公开(公告)号：US20070281090A1

公开(公告)日：2007-12-06

申请号：US11733906

申请日：2007-04-11

申请人： Shinichi Kurita ,  Takako Takehara ,  Suhail Anwar

发明人： Shinichi Kurita ,  Takako Takehara ,  Suhail Anwar

IPC分类号： C23C16/24 ,  C23C16/54

CPC分类号： H01L31/206 ,  H01L21/67155 ,  H01L21/67161 ,  H01L21/67167 ,  H01L21/67184 ,  H01L21/67207 ,  H01L21/67236 ,  Y02E10/50 ,  Y02P70/521

摘要： A method and apparatus for forming solar panels from n-doped silicon, p-doped silicon, intrinsic amorphous silicon, and intrinsic microcrystalline silicon using a cluster tool is disclosed. The cluster tool comprises at least one load lock chamber and at least one transfer chamber. When multiple clusters are used, at least one buffer chamber may be present between the clusters. A plurality of processing chambers are attached to the transfer chamber. As few as five and as many as thirteen processing chambers can be present.

摘要翻译： 公开了一种使用簇工具从n掺杂硅，p掺杂硅，本征非晶硅和本征微晶硅形成太阳能电池板的方法和装置。 集群工具包括至少一个装载锁定室和至少一个传送室。 当使用多个簇时，可以在簇之间存在至少一个缓冲室。 多个处理室附接到传送室。 只有五个和多达十三个处理室可以存在。

公开(公告)号：US06824343B2

公开(公告)日：2004-11-30

申请号：US10084762

申请日：2002-02-22

申请人： Shinichi Kurita ,  Wendell T. Blonigan ,  Suhail Anwar ,  Toshio Kiyotake ,  Hung T. Nguyen

发明人： Shinichi Kurita ,  Wendell T. Blonigan ,  Suhail Anwar ,  Toshio Kiyotake ,  Hung T. Nguyen

IPC分类号： B65G4724

CPC分类号： H01L21/68 ,  H01L21/68728 ,  H01L21/68778 ,  H01L21/68792 ,  Y10S414/136 ,  Y10S414/139 ,  Y10S414/141

摘要： A method and apparatus for supporting a substrate is generally provided. In one aspect, an apparatus for supporting a substrate includes a support plate having a first body disposed proximate thereto. A first pushing member is radially coupled to the first body and adapted to urge the substrate in a first direction parallel to the support plate when the first body rotates. In another aspect, a load lock chamber having a substrate support that supports a substrate placed thereon includes a cooling plate that is moved to actuate at least one alignment mechanism. The alignment mechanism includes a pushing member that urges the substrate in a first direction towards a center of the support. The pushing member may additionally rotate about an axis perpendicular to the first direction.

摘要翻译： 通常提供用于支撑衬底的方法和装置。 在一个方面，一种用于支撑衬底的装置包括具有靠近其设置的第一主体的支撑板。 第一推动构件径向耦合到第一主体并且适于在第一主体旋转时沿平行于支撑板的第一方向推动基板。 在另一方面，具有支撑其上放置的基板的基板支撑件的装载锁定室包括移动以致动至少一个对准机构的冷却板。 对准机构包括推动构件，其沿朝向支撑件的中心的第一方向推动基板。 推动构件可以另外围绕垂直于第一方向的轴旋转。

公开(公告)号：US08124907B2

公开(公告)日：2012-02-28

申请号：US11782267

申请日：2007-07-24

申请人： Jae-Chull Lee ,  Suhail Anwar ,  Shinichi Kurita

发明人： Jae-Chull Lee ,  Suhail Anwar ,  Shinichi Kurita

IPC分类号： B23K10/00

CPC分类号： H01L21/67126 ,  H01L21/67201

摘要： Embodiments of the invention include a load lock chamber having a decoupled slit valve door seal compartment. In one embodiment, a load lock chamber includes a main assembly, a first slit valve door seal compartment and a seal assembly. The main assembly has a substrate transfer cavity formed therein. Two substrate access ports are formed through the main assembly and fluidly couple to the cavity. The first slit valve door seal compartment has an aperture disposed adjacent to and aligned with one of the access ports. The first slit valve door seal compartment is decoupled from the main assembly. The seal assembly couples the first slit valve door seal compartment to the main assembly.

