公开(公告)号：US20090322414A1

公开(公告)日：2009-12-31

申请号：US12165484

申请日：2008-06-30

Applicant: Bradley S. Oraw ,  Telesphor Kamgaing

Inventor： Bradley S. Oraw ,  Telesphor Kamgaing

IPC: G05F3/02 ,  H02M3/07

CPC classification number: H02M3/07 ,  H01L2224/16225 ,  H01L2924/13091 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/00

Abstract: Switched capacitor networks for power delivery to packaged integrated circuits. In certain embodiments, the switched capacitor network is employed in place of at least one stage of a cascaded buck converter for power delivery. In accordance with particular embodiments of the present invention, a two-stage power delivery network comprising both switched capacitor stage and a buck regulator stage deliver power to a microprocessor or other packaged integrated circuit (IC). In further embodiments, a switched capacitor stage is implemented with a series switch module comprising low voltage MOS transistors that is then integrated onto a package of at least one IC to be powered. In certain embodiments, a switched capacitor stage is implemented with capacitors formed on a motherboard, embedded into an IC package or integrated into a series switch module.

Abstract translation: 开关电容网络用于封装集成电路的电力输送。 在某些实施例中，采用开关电容器网络代替用于功率输送的级联降压转换器的至少一级。 根据本发明的特定实施例，包括开关电容器级和降压调节器级的两级电力输送网络向微处理器或其它封装集成电路（IC）递送电力。 在另外的实施例中，利用包括低压MOS晶体管的串联开关模块来实现开关电容器级，然后将其集成到待供电的至少一个IC的封装上。 在某些实施例中，开关电容器级由主板上形成的电容器实现，嵌入到IC封装中或集成到串联开关模块中。

公开(公告)号：US20090051477A1

公开(公告)日：2009-02-26

申请号：US11842298

申请日：2007-08-21

Applicant: Telesphor Kamgaing

Inventor： Telesphor Kamgaing

IPC: H01F5/00

CPC classification number: H01F17/0006 ,  H01F41/04 ,  H01F2027/2819 ,  H01F2038/143 ,  Y10T29/4902 ,  Y10T29/49069 ,  Y10T29/49073 ,  Y10T29/49075

Abstract: A planar transformer or balun device, having small trace spacing and high mutual coupling coefficient, and a method of fabricating the same is disclosed. The method may comprise providing a first and a second inductor on a primary and a second substrate respectively, interleaving at least partially the first inductor with the second inductor, coupling the primary and the secondary substrates to form a unitary structure, and providing electrical contacts to couple the first and second inductors with another device or circuit.

Abstract translation: 公开了具有小迹线间距和高互耦系数的平面变压器或平衡 - 不平衡变压器及其制造方法。 该方法可以包括分别在主基片和第二衬底上提供第一和第二电感器，至少部分地将第一电感器与第二电感器交错，耦合初级和次级衬底以形成整体结构，并提供电触点 将第一和第二电感器与另一个器件或电路耦合。

公开(公告)号：US20090039986A1

公开(公告)日：2009-02-12

申请号：US11835960

申请日：2007-08-08

Applicant: Telesphor Kamgaing ,  Emile Davies-Venn

Inventor： Telesphor Kamgaing ,  Emile Davies-Venn

IPC: H01P1/04

CPC classification number: H01P1/212 ,  H01L2224/05553 ,  H01L2224/0603 ,  H01L2224/48095 ,  H01L2224/48225 ,  H01L2224/48237 ,  H01L2224/49113 ,  H01L2924/181 ,  H01L2924/00012

Abstract: A microelectronic package having a radio frequency (RF) amplifier circuit and, incorporating harmonic rejection filters and matching circuits integrally formed in the package is disclosed. A harmonic rejection filter may comprise a metal-insulator-metal (MIM) capacitor serially coupled between bond pads disposed on a RF amplifier circuit die, a first wire bond coupling a first bond pad to a package output, where the first bond pad is coupled to the output of the RF amplifier, and a second wire bond coupling a second bond pad to a package ground. The harmonic rejection filter may be appropriately configured to filter one or more harmonics at different frequencies.

