公开(公告)号：US20070045819A1

公开(公告)日：2007-03-01

申请号：US11160997

申请日：2005-07-19

Applicant: David Edwards ,  Sushumna Iruvanti ,  Hilton Toy ,  Wei Zou

Inventor： David Edwards ,  Sushumna Iruvanti ,  Hilton Toy ,  Wei Zou

IPC: H01L23/12

CPC classification number: H01L23/04 ,  H01L23/10 ,  H01L23/3675 ,  H01L23/42 ,  H01L24/32 ,  H01L2224/16225 ,  H01L2224/26175 ,  H01L2224/27013 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2224/83051 ,  H01L2224/83385 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/16152 ,  H01L2924/16153 ,  H01L2924/1616 ,  Y10S257/924

Abstract: A semiconductor module structure and a method of forming the semiconductor module structure are disclosed. The structure incorporates a die mounted on a substrate and covered by a lid. A thermal compound is disposed within a thermal gap between the die and the lid. A barrier around the periphery of the die extends between the lid and the substrate, contains the thermal compound, and flexes in response to expansion and contraction of both the substrate and the lid during cycling of the semiconductor module. More particularly, either the barrier is formed of a flexible material or has a flexible connection to the substrate and/or to the lid. The barrier effectively contains the thermal compound between the die and the lid and, thereby, provides acceptable and controlled coverage of the thermal compound over the die for heat removal.

公开(公告)号：US20070021203A1

公开(公告)日：2007-01-25

申请号：US11393244

申请日：2006-03-30

Applicant: David Edwards

Inventor： David Edwards

IPC: A63F9/24

CPC classification number: A63F13/52 ,  A63F13/10 ,  A63F13/12 ,  A63F13/332 ,  A63F13/5375 ,  A63F13/837 ,  A63F2300/203 ,  A63F2300/206 ,  A63F2300/303 ,  A63F2300/307 ,  A63F2300/406 ,  A63F2300/552 ,  A63F2300/6009 ,  A63F2300/66 ,  A63F2300/8076

Abstract: A method of display is provided that includes providing a similar game onto a first and second mobile devices. The game displaying a first portion of a video image on a small display of the first mobile device. The game displaying a second portion of the video image on a larger display of the second mobile device. The second portion wider and higher than the width the height of the first portion. The game allowing a first player of the game on the first mobile device a range of motion of a target indicator on the first mobile device about the height and width of the first portion of the video image. The game allowing a second player of the game on the second mobile device about the same height range of motion of the target indicator as provided on the first mobile device with the smaller display.

Abstract translation: 提供了一种显示方法，其包括在第一和第二移动设备上提供类似的游戏。 游戏在第一移动设备的小显示器上显示视频图像的第一部分。 游戏在第二移动设备的较大显示器上显示视频图像的第二部分。 第二部分宽并且高于第一部分的高度的宽度。 所述游戏允许第一移动设备上的游戏的第一玩家在第一移动设备上关于视频图像的第一部分的高度和宽度的目标指示器的运动范围。 所述游戏允许第二移动设备上的游戏的第二玩家在具有较小显示的第一移动设备上提供与目标指示器相同的高度运动范围。

公开(公告)号：US20070002784A1

公开(公告)日：2007-01-04

申请号：US11170971

申请日：2005-06-30

Applicant: David Edwards

Inventor： David Edwards

IPC: H04J3/08 ,  H04B7/14

CPC classification number: G08C23/04

Abstract: Systems, methods, and media for notifying users of personal computer system events on a remote control device are disclosed. Some embodiments may comprise a remote control device associated with an electronic device having a computer system communications module to receive an indication of an occurrence of an event from a personal computer system and a processor to process the received indication of the event occurrence. Embodiments may further include a user interface having a user output device such as a display to notify a user of the event occurrence and a user input device to receive commands from a user for the electronic device. Further embodiments may also include a remote transmitter to transmit commands from the remote control device to the electronic device. Other embodiments may include a user input device to receive a response to the event occurrence from the user. Other embodiments are disclosed and claimed.