摘要翻译： 本发明的实施例包括具有解耦的狭缝阀门密封隔室的装载锁定室。 在一个实施例中，负载锁定室包括主组件，第一狭缝阀门密封室和密封组件。 主组件具有形成在其中的衬底传送腔。 两个基板通道端口通过主组件形成并且流体耦合到空腔。 第一狭缝阀门密封隔室具有邻近并与其中一个进入口相对设置的孔。 第一个狭缝阀门密封隔间与主组件分离。 密封组件将第一狭缝阀门密封隔间连接到主组件。

公开(公告)号：US08061949B2

公开(公告)日：2011-11-22

申请号：US12709713

申请日：2010-02-22

申请人： Shinichi Kurita ,  Suhail Anwar ,  Jae-Chull Lee

发明人： Shinichi Kurita ,  Suhail Anwar ,  Jae-Chull Lee

IPC分类号： B65G49/07

CPC分类号： H01L21/67201 ,  C23C14/566 ,  H01L21/67109 ,  H01L21/67126 ,  H01L21/67167 ,  H01L21/67178 ,  H01L21/6719 ,  H01L21/67742 ,  H01L21/67751 ,  Y10S414/139

摘要： Embodiments of the invention include a load lock chamber, a processing system having a load lock chamber and a method for transferring substrates between atmospheric and vacuum environments. In one embodiment, the method includes maintaining a processed substrate within a transfer cavity formed in a chamber body for two venting cycles. In another embodiment, the method includes transferring a substrate from a transfer cavity to a heating cavity formed in the chamber body, and heating the substrate in the heating cavity. In another embodiment, a load lock chamber includes a chamber body having substrate support disposed in a transfer cavity. The substrate support is movable between a first elevation and a second elevation. A plurality of grooves are formed in at least one of a ceiling or floor of the transfer cavity and configured to receive at least a portion of the substrate support when located in the second elevation.

摘要翻译： 本发明的实施例包括负载锁定室，具有负载锁定室的处理系统和用于在大气和真空环境之间传送衬底的方法。 在一个实施例中，该方法包括将经处理的基板保持在形成在室主体中的传送空腔内用于两个排气循环。 在另一个实施例中，该方法包括将基底从传递腔转移到形成在腔体中的加热腔，以及加热加热腔中的基底。 在另一个实施例中，负载锁定室包括具有设置在传送腔中的衬底支撑件的室主体。 衬底支撑件可在第一高度和第二高度之间移动。 多个槽形成在传送腔的天花板或地板中的至少一个中，并且被配置为当位于第二高度时容纳衬底支撑件的至少一部分。

公开(公告)号：US07822324B2

公开(公告)日：2010-10-26

申请号：US11782290

申请日：2007-07-24

申请人： Suhail Anwar ,  Jae-Chull Lee ,  Shinichi Kurita

发明人： Suhail Anwar ,  Jae-Chull Lee ,  Shinichi Kurita

IPC分类号： F26B3/30

CPC分类号： H01L21/67115 ,  C23C16/54 ,  H01L21/67201

摘要： Embodiments of the invention include a heated load lock chamber. In one embodiment, a heated load lock chamber includes a chamber body having a plurality of lamp assembles disposed at least partially therein. Each lamp assembly includes a transmissive tube housing a lamp. The transmissive tube extends into the chamber body and provides a pressure barrier isolating the lamp from the interior volume of the load lock chamber. In another embodiment, an open end of the transmissive tube extends through a sidewall of the chamber body. A closed end of the transmissive tube is surrounded by the interior volume of the chamber body and is supported below a top of the chamber body in a spaced apart relation. The open end of the tube is sealed to the sidewall of the chamber body such that the interior of the tube is open to atmosphere.