Abstract translation: 公开了一种具有射频（RF）放大器电路并且并入谐波抑制滤波器和整体形成在封装中的匹配电路的微电子封装。 谐波抑制滤波器可以包括串联连接在RF放大器电路管芯上的接合焊盘之间的金属 - 绝缘体 - 金属（MIM）电容器，将第一接合焊盘耦合到封装输出端的第一引线键合，其中第一接合焊盘耦合 到RF放大器的输出，以及将第二接合焊盘耦合到封装地的第二引线接合。 谐波抑制滤波器可以被适当地配置为滤波不同频率的一个或多个谐波。

公开(公告)号：US20070069835A1

公开(公告)日：2007-03-29

申请号：US11240305

申请日：2005-09-29

Applicant: Telesphor Kamgaing

Inventor： Telesphor Kamgaing

IPC: H03H7/01

CPC classification number: H03H5/02 ,  H01F27/40 ,  H01F2017/0046 ,  H03H2001/0085

Abstract: A technique to provide a compact integration of inductor-capacitor resonator a capacitor having a top plate and a bottom plate embedding a dielectric layer. The top and bottom plates are substantially parallel to each other. An inductor having a first end is coupled to the capacitor at the bottom plate. The inductor has N turns surrounding the bottom plate in a spiral geometry. The inductor is co-planar to one of the top and bottom plates and ends at a second end.

Abstract translation: 一种提供电感器 - 电容谐振器紧凑集成的技术，其具有嵌入介电层的顶板和底板的电容器。 顶板和底板基本上彼此平行。 具有第一端的电感器在底板处耦合到电容器。 电感器以螺旋几何形式围绕底板N圈。 电感器与顶板和底板中的一个共面，并在第二端处终止。

公开(公告)号：US09673268B2

公开(公告)日：2017-06-06

申请号：US13976439

申请日：2011-12-29

Applicant: Andreas Duevel ,  Telesphor Kamgaing ,  Valluri R. Rao ,  Uwe Zillmann

Inventor： Andreas Duevel ,  Telesphor Kamgaing ,  Valluri R. Rao ,  Uwe Zillmann

IPC: H01L23/48 ,  H01L21/768 ,  H01L23/52 ,  H01L29/92 ,  H01L49/02 ,  H01F7/06 ,  H01F5/00 ,  H01L23/522 ,  H01F17/00 ,  H01L27/06 ,  H01L27/08

CPC classification number: H01L28/10 ,  H01F17/0006 ,  H01F2017/002 ,  H01L21/76898 ,  H01L23/481 ,  H01L23/5227 ,  H01L27/0688 ,  H01L27/08 ,  H01L2224/4813 ,  H01L2924/0002 ,  H01L2924/00012

Abstract: A three-dimensional inductor is formed in an integrated circuit die using conductive through-body-vias which pass through the body of the die and contact one or more metal interconnect layers on the front side of the die and terminate on the back side of the die. In another embodiment, the through-body-vias may pass through a dielectric material disposed in a plug in the body of the die. In yet another aspect, a transformer may be formed by coupling multiple inductors formed using through-body-vias. In still another aspect, a three-dimensional inductor may include conductors formed of stacks of on chip metallization layers and conductive through-layer-vias disposed in insulation layers between metallization layers. Other embodiments are described.