Abstract translation: 公开了用于在远程控制设备上通知用户个人计算机系统事件的系统，方法和媒体。 一些实施例可以包括与具有计算机系统通信模块的电子设备相关联的遥控设备，用于从个人计算机系统和处理器接收事件的发生的指示，以处理所接收的事件发生的指示。 实施例还可以包括具有诸如显示器的用户输出设备的用户界面，以向用户通知事件发生和用户输入设备从用户接收用于电子设备的命令。 另外的实施例还可以包括远程发射机，以将命令从远程控制设备传送到电子设备。 其他实施例可以包括用户输入设备以从用户接收对事件发生的响应。 公开和要求保护其他实施例。

公开(公告)号：US07146978B2

公开(公告)日：2006-12-12

申请号：US10771447

申请日：2004-02-05

Applicant: David Edwards ,  Mark DeLong ,  Craig Dunbar ,  Ernest E. Penachio ,  Kevin Stapleton ,  Mark Wolff

Inventor： David Edwards ,  Mark DeLong ,  Craig Dunbar ,  Ernest E. Penachio ,  Kevin Stapleton ,  Mark Wolff

IPC: A61M16/00

CPC classification number: A61M15/0028 ,  A61M11/003 ,  A61M15/0033 ,  A61M15/0035 ,  A61M15/0041 ,  A61M2202/064

Abstract: Inhalation device and associated method for facilitating inhalation by a patient of powder medicaments contained in a receptacle. The inhalation device has a chamber for receiving the receptacle. A ring is circumferentially coupled to an inner surface of the chamber to achieve a higher reproducible emitted dose of medicament from the receptacle. The inhalation device also includes an improved implement for puncturing the receptacle, requiring less force and experiencing fewer failures.

Abstract translation: 吸入装置和相关方法，用于便于患者容纳在容器中的粉末药物的吸入。 吸入装置具有容纳容器的腔室。 环周向耦合到腔室的内表面，以实现来自容器的较高可重复发射剂量的药物。 吸入装置还包括用于刺穿容器的改进的工具，需要更少的力并且经历更少的故障。

公开(公告)号：US20060261467A1

公开(公告)日：2006-11-23

申请号：US10908615

申请日：2005-05-19

Applicant: Evan Colgan ,  David Edwards ,  Benjamin Fasano ,  Kamal Sikka ,  Jeffrey Zitz ,  Wei Zou

Inventor： Evan Colgan ,  David Edwards ,  Benjamin Fasano ,  Kamal Sikka ,  Jeffrey Zitz ,  Wei Zou

IPC: H01L23/34

CPC classification number: H01L23/04 ,  H01L23/3675 ,  H01L23/433 ,  H01L24/31 ,  H01L2224/16225 ,  H01L2224/27013 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/83051 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/0401

Abstract: A chip package including a chip extension for containing thermal interface material (TIM) and improves chip cooling, and a related method, are disclosed. In particular, the chip package includes a chip, a cooling structure coupled to the chip via a TIM, and a chip extension may be thermally coupled to an outer edge of the chip. A TIM placed between the chip and the cooling structure is contained during thermal cycling by the chip extension such that void formation at the edge of the chip, which can move between the chip and cooling structure, is suppressed. The chip extension also improves lateral heat dissipation by providing a greater thermal contact area between the cooling structure and the chip and, if needed, the substrate at a much lower cost than using larger die with lower production unit output from a wafer.

Abstract translation: 公开了一种包括用于包含热界面材料（TIM）并提高芯片冷却的芯片延伸的芯片封装以及相关方法。 特别地，芯片封装包括芯片，经由TIM耦合到芯片的冷却结构，并且芯片延伸部可热耦合到芯片的外边缘。 放置在芯片和冷却结构之间的TIM被芯片延伸部的热循环期间包含，从而可以抑制可在芯片和冷却结构之间移动的芯片边缘处的空隙形成。 芯片延伸还通过在冷却结构和芯片之间提供更大的热接触面积，并且如果需要，以比使用具有较低的晶片生产单位输出的较大模具的成本低得多的成本来改善侧向散热。