摘要翻译： 本发明的实施例包括加热的负载锁定室。 在一个实施例中，加热的负载锁定室包括具有至少部分地设置在其中的多个灯组件的室主体。 每个灯组件包括容纳灯的透射管。 透射管延伸到室主体中并提供将灯隔离到负载锁定室的内部空间的压力屏障。 在另一个实施例中，透射管的开口端延伸穿过腔体的侧壁。 透射管的封闭端被室主体的内部空间包围，并以间隔的关系支撑在腔室主体的顶部下方。 管的开口端被密封到腔体的侧壁，使得管的内部对大气敞开。

公开(公告)号：US20050220604A1

公开(公告)日：2005-10-06

申请号：US11044245

申请日：2005-01-27

申请人： Shinichi Kurita ,  Suhail Anwar ,  Toshio Kiyotake

发明人： Shinichi Kurita ,  Suhail Anwar ,  Toshio Kiyotake

IPC分类号： H01L21/68 ,  B65G49/06 ,  C03C17/00 ,  C23C16/458 ,  F16C29/00 ,  F16C29/04 ,  H01L21/00 ,  H01L21/205 ,  H01L21/683 ,  G01V8/00

CPC分类号： F16C29/046 ,  B65G49/061 ,  B65G2249/02 ,  C03C17/002 ,  C23C16/4584 ,  F16C29/045 ,  H01L21/00

摘要： An apparatus for supporting a substrate within a processing chamber is provided. In one aspect, a substrate support member is provided comprising a housing having a bore formed therethrough, a support pin at least partially disposed within the bore, and a plurality of bearing elements disposed about the housing. In one aspect, the bearing elements comprise a roller having a central bore formed therethrough, a contoured outer surface, and a shaft at least partially disposed through the central bore. In another aspect, the bearing elements comprise a ball assembly comprising a larger spherical member and four smaller spherical members arranged about the larger spherical member.

摘要翻译： 提供了一种用于在处理室内支撑衬底的装置。 在一个方面，提供了一种基板支撑构件，其包括具有穿过其中形成的孔的壳体，至少部分地设置在孔内的支撑销和围绕壳体设置的多个轴承元件。 在一个方面，轴承元件包括具有穿过其形成的中心孔的辊，外形轮廓和至少部分地设置穿过中心孔的轴。 在另一方面，轴承元件包括球组件，该球组件包括较大球形构件和围绕较大球形构件布置的四个较小球形构件。

公开(公告)号：US08216422B2

公开(公告)日：2012-07-10

申请号：US11044245

申请日：2005-01-27

申请人： Shinichi Kurita ,  Suhail Anwar ,  Toshio Kiyotake

发明人： Shinichi Kurita ,  Suhail Anwar ,  Toshio Kiyotake

IPC分类号： C23C16/00 ,  C23C16/458 ,  H01L21/3065 ,  G01V8/00

CPC分类号： F16C29/046 ,  B65G49/061 ,  B65G2249/02 ,  C03C17/002 ,  C23C16/4584 ,  F16C29/045 ,  H01L21/00

摘要： An apparatus for supporting a substrate within a processing chamber is provided. In one aspect, a substrate support member is provided comprising a housing having a bore formed therethrough, a support pin at least partially disposed within the bore, and a plurality of bearing elements disposed about the housing. In one aspect, the bearing elements comprise a roller having a central bore formed therethrough, a contoured outer surface, and a shaft at least partially disposed through the central bore. In another aspect, the bearing elements comprise a ball assembly comprising a larger spherical member and four smaller spherical members arranged about the larger spherical member.

摘要翻译： 提供了一种用于在处理室内支撑衬底的装置。 在一个方面，提供了一种基板支撑构件，其包括具有穿过其中形成的孔的壳体，至少部分地设置在孔内的支撑销和围绕壳体设置的多个轴承元件。 在一个方面，轴承元件包括具有穿过其形成的中心孔的辊，外形轮廓和至少部分地设置穿过中心孔的轴。 在另一方面，轴承元件包括球组件，该球组件包括较大球形构件和围绕较大球形构件布置的四个较小球形构件。

公开(公告)号：US20080087214A1

公开(公告)日：2008-04-17

申请号：US11782267

申请日：2007-07-24

申请人： Jae-Chull Lee ,  Suhail Anwar ,  Shinichi Kurita

发明人： Jae-Chull Lee ,  Suhail Anwar ,  Shinichi Kurita

IPC分类号： C23C14/00

CPC分类号： H01L21/67126 ,  H01L21/67201

摘要： Embodiments of the invention include a load lock chamber having a decoupled slit valve door seal compartment. In one embodiment, a load lock chamber includes a main assembly, a first slit valve door seal compartment and a seal assembly. The main assembly has a substrate transfer cavity formed therein. Two substrate access ports are formed through the main assembly and fluidly couple to the cavity. The first slit valve door seal compartment has an aperture disposed adjacent to and aligned with one of the access ports. The first slit valve door seal compartment is decoupled from the main assembly. The seal assembly couples the first slit valve door seal compartment to the main assembly.

