High Productivity Combinatorial material screening for stable, high-mobility non-silicon thin film transistors
    51.
    发明授权
    High Productivity Combinatorial material screening for stable, high-mobility non-silicon thin film transistors 有权
    高生产率组合材料筛选稳定的高迁移率非硅薄膜晶体管

    公开(公告)号:US09105527B2

    公开(公告)日:2015-08-11

    申请号:US14135086

    申请日:2013-12-19

    摘要: Methods for HPC techniques are applied to the processing of site-isolated regions (SIR) on a substrate to form at least a portion of a TFT device used in display applications. The processing may be applied to at least one of gate dielectric deposition, gate dielectric patterning, metal-based semiconductor deposition, metal-based patterning, etch stop deposition, etch stop patterning, source/drain deposition, or source/drain patterning. The SIRs may be defined during the deposition process with uniform deposition within each SIR or the SIRs may be defined subsequent to the deposition of layers wherein the layers are deposited with a gradient in one or more properties across the substrate.

    摘要翻译: 将HPC技术的方法应用于基板上的位置隔离区域(SIR)的处理,以形成在显示应用中使用的TFT器件的至少一部分。 该处理可以应用于栅极介电沉积,栅极电介质图案化,基于金属的半导体沉积,基于金属的图案化,蚀刻停止沉积,蚀刻停止图案化,源极/漏极沉积或源极/漏极图案化中的至少一个。 可以在沉积过程期间限定SIR,每个SIR内均匀沉积,或者可以在层的沉积之后定义SIR,其中层以跨越衬底的一个或多个特性的梯度沉积。

    High productivity combinatorial material screening for metal oxide films
    52.
    发明授权
    High productivity combinatorial material screening for metal oxide films 有权
    用于金属氧化物膜的高生产率组合材料筛选

    公开(公告)号:US09105526B2

    公开(公告)日:2015-08-11

    申请号:US14134571

    申请日:2013-12-19

    摘要: Methods for HPC techniques are applied to the processing of site-isolated regions (SIR) on a substrate to form at least a portion of a TFT device used in display applications. The processing may be applied to at least one of gate dielectric deposition, gate dielectric patterning, metal-based semiconductor (e.g. ZnOx, ZnSnOx, ZnInOx, or ZnGaOx) deposition, metal-based semiconductor (e.g. ZnOx, ZnSnOx, ZnInOx, or ZnGaOx) patterning, etch stop deposition, etch stop patterning, source/drain deposition, or source/drain patterning. The SIRs may be defined during the deposition process with uniform deposition within each SIR or the SIRs may be defined subsequent to the deposition of layers wherein the layers are deposited with a gradient in one or more properties across the substrate.

    摘要翻译: 将HPC技术的方法应用于基板上的位置隔离区域(SIR)的处理,以形成在显示应用中使用的TFT器件的至少一部分。 该处理可以应用于栅极介电沉积,栅极电介质图案化,金属基半导体(例如ZnO x,ZnSnO x,ZnInO x或ZnGaO x)沉积,金属基半导体(例如ZnO x,ZnSnO x,ZnInO x或ZnGaO x)中的至少一种, 图案化,蚀刻停止沉积,蚀刻停止图案化,源极/漏极沉积或源极/漏极图案化。 可以在沉积过程期间限定SIR,每个SIR内均匀沉积,或者可以在层的沉积之后定义SIR,其中层以跨越衬底的一个或多个特性的梯度沉积。

    ZrO-based high K dielectric stack for logic decoupling capacitor or embedded DRAM
    53.
    发明授权
    ZrO-based high K dielectric stack for logic decoupling capacitor or embedded DRAM 有权
    用于逻辑去耦电容器或嵌入式DRAM的基于ZrO的高K电介质堆叠

    公开(公告)号:US09099430B2

    公开(公告)日:2015-08-04

    申请号:US14135491

    申请日:2013-12-19

    CPC分类号: H01L28/40 H01L27/10805

    摘要: A zirconium oxide based dielectric material is used in the formation of decoupling capacitors employed in microelectronic logic circuits. In some embodiments, the zirconium oxide based dielectric is doped. In some embodiments, the dopant includes at least one of aluminum, silicon, or yttrium. In some embodiments, the zirconium oxide based dielectric is formed as a nanolaminate of zirconium oxide and a dopant metal oxide.