公开(公告)号：US20060094296A1

公开(公告)日：2006-05-04

申请号：US10904198

申请日：2004-10-28

Applicant: David Edwards ,  Ronald Hering ,  David Long ,  Jason Miller

Inventor： David Edwards ,  Ronald Hering ,  David Long ,  Jason Miller

IPC: H01R13/73

CPC classification number: H05K7/142

Abstract: An expanding standoff connector is disclosed including a collar having a slit through a wall of the collar, a tapered interior surface and an exterior surface configured to engage an interior of a mounting opening of the circuit board. A fastener including a threaded portion and a substantially cone shaped portion configured to mate with the tapered interior surface of the collar is placed within the collar and advanced to expand the collar to mount the circuit board. A related method for mounting a circuit board is also disclosed. Since the expansion is horizontal only (purely radial), a more uniform radial expansion from top-to-bottom of the collar is applied to the circuit board and a best-fit alignment between a circuit board and heatsink can be maintained.

Abstract translation: 公开了一种扩展的支座连接器，其包括具有通过套环的壁的狭缝的套环，锥形内表面和被配置为接合电路板的安装开口的内部的外表面。 包括螺纹部分和构造成与套环的锥形内表面配合的基本锥形部分的紧固件被放置在套环内并且前进以扩展套环以安装电路板。 还公开了一种用于安装电路板的相关方法。 由于膨胀仅是水平的（纯径向），所以从电路板的顶部到底部的更均匀的径向膨胀被施加到电路板上，并且可以保持电路板和散热器之间的最佳匹配对准。

公开(公告)号：US20060060636A1

公开(公告)日：2006-03-23

申请号：US10711501

申请日：2004-09-22

Applicant: Glenn Daves ,  David Edwards ,  Mukta Farooq ,  Frank Pompeo

Inventor： Glenn Daves ,  David Edwards ,  Mukta Farooq ,  Frank Pompeo

IPC: B23K31/02

CPC classification number: B23K3/0638 ,  B23K2101/40 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/15311 ,  H05K3/301 ,  H05K3/303 ,  H05K3/305 ,  H05K2201/0209 ,  H05K2201/09909 ,  H05K2201/10234 ,  H05K2201/10734 ,  H05K2201/10977 ,  H05K2201/2018 ,  H05K2201/2036 ,  Y02P70/613 ,  Y10T29/49144 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/0401

Abstract: A method for assembling, and the resultant electronic module, includes attaching a chip to a substrate using a first solder interconnection array, and attaching a board to the substrate using a second solder interconnection array, which may be a single-melt or a dual-melt solder array. The second solder interconnection array resides entirely within a space defined between the board and substrate. A creep resistant structure is provided within this space for maintaining the defined space and optimizing integrity of the second solder interconnection array. The creep resistant structure may include an underfill material, balls, brackets, frames, collars or combinations thereof. Wherein the creep resistant structure is an underfill material, it is crucial that the substrate be attached to the board before either entirely encapsulating the second interconnection array with underfill material, or partially encapsulating the second solder interconnection array at discrete locations with underfill material.

Abstract translation: 一种用于组装的方法，并且所得到的电子模块包括使用第一焊料互连阵列将芯片附接到衬底，并且使用第二焊料互连阵列将衬底附接到衬底，第二焊料互连阵列可以是单熔体或双 - 熔融焊料阵列。 第二焊料互连阵列完全位于限定在板和衬底之间的空间内。 在该空间内设有抗蠕变结构，用于维持限定的空间并优化第二焊料互连阵列的完整性。 抗蠕变结构可以包括底部填充材料，球，支架，框架，套环或其组合。 其中抗蠕变结构是底部填充材料，在将基板完全用底部填充材料完全封装第二互连阵列之前，或者在具有底部填充材料的不连续位置部分地封装第二焊料互连阵列之前，衬底附着到板上是至关重要的。

公开(公告)号：US20060016839A1

公开(公告)日：2006-01-26

申请号：US10894687

申请日：2004-07-20

Applicant: David Edwards

Inventor： David Edwards

IPC: B62D43/00

CPC classification number: B60R11/06 ,  B60R2011/0036 ,  B62D43/10

Abstract: An apparatus is provided for securing tools with respect to a spare wheel for a vehicle. The apparatus includes a hub member that is adapted for selective securement to a central area of a spare wheel. At least one securement structure is provided on the hub member. At least one strap member is secured to the at least one securement structure. The at least one strap member is adjustable to at least partially define a variably sized opening and is configured to selectively secure at least one tool within the variably sized opening.