摘要翻译： 本发明的实施例包括具有解耦的狭缝阀门密封隔室的装载锁定室。 在一个实施例中，负载锁定室包括主组件，第一狭缝阀门密封室和密封组件。 主组件具有形成在其中的衬底传送腔。 通过主组件形成两个基板通道端口，并且流体耦合到空腔。 第一狭缝阀门密封隔室具有邻近并与其中一个进入口相对设置的孔。 第一个狭缝阀门密封隔间与主组件分离。 密封组件将第一狭缝阀门密封隔间连接到主组件。

公开(公告)号：US20060236934A1

公开(公告)日：2006-10-26

申请号：US11473661

申请日：2006-06-22

申请人： Soo Choi ,  John White ,  Qunhua Wang ,  Li Hou ,  Ki Kim ,  Shinichi Kurita ,  Tae Won ,  Suhail Anwar ,  Beom Park ,  Robin Tiner

发明人： Soo Choi ,  John White ,  Qunhua Wang ,  Li Hou ,  Ki Kim ,  Shinichi Kurita ,  Tae Won ,  Suhail Anwar ,  Beom Park ,  Robin Tiner

IPC分类号： C23F1/00 ,  C23C16/00

CPC分类号： H01J37/3244 ,  C23C16/345 ,  C23C16/455 ,  C23C16/45565 ,  C23C16/5096 ,  H01J37/32082 ,  H01J37/32091 ,  H01J37/32541 ,  H01J37/32596 ,  H01J2237/327 ,  H01J2237/3321 ,  H01J2237/3323 ,  H01J2237/3325 ,  Y10T29/49885 ,  Y10T29/49996

摘要： Embodiments of a gas diffuser plate for distributing gas in a processing chamber are provided. The gas distribution plate includes a diffuser plate having an upstream side and a downstream side, and a plurality of gas passages passing between the upstream and downstream sides of the diffuser plate. The gas passages include hollow cathode cavities at the downstream side to enhance plasma ionization. The depths, the diameters, the surface area and density of hollow cathode cavities of the gas passages that extend to the downstream end can be gradually increased from the center to the edge of the diffuser plate to improve the film thickness and property uniformity across the substrate. The increasing diameters, depths and surface areas from the center to the edge of the diffuser plate can be created by bending the diffuser plate toward downstream side, followed by machining out the convex downstream side. Bending the diffuser plate can be accomplished by a thermal process or a vacuum process. The increasing diameters, depths and surface areas from the center to the edge of the diffuser plate can also be created computer numerically controlled machining. Diffuser plates with gradually increasing diameters, depths and surface areas of the hollow cathode cavities from the center to the edge of the diffuser plate have been shown to produce improved uniformities of film thickness and film properties.

公开(公告)号：US20050180737A1

公开(公告)日：2005-08-18

申请号：US10779130

申请日：2004-02-12

申请人： Shinichi Kurita ,  Suhail Anwar ,  Toshio Kiyotake

发明人： Shinichi Kurita ,  Suhail Anwar ,  Toshio Kiyotake

IPC分类号： H01L21/68 ,  B65G49/06 ,  C03C17/00 ,  C23C16/458 ,  F16C29/00 ,  F16C29/04 ,  H01L21/00 ,  H01L21/205 ,  H01L21/683 ,  F26B3/30

CPC分类号： F16C29/046 ,  B65G49/061 ,  B65G2249/02 ,  C03C17/002 ,  C23C16/4584 ,  F16C29/045 ,  H01L21/00

摘要： An apparatus for supporting a substrate within a processing chamber is provided. In one aspect, a substrate support member is provided comprising a housing having a bore formed therethrough, a support pin at least partially disposed within the bore, and a plurality of bearing elements disposed about the housing. In one aspect, the bearing elements comprise a roller having a central bore formed therethrough, a contoured outer surface, and a shaft at least partially disposed through the central bore. In another aspect, the bearing elements comprise a ball assembly comprising a larger spherical member and four smaller spherical members arranged about the larger spherical member.