公开(公告)号：US20190043847A1

公开(公告)日：2019-02-07

申请号：US15973927

申请日：2018-05-08

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Yun Tae LEE ,  Han KIM ,  Hyung Joon KIM

IPC: H01L25/18 ,  H01L23/538 ,  H01L23/427 ,  H01L23/552 ,  H01L23/498

Abstract: A connection system of semiconductor packages includes: a printed circuit board; a first semiconductor package disposed on a first surface of the printed circuit board and connected to the printed circuit board through first electrical connection structures; a second semiconductor package disposed on a second surface of the printed circuit board and connected to the printed circuit board through second electrical connection structures; and a third semiconductor package disposed on the first semiconductor package and connected to the first semiconductor package through third electrical connection structures. The first semiconductor package includes an application processor (AP), the second semiconductor package includes a memory, and the third semiconductor package includes a power management integrated circuit (PMIC).

公开(公告)号：US20190013300A1

公开(公告)日：2019-01-10

申请号：US15882440

申请日：2018-01-29

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Yong Ho BAEK ,  Joo Hwan JUNG ,  Young Sik HUR ,  Jung Chul GONG ,  Han KIM

IPC: H01L25/16 ,  H01L23/498 ,  H01L23/31 ,  H01L23/552 ,  H01L49/02

Abstract: A fan-out semiconductor package module includes: a core member having a first through hole and a second through hole; a semiconductor chip disposed in the first through hole, and having an active surface and an inactive surface opposite the active surface, the active surface having a connection pad disposed thereon; at least one first passive component disposed in the second through hole; a first encapsulant encapsulating the core member encapsulating at least a portion of each of the core member and the at least one first passive component; a second encapsulant encapsulating at least a portion of the inactive surface of the semiconductor chip; and a connection member disposed on the core member, the active surface of the semiconductor chip, and the at least one first passive component, and including a redistribution layer electrically connected to the connection pad and the at least one first passive component.

公开(公告)号：US20180331054A1

公开(公告)日：2018-11-15

申请号：US16042644

申请日：2018-07-23

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Han KIM ,  Kyung Moon JUNG ,  Seok Hwan KIM ,  Kyung Ho LEE ,  Kang Heon HUR

IPC: H01L23/00

Abstract: A fan-out semiconductor package includes a semiconductor chip having an active surface on which a connection pad is disposed and an inactive surface opposing the active surface, an encapsulant sealing at least a portion of the inactive surface, a first connection member disposed on the active surface and including a redistribution layer and a first via electrically connecting the connection pad to the redistribution layer, a passivation layer disposed on the first connection member, and an under-bump metal layer including an external connection pad disposed on the passivation layer and a second via connecting the external connection pad to the redistribution layer. In a vertical direction, the first and second vias are disposed within the external connection pad and do not overlap each other.

公开(公告)号：US20180233454A1

公开(公告)日：2018-08-16

申请号：US15955230

申请日：2018-04-17

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Hyung Joon KIM ,  Jung Ho SHIM ,  Dae Hyun PARK ,  Han KIM

IPC: H01L23/538 ,  H01L25/065 ,  H01L23/00

Abstract: The present disclosure relates to a fan-out semiconductor package in which a plurality of semiconductor chips are stacked and packaged, and are disposed in a special form to be thus electrically connected to a redistribution layer of a connection member through vias rather than wires. The fan-out semiconductor package can further include a connection member having a through-hole, and at least one of the semiconductor chips can be disposed in the through-hole.

公开(公告)号：US20180190591A1

公开(公告)日：2018-07-05

申请号：US15689861

申请日：2017-08-29

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Han KIM ,  Eun Jung JO ,  Jung Ho SHIM

IPC: H01L23/538 ,  H01L23/31 ,  H01L23/00 ,  H01L21/48

CPC classification number: H01L23/5389 ,  H01L21/4853 ,  H01L21/4857 ,  H01L23/3114 ,  H01L23/5383 ,  H01L23/5386 ,  H01L23/562 ,  H01L24/19 ,  H01L24/20 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/19 ,  H01L2224/214 ,  H01L2224/24226 ,  H01L2224/97 ,  H01L2224/83 ,  H01L2224/82

Abstract: A fan-out semiconductor package includes: a first semiconductor chip; a first encapsulant; a connection member including first vias and a first redistribution layer; a second semiconductor chip; a second encapsulant; a second redistribution layer; second vias; and third vias. A length of the longest side of a first cut surface of the second via is less than that of the longest side of a second cut surface of the third via, the first cut surface of the second via and the second cut surface of the third via being cut by a plane on any level parallel to the second active surface.