    摘要翻译: 在形成用于微电子逻辑电路中的去耦电容器中使用基于氧化锆的电介质材料。 在一些实施方案中,掺杂氧化锆基电介质。 在一些实施方案中,掺杂剂包括铝,硅或钇中的至少一种。 在一些实施方案中,基于氧化锆的电介质形成为氧化锆和掺杂剂金属氧化物的纳米氨酸盐。

    Transition Metal Oxide Bilayers
    54.
    发明申请
    Transition Metal Oxide Bilayers 有权
    过渡金属氧化物双层

    公开(公告)号:US20150200361A1

    公开(公告)日:2015-07-16

    申请号:US14618055

    申请日:2015-02-10

    IPC分类号: H01L45/00

    摘要: Embodiments of the invention include nonvolatile memory elements and memory devices comprising the nonvolatile memory elements. Methods for forming the nonvolatile memory elements are also disclosed. The nonvolatile memory element comprises a first electrode layer, a second electrode layer, and a plurality of layers of an oxide disposed between the first and second electrode layers. One of the oxide layers has linear resistance and substoichiometric composition, and the other oxide layer has bistable resistance and near-stoichiometric composition. Preferably, the sum of the two oxide layer thicknesses is between about 20 Å and about 100 Å, and the oxide layer with bistable resistance has a thickness between about 25% and about 75% of the total thickness. In one embodiment, the oxide layers are formed using reactive sputtering in an atmosphere with controlled flows of argon and oxygen.

    摘要翻译: 本发明的实施例包括非易失性存储器元件和包括非易失性存储元件的存储器件。 还公开了形成非易失性存储元件的方法。 非易失性存储元件包括第一电极层,第二电极层和设置在第一和第二电极层之间的多个氧化物层。 氧化物层中的一个具有线性电阻和亚化学计量组成,另一个氧化物层具有双稳态电阻和近化学计量组成。 优选地,两个氧化物层厚度的总和在约和之间,并且具有双稳态电阻的氧化物层具有在总厚度的约25%至约75%之间的厚度。 在一个实施例中,氧化物层在具有受控的氩气和氧气的气氛中使用反应溅射形成。

    Method of forming current-programmable inline resistor
    55.
    发明申请
    Method of forming current-programmable inline resistor 审中-公开
    形成电流可编程内联电阻的方法

    公开(公告)号:US20150187841A1

    公开(公告)日:2015-07-02

    申请号:US14140723

    申请日:2013-12-26

    IPC分类号: H01L27/24 H01L49/02 H01L45/00

    摘要: Provided are resistive random access memory (ReRAM) cells and methods of fabricating thereof. A ReRAM cell includes an embedded resistor and a variable resistance layer that are interconnected in series by, for example, stacking the two. The embedded resistor prevents excessive electrical currents through the variable resistance layer thereby preventing its over-programming. The embedded resistor is configured to maintain a constant resistance during the operation of the ReRAM cell, such as applying switching currents and changing the resistance of the variable resistance layer. Specifically, the embedded resistor may be electrically broken down during fabrication of the ReRAM cell to improve the subsequent stability of the embedded resistance to electrical fields during operation of the ReRAM cell. The embedded resistor may be made from materials that allow this initial breakdown and to avoid future breakdowns, such metal silicon nitrides, metal aluminum nitrides, and metal boron nitrides.

    摘要翻译: 提供了电阻随机存取存储器(ReRAM)单元及其制造方法。 ReRAM单元包括嵌入式电阻器和可变电阻层,其通过例如堆叠两者串联互连。 嵌入式电阻器阻止通过可变电阻层的过大电流,从而防止其过度编程。 嵌入式电阻器被配置为在ReRAM单元的操作期间保持恒定的电阻,例如施加开关电流并改变可变电阻层的电阻。 具体地说,在ReRAM单元的制造期间,嵌入式电阻器可能被电分解,以提高在ReRAM单元操作期间嵌入电阻对电场的后续稳定性。 嵌入式电阻器可以由允许该初始击穿并避免将来击穿的材料制成,例如金属氮化硅,金属氮化铝和金属氮化硼。

    High Productivity Combinatorial Testing of Multiple Work Function Materials on the Same Semiconductor Substrate
    56.
    发明申请
    High Productivity Combinatorial Testing of Multiple Work Function Materials on the Same Semiconductor Substrate 审中-公开
    多功能材料在同一半导体基板上的高效率组合测试

    公开(公告)号:US20150187664A1

    公开(公告)日:2015-07-02

    申请号:US14140727

    申请日:2013-12-26

    发明人: Amol Joshi

    IPC分类号: H01L21/66 H01L21/28

    摘要: Provided are methods of high productivity combinatorial (HPC) screening of work function materials. Multiple test materials may be deposited as separate blanket layers on the same substrate while still forming individual interfaces with a common base layer. The thickness of each test material layer ensures that its work function properties are not impacted when other layers are deposited over that layer. A method may involve depositing a blocking layer over the base layer and selectively removing the blocking layer from a first site isolated region. A first test material is then deposited as a blanket layer and forms an interface with the base layer in that first region only. The first test material layer and the blocking layer are selectively removed from a second site isolated region followed by depositing a second test material layer as another blanket layer, which forms an interface with the base layer in the second region only.

