公开(公告)号：US09758373B2

公开(公告)日：2017-09-12

申请号：US14262437

申请日：2014-04-25

Applicant: STMicroelectronics S.r.l.

Inventor： Stefano Losa ,  Raffaella Pezzuto ,  Roberto Campedelli ,  Matteo Perletti ,  Luigi Esposito ,  Mikel Azpeitia Urquia

IPC: H01L29/84 ,  B81C1/00 ,  B81B7/00

CPC classification number: H01L21/02178 ,  B81B7/0032 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81C1/00595 ,  B81C1/00801 ,  B81C2201/014 ,  B81C2201/053 ,  H01L21/0228

Abstract: A method for manufacturing a protective layer for protecting an intermediate structural layer against etching with hydrofluoric acid, the intermediate structural layer being made of a material that can be etched or damaged by hydrofluoric acid, the method comprising the steps of: forming a first layer of aluminum oxide, by atomic layer deposition, on the intermediate structural layer; performing a thermal crystallization process on the first layer of aluminum oxide, forming a first intermediate protective layer; forming a second layer of aluminum oxide, by atomic layer deposition, above the first intermediate protective layer; and performing a thermal crystallization process on the second layer of aluminum oxide, forming a second intermediate protective layer and thereby completing the formation of the protective layer. The method for forming the protective layer can be used, for example, during the manufacturing steps of an inertial sensor such as a gyroscope or an accelerometer.

公开(公告)号：US20170225949A1

公开(公告)日：2017-08-10

申请号：US15497741

申请日：2017-04-26

Applicant: NXP USA, Inc.

Inventor： Aaron A. GEISBERGER

IPC: B81C1/00

CPC classification number: B81C1/00626 ,  B81B7/0048 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2203/0307

Abstract: An embodiment of a microelectromechanical systems (MEMS) device is provided, which includes a substrate; a proof mass positioned in space above a surface of the substrate, wherein the proof mass is configured to pivot on a rotational axis parallel to the substrate; an anchor structure that includes two or more separated anchors mounted to the surface of the substrate, wherein the anchor structure is aligned with the rotational axis; and an isolation sub-frame structure that surrounds the anchor structure and is flexibly connected to each of the two or more separated anchors of the anchor structure, where the proof mass is flexibly connected to the isolation sub-frame structure.

公开(公告)号：US09725299B1

公开(公告)日：2017-08-08

申请号：US15007762

申请日：2016-01-27

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.

Inventor： Chun-Wen Cheng ,  Jiou-Kang Lee

IPC: H01L29/82 ,  B81B3/00

CPC classification number: B81C1/00825 ,  B81B3/0008 ,  B81B3/001 ,  B81B2201/0235 ,  B81B2201/0242

Abstract: A device includes a substrate, a first structure, a second structure, a third structure and a bumper. The first structure is over the substrate. The second structure is over the substrate, wherein the second structure has a first end coupled to the first structure. The third structure is over the substrate, wherein the third structure is coupled to a second end of the second structure. The bumper is between the substrate and the third structure, wherein the bumper is a multi-layered bumper including a first conductive feature, a dielectric feature and a second conductive feature. The dielectric feature is over the first conductive feature. The second conductive feature is over the dielectric feature and electrically connected to the first conductive feature.

公开(公告)号：US09718679B2

公开(公告)日：2017-08-01

申请号：US14598138

申请日：2015-01-15

Applicant: InvenSense, Inc.

Inventor： Martin Lim

IPC: H01L23/02 ,  H01L21/54 ,  H01L21/04 ,  B81C1/00 ,  B81B7/02

CPC classification number: B81C1/00285 ,  B81B7/02 ,  B81B2201/0235 ,  B81B2201/0242

Abstract: A Microelectromechanical Systems (MEMS) structure with integrated heater is disclosed. The MEMS structure with integrated heater comprises a first substrate with cavities, bonded to a second substrate, forming a plurality of sealed enclosures of at least two types. Each of the plurality of sealed enclosures is defined by the first substrate, the second substrate, and a seal-ring material, where the first enclosure type further includes at least one of a gettering element to decrease cavity pressure in the first enclosure type or an outgassing element to increase cavity pressure in the first enclosure type when activated. The first enclosure type further comprises at least one heater integrated into the first substrate adjacent to the gettering element or the outgassing element to adjust the temperature of the gettering element or the outgassing element thereby providing heating to the gettering element or the outgassing element.

公开(公告)号：US20170199217A1

公开(公告)日：2017-07-13

申请号：US15393457

申请日：2016-12-29

Applicant: Seiko Epson Corporation

Inventor： Atsuki NARUSE ,  Shota KIGURE

IPC: G01P15/125 ,  B81B7/04 ,  B81C1/00

CPC classification number: G01P15/125 ,  B81B7/0048 ,  B81B7/04 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2201/0264 ,  B81B2203/0118 ,  B81B2207/012 ,  B81B2207/07 ,  B81C1/0023 ,  B81C2203/0109 ,  B81C2203/0172 ,  B81C2203/0792 ,  G01P1/023 ,  G01P15/0802 ,  G01P15/18 ,  G01P2015/0814 ,  G01P2015/0831 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/00014

Abstract: An electronic device includes a package; and a functional element, in which a side surface of the functional element is fixed to a side wall of the package on an inner side thereof via an adhesive.

