AlGaInP-based high-output red semiconductor laser device
    41.
    发明授权
    AlGaInP-based high-output red semiconductor laser device 有权
    基于AlGaInP的高输出红色半导体激光器件

    公开(公告)号:US06778575B2

    公开(公告)日:2004-08-17

    申请号:US10100920

    申请日:2002-03-20

    IPC分类号: G01R2302

    摘要: A semiconductor laser device having a real refractive index guided structure capable of obtaining a high kink light output and a high maximum light output also when a vertical beam divergence angle is at a small level of at least 12.5° and not more than 20.0° is provided. This semiconductor laser device comprises an n-type cladding layer of AlGaInP formed on an n-type GaAs substrate, an active layer having an AlGaInP layer formed on the n-type cladding layer, a p-type cladding layer of AlGaInP formed on the active layer and a light confinement layer formed to partially cover the p-type cladding layer, and a vertical beam divergence angle is at least 12.5° and not more than 20.0°. Thus, a higher kink light output and a higher maximum light output can be obtained as compared with a conventional semiconductor laser device having a vertical beam divergence angle exceeding 20.0°.

    摘要翻译: 提供具有实际折射率引导结构的半导体激光器件,当垂直光束发散角处于至少12.5°且不大于20.0°的较小水平时,也可以获得高扭结光输出和高最大光输出 。 该半导体激光器件包括在n型GaAs衬底上形成的AlGaInP的n型包覆层,在n型覆层上形成有AlGaInP层的有源层,形成在活性层上的AlGaInP的p型包覆层 层和形成为部分地覆盖p型包层的光限制层,垂直光束发散角为至少12.5°且不大于20.0°。 因此,与具有超过20.0°的垂直光束发散角的常规半导体激光器件相比,可以获得更高的扭结光输出和更高的最大光输出。

    Semiconductor laser device and manufacturing method thereof
    43.
    发明授权
    Semiconductor laser device and manufacturing method thereof 失效
    半导体激光器件及其制造方法

    公开(公告)号:US5963572A

    公开(公告)日:1999-10-05

    申请号:US773346

    申请日:1996-12-26

    IPC分类号: H01S5/22 H01S5/223 H01S3/19

    摘要: A semiconductor laser device including an n-type cladding layer, an active layer, a p-type cladding layer having a ridge portion, an n-type optical confinement layer formed on the flat portion and side surfaces of the ridge portion of the p-type cladding layer, and an n-type current blocking layer formed on the n-type optical confinement layer in this order. The optical confinement layer is composed of a low resistivity layer doped with n-type impurity, which has a smaller refractive index than the p-type cladding layer and a bandgap energy greater than the energy of lasing light. The optical confinement layer has an impurity concentration of 5.times.10.sup.7 cm.sup.-3 or less. The n-type current blocking layer has a thickness of 0.4 .mu.m or less.

    摘要翻译: 一种半导体激光装置,包括n型包层,有源层,具有脊部的p型包覆层,形成在平坦部分上的n型光限制层和p型包层, 型包层,以及n型光限制层上形成的n型电流阻挡层。 光限制层由掺杂有n型杂质的低电阻率层构成,其折射率比p型覆层更小,并且带隙能量大于激光的能量。 光学限制层的杂质浓度为5×10 7 cm -3以下。 n型电流阻挡层的厚度为0.4μm以下。

    Semiconductor laser diode and method of fabricating the same
    44.
    发明申请
    Semiconductor laser diode and method of fabricating the same 失效
    半导体激光二极管及其制造方法

    公开(公告)号:US20070069221A1

    公开(公告)日:2007-03-29

    申请号:US11525088

    申请日:2006-09-22

    IPC分类号: H01L33/00

    摘要: A semiconductor laser diode capable of further improving temperature characteristics while sufficiently preventing a laser beam emission end surface portion from thermal destruction through a window structure is obtained. This semiconductor laser diode comprises an active layer having a window structure on a laser beam emission end surface portion and a p-type layer, formed on the surface of the active layer, containing Mg and Zn as impurities. The impurity concentration of Zn contained in the p-type layer is larger than the impurity concentration of Mg contained in the p-type layer.

    摘要翻译: 可以获得能够进一步提高温度特性的半导体激光二极管,同时充分防止激光束发射端面部分通过窗口结构的热破坏。 该半导体激光二极管包括在激光束发射端面部分具有窗口结构的有源层和形成在有源层的表面上的包含Mg和Zn作为杂质的p型层。 包含在p型层中的Zn的杂质浓度大于p型层中所含的Mg的杂质浓度。

    Semiconductor laser device and method of fabricating the same
    50.
    发明授权
    Semiconductor laser device and method of fabricating the same 有权
    半导体激光器件及其制造方法

    公开(公告)号:US06771676B2

    公开(公告)日:2004-08-03

    申请号:US10234250

    申请日:2002-09-05

    IPC分类号: H01S304

    摘要: A semiconductor laser device capable of improving reliability is obtained in a structure formed by mounting a semiconductor laser element on a submount (base) in a junction-down system. This semiconductor laser device comprises a first electrode layer formed on the surface of a semiconductor element including an emission layer to have a shape comprising recess portions and projection portions, a base mounted with the semiconductor element, and a plurality of low melting point metal layers provided between the first electrode layer formed on the surface of the semiconductor element and the base for bonding the first electrode layer formed on the surface of the semiconductor element and the base to each other. Thus, the plurality of low melting point metal layers easily embed clearances resulting from the shape comprising recess portions and projection portions of the surface of the semiconductor element dissimilarly to a case of employing a single low melting point metal layer.

    摘要翻译: 通过将半导体激光元件安装在下降系统中的底座(基座)上形成的结构,可以获得能够提高可靠性的半导体激光器件。 该半导体激光器件包括形成在包括发光层的半导体元件的表面上的第一电极层,该发光层具有包括凹部和突出部的形状,安装有半导体元件的基底和设置有多个低熔点金属层 在形成在半导体元件的表面上的第一电极层和用于将形成在半导体元件的表面上的第一电极层与基底接合的基底之间。 因此,多个低熔点金属层与使用单个低熔点金属层的情况相比,容易地嵌入由包含凹部的形状和半导体元件的表面的突出部分形成的间隙。