公开(公告)号：US20150084139A1

公开(公告)日：2015-03-26

申请号：US14129541

申请日：2013-09-25

Applicant: Weng Hong Teh ,  Tarek A. Ibrahim ,  Sarah K. Haney ,  Daniel N. Sobieski ,  Parshuram B. Zantye ,  Chad E. Mair ,  Telesphor Kamgaing

Inventor： Weng Hong Teh ,  Tarek A. Ibrahim ,  Sarah K. Haney ,  Daniel N. Sobieski ,  Parshuram B. Zantye ,  Chad E. Mair ,  Telesphor Kamgaing

IPC: B81B3/00 ,  B81C1/00

CPC classification number: B81C1/00246 ,  B81B2201/0271 ,  B81C1/00261 ,  B81C1/00277 ,  H01L21/568 ,  H01L24/19 ,  H01L2224/04105 ,  H01L2224/73267 ,  H01L2924/01079

Abstract: Techniques and mechanisms for providing precisely fabricated structures of a semiconductor package. In an embodiment, a build-up carrier of the semiconductor package includes a layer of porous dielectric material. Seed copper and plated copper is disposed on the layer of porous dielectric material. Subsequent etching is performed to remove copper adjacent to the layer of porous dielectric material, forming a gap separating a suspended portion of a MEMS structure from the layer of porous dielectric material. In another embodiment, the semiconductor package includes a copper structure disposed between portions of an insulating layer or portions of a layer of silicon nitride material. The layer of silicon nitride material couples the insulating layer to another insulating layer. One or both of the insulating layers are each protected from desmear processing with a respective release layer structure.

Abstract translation: 用于提供半导体封装的精确制造结构的技术和机构。 在一个实施例中，半导体封装的积聚载体包括多孔介电材料层。 种子铜和电镀铜设置在多孔电介质材料层上。 进行随后的蚀刻以去除邻近多孔介电材料层的铜，形成将MEMS结构的悬置部分与多孔介电材料层分开的间隙。 在另一个实施例中，半导体封装包括设置在绝缘层的一部分之间或者氮化硅材料层的一部分的铜结构。 氮化硅材料层将绝缘层耦合到另一绝缘层。 每个绝缘层中的一个或两个保护层不受去离子处理的剥离层结构的剥离。

公开(公告)号：US08901688B2

公开(公告)日：2014-12-02

申请号：US13101891

申请日：2011-05-05

Applicant: Telesphor Kamgaing

Inventor： Telesphor Kamgaing

IPC: H01L27/14 ,  H01L31/00 ,  H01Q21/06 ,  H01Q3/26 ,  H01Q1/12 ,  H01Q21/00 ,  H01L23/00 ,  H01L23/552

CPC classification number: H01Q1/1271 ,  H01L23/552 ,  H01L24/16 ,  H01L24/17 ,  H01L2223/6677 ,  H01L2224/13025 ,  H01L2224/14181 ,  H01L2224/16146 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/17181 ,  H01L2224/32155 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06537 ,  H01L2225/06541 ,  H01L2225/06565 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/1421 ,  H01L2924/1433 ,  H01L2924/14335 ,  H01L2924/1434 ,  H01Q1/2283 ,  H01Q3/26 ,  H01Q21/0087 ,  H01Q21/0093 ,  H01Q21/065 ,  Y10T29/49016 ,  H01L2924/00

Abstract: A glass-based, high-performance 60 GHz/mm-wave antenna includes cavities disposed in a phased-array antenna (PAA) substrate. The cavities are disposed below planar antenna elements. Emitter traces are disposed on the PAA substrate opposite the planar antenna elements and the emitter traces, the cavities, and the planar antenna elements are vertically aligned.

Abstract translation: 基于玻璃的高性能60GHz / mm波天线包括设置在相控阵天线（PAA）衬底中的腔体。 空腔设置在平面天线元件下方。 发射极迹线设置在与平面天线元件相对的PAA衬底上，发射极迹线，空腔和平面天线元件垂直对齐。

公开(公告)号：US08759950B2

公开(公告)日：2014-06-24

申请号：US13101874

申请日：2011-05-05

Applicant: Telesphor Kamgaing ,  Valluri R. Rao

Inventor： Telesphor Kamgaing ,  Valluri R. Rao

IPC: H01L29/40

CPC classification number: H01L23/552 ,  H01L23/481 ,  H01L23/66 ,  H01L25/18 ,  H01L2223/6616 ,  H01L2223/6677 ,  H01L2224/16225 ,  H01L2225/06513 ,  H01L2225/06537 ,  H01L2225/06541 ,  H01L2924/15311

Abstract: An apparatus includes a radio-frequency die with shielding through-silicon vias and a die backside lattice lid that shield a sector in the RF die from radio- and electromagnetic interference.