公开(公告)号：US20180174974A1

公开(公告)日：2018-06-21

申请号：US15666266

申请日：2017-08-01

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Hyung Joon KIM ,  Jung Ho SHIM ,  Dae Hyun PARK ,  Han KIM

IPC: H01L23/538 ,  H01L25/065 ,  H01L23/00

CPC classification number: H01L23/5389 ,  H01L23/5384 ,  H01L24/08 ,  H01L24/13 ,  H01L24/24 ,  H01L24/25 ,  H01L25/0652 ,  H01L25/50 ,  H01L2224/08235 ,  H01L2224/13024 ,  H01L2224/24137 ,  H01L2224/24146 ,  H01L2224/25171 ,  H01L2225/06524

Abstract: The present disclosure relates to a fan-out semiconductor package in which a plurality of semiconductor chips are stacked and packaged, and are disposed in a special form to be thus electrically connected to a redistribution layer of a connection member through vias rather than wires. The fan-out semiconductor package can further include a connection member having a through-hole, and at least one of the semiconductor chips can be disposed in the through-hole.

公开(公告)号：US20180090458A1

公开(公告)日：2018-03-29

申请号：US15402383

申请日：2017-01-10

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Han KIM ,  Kyung Moon JUNG ,  Seok Hwan KIM ,  Kyung Ho LEE ,  Kang Heon HUR

IPC: H01L23/00

CPC classification number: H01L24/04 ,  H01L24/02 ,  H01L24/05 ,  H01L24/19 ,  H01L2224/02331 ,  H01L2224/0235 ,  H01L2224/02375 ,  H01L2224/02379 ,  H01L2224/02381 ,  H01L2224/0401 ,  H01L2224/05008 ,  H01L2224/05091 ,  H01L2224/05092 ,  H01L2224/13024 ,  H01L2224/16225 ,  H01L2224/18 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/15311 ,  H01L2924/18162 ,  H01L2924/3512 ,  H01L2924/35121 ,  H01L2924/00

Abstract: A fan-out semiconductor package includes a semiconductor chip having an active surface on which a connection pad is disposed and an inactive surface opposing the active surface, an encapsulant sealing at least a portion of the inactive surface, a first connection member disposed on the active surface and including a redistribution layer and a first via electrically connecting the connection pad to the redistribution layer, a passivation layer disposed on the first connection member, and an under-bump metal layer including an external connection pad disposed on the passivation layer and a second via connecting the external connection pad to the redistribution layer. In a vertical direction, the first and second vias are disposed within the external connection pad and do not overlap each other.

公开(公告)号：US20180047683A1

公开(公告)日：2018-02-15

申请号：US15679860

申请日：2017-08-17

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Yun Tae LEE ,  Sung Han KIM ,  Han KIM

IPC: H01L23/00 ,  H01L23/31 ,  H01L23/498

CPC classification number: H01L24/02 ,  H01L23/3107 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/562 ,  H01L24/09 ,  H01L24/19 ,  H01L24/20 ,  H01L2224/02331 ,  H01L2224/02371 ,  H01L2224/02373 ,  H01L2224/02379 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/1035 ,  H01L2924/01029 ,  H01L2924/181 ,  H01L2924/18162 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19105 ,  H01L2924/3025 ,  H01L2924/351 ,  H01L2924/3511

Abstract: A fan-out semiconductor package includes: a first connection member having a through-hole; a semiconductor chip disposed in the through-hole and having an active surface having connection pads disposed thereon and an inactive surface disposed to oppose the active surface; a dummy chip disposed in the through-hole and spaced apart from the semiconductor chip; a second connection member disposed on the first connection member, the dummy chip, and the active surface of the semiconductor chip; and an encapsulant encapsulating at least portions of the first connection member, the dummy chip, and the inactive surface of the semiconductor chip. The first connection member and the second connection member include, respectively, redistribution layers electrically connected to the connection pads.