    摘要翻译: 提供了工作功能材料的高生产率组合(HPC)筛选方法。 多个测试材料可以作为单独的覆盖层沉积在同一衬底上,同时仍然与公共基底层形成单独的界面。 每个测试材料层的厚度确保当其它层沉积在该层上时,其功函数特性不受影响。 一种方法可以包括在基底层上沉积阻挡层,并从第一位置隔离区选择性地去除阻挡层。 然后将第一测试材料沉积为覆盖层,并且仅在该第一区域中与基底层形成界面。 第一测试材料层和阻挡层从第二位置分离区域选择性地去除,随后沉积作为另一覆盖层的第二测试材料层,其仅与第二区域中的基层形成界面。

    Methods and Apparatus for Combinatorial PECVD or PEALD
    57.
    发明申请
    Methods and Apparatus for Combinatorial PECVD or PEALD 审中-公开
    组合PECVD或PEALD的方法和装置

    公开(公告)号:US20150184298A1

    公开(公告)日:2015-07-02

    申请号:US14660772

    申请日:2015-03-17

    摘要: Apparatus and methods for depositing materials on a plurality of site-isolated regions on a substrate are provided. The deposition uses PECVD or PEALD. The apparatus include an inner chamber with an aperture and barrier that can be used to isolate the regions during the deposition and prevent the remaining portions of the substrate from being exposed to the deposition process. The process parameters for the deposition process are varied among the site-isolate regions in a combinatorial manner.

    摘要翻译: 提供了用于在衬底上的多个位置隔离区域上沉积材料的设备和方法。 沉积使用PECVD或PEALD。 该装置包括具有开口和屏障的内室,其可以用于在沉积期间隔离区域,并且防止基板的剩余部分暴露于沉积工艺。 用于沉积过程的工艺参数以组合方式在位点隔离区域之间变化。

    ZrO-Based High K Dielectric Stack for Logic Decoupling Capacitor or Embedded DRAM
    59.
    发明申请
    ZrO-Based High K Dielectric Stack for Logic Decoupling Capacitor or Embedded DRAM 有权
    用于逻辑去耦电容器或嵌入式DRAM的基于ZrO的高K介质堆叠

    公开(公告)号:US20150179730A1

    公开(公告)日:2015-06-25

    申请号:US14135491

    申请日:2013-12-19

    IPC分类号: H01L49/02 H01L27/108

    CPC分类号: H01L28/40 H01L27/10805

    摘要: A zirconium oxide based dielectric material is used in the formation of decoupling capacitors employed in microelectronic logic circuits. In some embodiments, the zirconium oxide based dielectric is doped. In some embodiments, the dopant includes at least one of aluminum, silicon, or yttrium. In some embodiments, the zirconium oxide based dielectric is formed as a nanolaminate of zirconium oxide and a dopant metal oxide.

    摘要翻译: 在形成用于微电子逻辑电路中的去耦电容器中使用基于氧化锆的电介质材料。 在一些实施方案中,掺杂氧化锆基电介质。 在一些实施方案中,掺杂剂包括铝,硅或钇中的至少一种。 在一些实施方案中,基于氧化锆的电介质形成为氧化锆和掺杂剂金属氧化物的纳米氨酸盐。

    Plasma Treatment of Low-K Surface to Improve Barrier Deposition
    60.
    发明申请
    Plasma Treatment of Low-K Surface to Improve Barrier Deposition 有权
    低K表面的等离子体处理提高了阻挡层沉积

    公开(公告)号:US20150179509A1

    公开(公告)日:2015-06-25

    申请号:US14135182

    申请日:2013-12-19

    IPC分类号: H01L21/768 H01L21/02

    摘要: Methods and apparatus for processing using a remote plasma source are disclosed. The apparatus includes an outer chamber enclosing a substrate support, a remote plasma source, and a showerhead. A substrate heater can be mounted in the substrate support. A transport system moves the substrate support and is capable of positioning the substrate. The plasma system may be used to generate activated species. The activated species can be used to treat the surfaces of low-k and/or ultra low-k dielectric materials to facilitate improved deposition of diffusion barrier materials.

    摘要翻译: 公开了使用远程等离子体源的处理方法和装置。 该装置包括封闭衬底支撑件,远程等离子体源和喷头的外室。 基板加热器可以安装在基板支撑件中。 运输系统移动基板支撑件并且能够定位基板。 等离子体系统可用于产生活化物质。 活化物质可用于处理低k和/或超低k介电材料的表面,以促进扩散阻挡材料的改进沉积。