公开(公告)号：US09701533B2

公开(公告)日：2017-07-11

申请号：US14938118

申请日：2015-11-11

Applicant: Commissariat a l'energie atomique et aux energies alternatives

Inventor： Stephane Nicolas

IPC: B81B7/00 ,  B81C1/00

CPC classification number: B81B7/0038 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2207/097 ,  B81C1/00285 ,  B81C2203/0109 ,  B81C2203/0118 ,  B81C2203/0145 ,  H01L2224/11

Abstract: A packing structure including:a cap secured to at least one first substrate and forming at least one cavity between the cap and the first substrate;a layer of at least one first material permeable to a gas, arranged in the cap and/or in the first substrate and/or at the interface between the cap and the first substrate, and forming at least one part of a wall of the cavity;a portion of at least one second material non-permeable to said gas, the thickness of which is higher than or equal to that of the layer of the first material, and surrounding at least one first part of the layer of the first material forming said part of the wall of the cavity;an aperture passing through the cap or the first substrate and opening onto or into said part of the layer of the first material.

公开(公告)号：US20170176186A1

公开(公告)日：2017-06-22

申请号：US15454220

申请日：2017-03-09

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Shigehiro Yoshiuchi ,  Satoshi Ohuchi ,  Tsuyoshi Fujii ,  Kensaku Yamamoto ,  Hideo Ohkoshi

IPC: G01C19/5769 ,  B81B7/00

CPC classification number: G01C19/5769 ,  B81B7/0048 ,  B81B2201/0242 ,  B81B2201/025 ,  B81B2203/0118 ,  B81B2203/0315 ,  B81B2207/07 ,  B81C1/0023 ,  B81C1/00238 ,  G01P15/0802 ,  H01L24/32 ,  H01L41/1132 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/06506 ,  H01L2924/01014 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/00014

Abstract: An inertial force sensor that can suppress fluctuation of detection sensitivity even if an external stress is applied to the inertial force sensor. Angular velocity sensor (1), that is, an inertial force sensor includes ceramic substrate (6), lower lid (4) adhering to ceramic substrate (6) with adhesives (11a and 11b) (first adhesives), and sensor element (2) adhering to lower lid (4) with adhesives (10a and 10b) (second adhesives). The elastic moduli of adhesives (11a and 11b) are smaller than those of adhesives (10a and 10b).

公开(公告)号：US20170158499A1

公开(公告)日：2017-06-08

申请号：US15371659

申请日：2016-12-07

Applicant: Robert Bosch GmbH

Inventor： Mawuli Ametowobla ,  Philip Kappe

IPC: B81C1/00 ,  B23K26/064 ,  B23K26/06 ,  B23K26/0622 ,  B81B7/00 ,  B23K26/20

CPC classification number: B81C1/00325 ,  B23K26/06 ,  B23K26/0622 ,  B23K26/064 ,  B23K26/206 ,  B23K2101/40 ,  B81B7/0051 ,  B81B7/02 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81C2203/0145 ,  H01L23/04 ,  H01L23/10 ,  H01L2924/1461 ,  H01L2924/16152

Abstract: A method for manufacturing a micromechanical component having a substrate and having a cap connected to the substrate and enclosing with the substrate a first cavity is provided, a first pressure existing, and a first gas mixture having a first chemical composition being enclosed, in the first cavity, in a first method step an access opening that connects the first cavity to an environment of the micromechanical component being constituted in the substrate or in the cap, in a second method step the first pressure and/or the first chemical composition being established in the first cavity, in a third method step the access opening being sealed with the aid of a laser by the introduction of energy or heat into an absorbing portion of the substrate or of the cap, the introduction of energy or heat being controlled by spatial displacement of a laser beam along a path proceeding substantially parallel to a surface, facing away from the first cavity, of the substrate or of the cap.

公开(公告)号：US20170158492A1

公开(公告)日：2017-06-08

申请号：US15355798

申请日：2016-11-18

Applicant: Robert Bosch GmbH

Inventor： Achim Breitling ,  Frank Reichenbach ,  Jochen Reinmuth ,  Julia Amthor

IPC: B81B7/00 ,  B81C1/00

CPC classification number: B81B7/0051 ,  B81B7/02 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81C1/00325 ,  B81C2201/0167 ,  B81C2203/0145

Abstract: A method is described for manufacturing a micromechanical component including a substrate and including a cap, which is connected to the substrate and, together with the substrate, encloses a first cavity, a first pressure prevailing and a first gas mixture having a first chemical composition being enclosed in the first cavity. An access opening connecting the first cavity to surroundings of the micromechanical component is formed in the substrate or cap. The first pressure and/or the first chemical composition is adjusted in the first cavity. The access opening is sealed by introducing energy or heat into an absorbing part of the substrate or cap using a laser. A layer is deposited or grown on a surface of the substrate or the cap in the area of the access opening to produce a second mechanical stress, which counteracts a first mechanical stress occurring in the case of sealed access opening.

公开(公告)号：US09656852B2

公开(公告)日：2017-05-23

申请号：US14792058

申请日：2015-07-06

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.

Inventor： Chun-Wen Cheng ,  Yi-Chuan Teng

IPC: B81B3/00 ,  B81C1/00

CPC classification number: B81B3/001 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2207/012 ,  B81C1/00238 ,  B81C1/00976

Abstract: The present disclosure provides a CMOS-MEMS device structure. The CMOS-MEMS device structure includes a sensing substrate and a CMOS substrate. The sensing substrate includes a bonding mesa structure. The CMOS substrate includes a top dielectric layer. The sensing substrate and the CMOS substrate are bonded through the bonding mesa structure, and the bonding mesa structure defines a bonding gap between the CMOS substrate and the sensing substrate.