公开(公告)号：US20170040265A1

公开(公告)日：2017-02-09

申请号：US15297831

申请日：2016-10-19

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Dae Hyun PARK ,  Han KIM ,  Kang Heon HUR ,  Young Gwan KO ,  Jung Ho SHIM

IPC: H01L23/538 ,  H01L23/29 ,  H01L21/683 ,  H01L21/48 ,  H01L21/56 ,  H01L25/00 ,  H01L23/31 ,  H01L25/10

CPC classification number: H01L23/5389 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/486 ,  H01L21/568 ,  H01L21/6836 ,  H01L23/3128 ,  H01L23/48 ,  H01L23/5383 ,  H01L23/5384 ,  H01L23/5386 ,  H01L24/00 ,  H01L24/19 ,  H01L24/20 ,  H01L24/48 ,  H01L25/105 ,  H01L25/50 ,  H01L2221/68372 ,  H01L2221/68386 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/05569 ,  H01L2224/05572 ,  H01L2224/12105 ,  H01L2224/16238 ,  H01L2224/24137 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2225/1035 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18162 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/19106 ,  H01L2924/3511 ,  H05K1/0271 ,  H05K1/185 ,  H05K2201/10674 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: The present disclosure relates to a fan-out semiconductor package and a method of manufacturing the same. The fan-out semiconductor package includes: a first connection member having a through-hole; a semiconductor chip disposed in the through-hole; an encapsulant encapsulating at least portions of the first connection member and the semiconductor chip; and a second connection member disposed on the first connection member and the semiconductor chip. The first connection member includes a first insulating layer, a first redistribution layer and a second redistribution layer disposed on one surface and the other surface of the first insulating layer opposing the one surface thereof, respectively, a second insulating layer disposed on the first insulating layer and covering the first redistribution layer, and a third redistribution layer disposed on the second insulating layer. A fan-out semiconductor package may include one or more connection units instead of the first connection member.

Abstract translation: 本公开涉及扇出半导体封装及其制造方法。 扇出半导体封装包括：具有通孔的第一连接构件; 设置在所述通孔中的半导体芯片; 密封剂，其封装所述第一连接构件和所述半导体芯片的至少一部分; 以及设置在所述第一连接构件和所述半导体芯片上的第二连接构件。 第一连接构件包括第一绝缘层，第一再分布层和设置在第一绝缘层的与其一个表面相对的一个表面和另一个表面上的第二再分布层，设置在第一绝缘层上的第二绝缘层 并且覆盖第一再分布层，以及设置在第二绝缘层上的第三再分配层。 扇出半导体封装可以包括一个或多个连接单元而不是第一连接构件。

公开(公告)号：US20170005519A1

公开(公告)日：2017-01-05

申请号：US15196426

申请日：2016-06-29

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Sang Jong LEE ,  Han KIM ,  Tae Ho YUN ,  Kang Heon HUR ,  Su Bong JANG

IPC: H02J50/10 ,  H02J50/80 ,  H02J50/90

CPC classification number: H02J50/10 ,  H01F27/006 ,  H01F38/14 ,  H01F2038/143 ,  H02J7/025 ,  H02J50/80 ,  H02J50/90 ,  H04B5/0037

Abstract: A wireless power receiving device includes a first coil partially disposed in an outer region and configured to transmit and/or receive data; and a second coil disposed inwardly of an inner boundary line of the outer region and configured to receive wirelessly transmitted power, wherein a center defined by an inner boundary line and a center defined by an outer boundary line of the second coil are different from each other.

Abstract translation: 无线电力接收装置包括部分地设置在外部区域中并被配置为发送和/或接收数据的第一线圈; 以及第二线圈，其设置在所述外部区域的内边界线的内侧，并被配置为接收无线发射的功率，其中由所述第二线圈的外边界线限定的内边界线和中心限定的中心彼此不同 。