Abstract:
A method of in-wafer testing is provided for a monolithic photonic integrated circuit (PIC) formed in a semiconductor wafer where each such in-wafer circuit comprises two or more integrated electro-optic components, one of each in tandem forming a signal channel in the circuit. The method includes the provision of a first integrated photodetector at a rear end of each signal channel and a second integrated photodetector at forward end of each signal channel. Then, the testing is accomplished, first, by sequentially operating a first of a selected channel electro-optic component in a selected circuit to monitor light output from a channel via its first corresponding channel photodetector and adjusting its operating characteristics by detecting that channel electro-optic component output via its second corresponding channel photodetector to provide first calibration data. Second, by sequentially operating a second of a selected channel electro-optic component in the selected circuit to monitor signal output from the second selected channel electro-optic component via its second corresponding channel photodetector and adjusting its operating characteristics by detecting that channel electro-optic component output via its second corresponding channel photodetector to provide second calibration data. The first and second calibration data for each circuit channel for the selected circuit are then stored for future reference.
Abstract:
A tunable laser is disclosed including a gain section for creating a light beam over a bandwidth, a phase section for controlling the light beam around a center frequency of the bandwidth, a waveguide for guiding and reflecting the light beam in a cavity including a relatively low energy bandgap separate-confinement-heterostructure (SCH), a front mirror bounding an end of the cavity and a back mirror bounding an opposite end of the cavity wherein gain is provided by at least one of the group comprising the phase section, the front mirror and the back mirror.
Abstract:
A method of in-wafer testing is provided for a monolithic photonic integrated circuit (PIC) formed in a semiconductor wafer where each such in-wafer circuit comprises two or more integrated electro-optic components, one of each in tandem forming a signal channel in the circuit. The method includes the provision of a first integrated photodetector at a rear end of each signal channel and a second integrated photodetector at forward end of each signal channel. Then, the testing is accomplished, first, by sequentially operating a first of a selected channel electro-optic component in a selected circuit to monitor light output from a channel via its first corresponding channel photodetector and adjusting its operating characteristics by detecting that channel electro-optic component output via its second corresponding channel photodetector to provide first calibration data. Second, by sequentially operating a second of a selected channel electro-optic component in the selected circuit to monitor signal output from the second selected channel electro-optic component via its second corresponding channel photodetector and adjusting its operating characteristics by detecting that channel electro-optic component output via its second corresponding channel photodetector to provide second calibration data. The first and second calibration data for each circuit channel for the selected circuit are then stored for future reference.
Abstract:
It is an object of this invention to overcome the problems of prior art by a unique arrangement based on a novel idea, and to provide an optical device having desired characteristics and an optical module and optical system incorporating the optical device. Provided is a photonic crystal including a three-dimensional periodic structure formed by using a first material which changes in properties relatively easily and a second material which does not change in properties relatively easily, wherein the first material is preferentially allowed to change in properties to make a refractive index difference between the first and second materials larger than that before the property change. Also provided is an optical device including a photonic waveguide, gain means, and reflecting means, wherein resonance is generated by reversing the propagating direction of light propagating in the photonic waveguide by the reflecting means while a gain is given to the light by the gain means.
Abstract:
A photonic integrated circuit (PIC) chip comprising an array of modulated sources, each providing a modulated signal output at a channel wavelength different from the channel wavelength of other modulated sources and a wavelength selective combiner having an input optically coupled to received all the signal outputs from the modulated sources and provide a combined output signal on an output waveguide from the chip. The modulated sources, combiner and output waveguide are all integrated on the same chip.
Abstract:
A method of making a diode laser assembly provides a substrate. An epitaxial structure is formed on the substrate. Different areas of the epitaxial structure have different optical properties. A laser, a modulator and a coupler are formed in the epitaxial structure.
Abstract:
An electro-optical transceiver system with controlled lateral light leakage and a method of making such a system includes a plurality of emitter devices and detector devices including at least one of each, arranged in a planar array for transmitting and receiving, respectively, energy in a predetermined wavelength and a blocking medium disposed interstitially of the devices and being absorbing at the predetermined wavelength for blocking energy at the predetermined wavelength laterally leaking from an emitter device to one or more detector devices.
Abstract:
In the monolithically integrated photonic circuit, light travels through multiple quantum well channel waveguides and is coupled into and out of the devices that reside in common on a single semiconductor substrate. Each device, which is co-planar with any other device on the substrate, is comprised of a quantum well channel waveguide of a pre-determined length and an electrical contact pad mounted on the waveguide that facilitates the application of electric field to the device. The function of any particular device as an optical source, an optical modulator or a photo-detector is determined by the bias mode of electric field applied to that particular device. The circuit is comprised of multiple rows of such devices. Each of these rows contains at least three devices which function as an optical source, an optical modulator and a photo-detector, respectively, and are separated from each other by electrical isolation gaps.
Abstract:
The invention concerns a semiconductor opto-electronic component comprising at least two optically active structures (20, 30), at least one of which consists of a detector (30), characterized in that the detector or detectors (30) comprise a first active portion (33) able to detect a signal at a given wavelength and a second inactive portion (34) only slightly sensitive to the signal to be detected and exposed to the non-guided stray light conveyed in the component.
Abstract:
An apparatus with an optical functional device includes a first substrate, a first optical functional device with a functional portion provided on the first substrate, a first wiring electrode for injecting a current into or applying a voltage to the functional portion of the first optical functional device, a second substrate, and a second wiring electrode. The first wiring electrode is formed on the first substrate and includes a first portion electrically connected to the functional portion, a first extension portion extending from the first portion to an outside of the functional portion and a first pad portion connected to the extension portion outside the functional portion, and the second wiring electrode is formed on the second substrate and includes a second pad portion and a second extension portion extending from the second pad portion. The first substrate and the second substrate are bonded to each other with the first pad portion and the second pad portion being electrically connected to each other.