comprises a wiring substrate provided with at least one conductor circuit, a solder resist layer formed on the surface of the wiring substrate, covering the at least one conductor circuit, conductor pads formed on a part of the at least one conductor circuit exposed from respective openings provided in the solder resist layer for mounting electronic parts, and solder bumps formed on the respective conductor pads. Connection reliability and insulation reliability are easily improved by making the ratio (H/D) of a height H from solder resist layer surface the solder bump to an opening diameter of the opening about 0.55 to about 1.0 even in narrow pitch structure under the pitch of the opening provided in the solder resist layer of about 200 μm or less.

摘要翻译： 一种印刷电路板，包括设置有至少一个导体电路的布线基板，形成在所述布线基板的表面上的阻焊层，覆盖所述至少一个导体电路，形成在所述至少一个导体电路的一部分上的导体焊盘 从设置在用于安装电子部件的阻焊层中的各个开口露出，以及形成在各个导体焊盘上的焊料凸块。 通过使窄阻抗层的高度H与焊锡凸块的比例（H / D）在开口直径大约0.55至1.0左右，在窄间距结构下，在距离 设置在阻焊层上的开口约为200μm以下。

公开(公告)号：US07714233B2

公开(公告)日：2010-05-11

申请号：US11476557

申请日：2006-06-29

申请人： Yoichiro Kawamura ,  Shigeki Sawa ,  Katsuhiko Tanno ,  Hironori Tanaka ,  Naoaki Fujii

发明人： Yoichiro Kawamura ,  Shigeki Sawa ,  Katsuhiko Tanno ,  Hironori Tanaka ,  Naoaki Fujii

IPC分类号： H05K1/16

CPC分类号： H05K3/3478 ,  H01L21/4853 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49822 ,  H01L24/16 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11334 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2224/81192 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01047 ,  H01L2924/01061 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01088 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H05K3/3452 ,  H05K2201/0191 ,  H05K2201/099 ,  H05K2203/041 ,  H05K2203/0557 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49165 ,  H01L2924/00 ,  H01L2224/05599

摘要： A printed wiring board including a wiring substrate provided with at least one conductor circuit, a solder resist layer formed on the surface of the wiring substrate, covering the at least one conductor circuit, conductor pads formed on a part of the at least one conductor circuit exposed from respective openings provided in the solder resist layer for mounting electronic parts, and solder bumps formed on the respective conductor pads. The ratio (H/D) of a height H of the solder bumps from solder resist layer surface to an opening diameter of the openings are made to be about 0.55 to about 1.0 with the pitch of the openings provided in the solder resist layer of about 200 μm or less.

摘要翻译： 一种印刷电路板，包括设置有至少一个导体电路的布线基板，形成在所述布线基板的表面上的阻焊层，覆盖所述至少一个导体电路，形成在所述至少一个导体电路的一部分上的导体焊盘 从设置在用于安装电子部件的阻焊层中的各个开口露出，以及形成在各个导体焊盘上的焊料凸块。 由阻焊层表面的焊锡凸块的高度H与开口的开口直径之比H（H / D）为约0.55〜约1.0，在阻焊层上设置的开口的间距约为 200μm以下。

公开(公告)号：US07578625B2

公开(公告)日：2009-08-25

申请号：US11529318

申请日：2006-09-29

申请人： Hironori Tanaka ,  Naoaki Fujii

发明人： Hironori Tanaka ,  Naoaki Fujii

IPC分类号： G02B6/36 ,  G02B6/38

CPC分类号： G02B6/3636 ,  G02B6/3652 ,  G02B6/3668 ,  G02B6/3692 ,  G02B6/3861 ,  G02B6/3885

摘要： An optical fiber array 10 includes: a substrate 30 with housing grooves 34 for housing optical fibers 24 formed therein; a cover plate 12 for covering the optical fibers 24 that are housed in the housing grooves 34; and an adhesive layer 16 for joining the substrate 30 with the optical fibers 24 being housed in the housing grooves 34 and the coverplate 12. In the substrate 30, there are formed adhesive grooves 36 for introduction of the adhesive layer 16 between the housing grooves 34 for housing the optical fibers 24 and the end portions of the substrate 30.

摘要翻译： 光纤阵列10包括：具有容纳槽34的基板30，用于容纳形成在其中的光纤24; 用于覆盖容纳在容纳槽34中的光纤24的盖板12; 以及用于将基板30与容纳在壳体槽34和盖板12中的光纤24接合的粘合剂层16.在基板30中，形成有用于将粘合剂层16引入壳体槽34之间的粘合剂槽36 用于容纳光纤24和基板30的端部。

公开(公告)号：US20070019920A1

公开(公告)日：2007-01-25

申请号：US11529318

申请日：2006-09-29

申请人： Hironori Tanaka ,  Naoaki Fujii

发明人： Hironori Tanaka ,  Naoaki Fujii

IPC分类号： G02B6/00

CPC分类号： G02B6/3636 ,  G02B6/3652 ,  G02B6/3668 ,  G02B6/3692 ,  G02B6/3861 ,  G02B6/3885

摘要： An optical fiber array 10 includes: a substrate 30 with housing grooves 34 for housing optical fibers 24 formed therein; a cover plate 12 for covering the optical fibers 24 that are housed in the housing grooves 34; and an adhesive layer 16 for joining the substrate 30 with the optical fibers 24 being housed in the housing grooves 34 and the coverplate 12. In the substrate 30, there are formed adhesive grooves 36 for introduction of the adhesive layer 16 between the housing grooves 34 for housing the optical fibers 24 and the end portions of the substrate 30.

摘要翻译： 光纤阵列10包括：具有容纳槽34的基板30，用于容纳形成在其中的光纤24; 用于覆盖容纳在容纳槽34中的光纤24的盖板12; 以及用于将基板30与容纳在壳体槽34和盖板12中的光纤24接合的粘合剂层16。 在基板30中，形成有用于在用于容纳光纤24的壳体槽34和基板30的端部之间引入粘合剂层16的粘合槽36。