Abstract translation: 提供了一种用于相对于用于车辆的备用轮固定工具的装置。 该装置包括一个适于选择性地固定到备用轮的中心区域的轮毂件。 在轮毂构件上设置至少一个固定结构。 至少一个带构件被固定到所述至少一个固定结构。 所述至少一个带状构件是可调节的，以至少部分地限定可变尺寸的开口，并且构造成选择性地将至少一个工具固定在可变尺寸的开口内。

公开(公告)号：US20050097379A1

公开(公告)日：2005-05-05

申请号：US10700989

申请日：2003-11-04

Applicant: David Edwards

Inventor： David Edwards

IPC: G06F1/20 ,  G06F1/26 ,  H01L23/42

CPC classification number: G06F1/26 ,  G06F1/206 ,  H01L23/42 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/09701 ,  H01L2924/16152 ,  Y02D10/16 ,  H01L2924/00

Abstract: The present invention provides a method for controlling power change for a semiconductor module. Specifically, under the present invention power is applied to, or removed from a semiconductor module between a lower power state such as a zero power, nap or sleep state and a full power state over a predetermined time period. This allows the rate of movement and strain rate of the thermal interface material within the semiconductor module to be controlled, thus preserving the reliability of the material. Typically, the power is changed over time between the lower power state and the full power state in a linear fashion or incrementally.

Abstract translation: 本发明提供了一种用于控制半导体模块的功率变化的方法。 具体地说，在本发明的范围内，在预定时间段内，在诸如零功率，睡眠状态或睡眠状态的较低功率状态和全功率状态之间施加功率或从半导体模块中去除功率。 这允许控制半导体模块内的热界面材料的移动速度和应变速率，从而保持材料的可靠性。 通常，功率随着时间的推移在低功率状态和全功率状态之间以线性方式或递增地改变。

公开(公告)号：US20050083564A1

公开(公告)日：2005-04-21

申请号：US10975173

申请日：2004-10-28

Applicant: Prakash Mallya ,  Yi-Hung Chiao ,  David Edwards ,  Kal Li ,  Xin-Jiu Wang ,  Sriram Venkatasanthanam ,  Nagarajan Srivatsan ,  Pradeep Iyer

Inventor： Prakash Mallya ,  Yi-Hung Chiao ,  David Edwards ,  Kal Li ,  Xin-Jiu Wang ,  Sriram Venkatasanthanam ,  Nagarajan Srivatsan ,  Pradeep Iyer

IPC: G02F1/139 ,  G02B20060101 ,  G02B26/00 ,  G02F1/01 ,  G02F1/03 ,  G02F1/07 ,  G02F1/1333 ,  G02F1/1334 ,  G02F1/1345 ,  G02F1/137

CPC classification number: G02F1/13718 ,  G02F1/1334 ,  G02F1/13737 ,  G02F2201/086 ,  G02F2201/30 ,  G02F2201/50 ,  G02F2201/501 ,  G02F2202/026 ,  G02F2202/04

Abstract: The present invention is directed to an electrically switchable laminate construction for applications including smart windows, and other uses and applications in which light management is desired. The electro-optical laminate construction has scattering and transparent modes of operation for dynamically controlling electromagnetic radiation flow.

Abstract translation: 本发明涉及一种用于包括智能窗户以及期望光管理的其它用途和应用的应用的可电切换层压结构。 电光层压结构具有散射和透明的操作模式，用于动态控制电磁辐射流。