Abstract translation: 一种装置包括具有屏蔽通硅通孔的射频管芯和屏蔽RF管芯中的扇区的模具背面格栅盖与放射和电磁干扰。

公开(公告)号：US20140159681A1

公开(公告)日：2014-06-12

申请号：US14180166

申请日：2014-02-13

Applicant: Bradley S. Oraw ,  Telesphor Kamgaing

Inventor： Bradley S. Oraw ,  Telesphor Kamgaing

IPC: H02M3/07

CPC classification number: H02M3/07 ,  H02J1/102 ,  H02J9/005 ,  H02M2001/008 ,  Y10T307/406

Abstract: Series switches for power delivery. A regulator operated as a current source is arranged in parallel with a switched capacitor divider. A switched capacitor divider is configured in series with a plurality of linear regulators with each regulating one of a plurality of voltage outputs from the switched capacitor divider. In another embodiment, a series switch bridge has a first pair of switches connected in series with a second pair of switches across a voltage input, each switch within a pair of switches is switched in-phase with the other while the first pair of switches is switched out of phase with the second pair of switches. A balancing capacitor is coupled across one switch in both the first and second pair to be in parallel when either of the pair of switches is closed to reduce a charge imbalance between the switches.

Abstract translation: 串联交换机供电。 作为电流源工作的调节器与开关电容分压器并联布置。 开关电容器分配器与多个线性调节器串联配置，每个线性调节器调节来自开关电容器分压器的多个电压输出中的一个。 在另一个实施例中，串联开关桥具有跨越电压输入与第二对开关串联连接的第一对开关，一对开关内的每个开关与另一个开关同相切换，而第一对开关为 与第二对开关切换异相。 平衡电容器耦合在第一对和第二对中的一个开关上，以在两对开关中的任一个闭合时并联，以减少开关之间的电荷不平衡。

公开(公告)号：US08330436B2

公开(公告)日：2012-12-11

申请号：US12165492

申请日：2008-06-30

Applicant: Bradley S. Oraw ,  Telesphor Kamgaing

Inventor： Bradley S. Oraw ,  Telesphor Kamgaing

IPC: G05F1/00

CPC classification number: H02M3/07 ,  H02J1/102 ,  H02J9/005 ,  H02M2001/008 ,  Y10T307/406

Abstract: Series switches for power delivery. A regulator operated as a current source is arranged in parallel with a switched capacitor divider. A switched capacitor divider is configured in series with a plurality of linear regulators with each regulating one of a plurality of voltage outputs from the switched capacitor divider. In another embodiment, a series switch bridge has a first pair of switches connected in series with a second pair of switches across a voltage input, each switch within a pair of switches is switched in-phase with the other while the first pair of switches is switched out of phase with the second pair of switches. A balancing capacitor is coupled across one switch in both the first and second pair to be in parallel when either of the pair of switches is closed to reduce a charge imbalance between the switches.

Abstract translation: 串联交换机供电。 作为电流源工作的调节器与开关电容分压器并联布置。 开关电容器分配器与多个线性调节器串联配置，每个线性调节器调节来自开关电容器分压器的多个电压输出中的一个。 在另一个实施例中，串联开关桥具有跨越电压输入与第二对开关串联连接的第一对开关，一对开关内的每个开关与另一个开关同相切换，而第一对开关为 与第二对开关切换异相。 平衡电容器耦合在第一对和第二对中的一个开关上，以在两对开关中的任一个闭合时并联，以减少开关之间的电荷不平衡。