摘要:
The present invention provides a CMOS-inverter-type frequency divider circuit that can further reduce power consumption.The CMOS-inverter-type frequency divider circuit includes: a plurality of CMOS inverters that contribute to realizing a frequency division function; a frequency division control section for performing control such that some or all of the plurality of CMOS inverters are intermittently driven at the respective different timings in accordance with an input signal; and a drive power supplying section for supplying powers for driving the plurality of CMOS inverters, and for, based on state information indicating whether VCO sub band selection or normal transmission is performed, switching some or all of the powers for the plurality of CMOS inverters between the VCO sub band selection and the normal transmission.
摘要:
A method for manufacturing a ceramic substrate having a via hole(s) and a surface wiring pattern electrically connected to the via hole(s). The method includes: preparing a sintered ceramic substrate having a via hole(s); forming over the sintered ceramic substrate a sintered ceramic layer having a hole(s) or opening(s) whose bottom is configured to be at least a part of an exposed end surface of the via hole(s) by post-firing method; forming inside the hole(s) or opening(s) a conductive portion which electrically connects the surface of the sintered ceramic layer and the via hole(s); and forming over the surface of the sintered ceramic layer a surface wiring pattern electrically connected to the conductive portion.
摘要:
A method is set forth of forming an ohmic electrode having good characteristics on a SiC semiconductor layer. In the method, a Ti-layer and an Al-layer are formed on a surface of the SiC substrate. The SiC substrate having the Ti-layer and the Al-layer is maintained at a temperature that is higher than or equal to a first temperature and lower than a second temperature until all Ti in the Ti-layer has reacted with Al. The first temperature is the minimum temperature of a temperature zone at which the Ti reacts with the Al to form Al3Ti, and the second temperature is the minimum temperature of a temperature zone at which the Al3Ti reacts with SiC to form Ti3SiC2. As a result of this maintaining of temperature step, an Al3Ti-layer is formed on the surface of the SiC substrate. The method also comprises further heating the SiC substrate having the Al3Ti-layer to a temperature that is higher than the second temperature. As a result of this step of further heating the SiC substrate reacts with Al3Ti of the Al3Ti-layer to form a Ti3SiC2-layer on the surface of the SiC substrate.
摘要:
Provided is a PLL oscillation circuit that can reduce the variability of modulation sensitivity of a VCO 101 and obtain a desired output amplitude quickly with high precision. An amplitude detector 103 detects an output amplitude of the VCO 101. An amplitude controller 105 controls a current value of a variable current source 109 so as to have an output amplitude of the VCO 101 detected by the amplitude detector 103 to be a desired amplitude. A LPF 108 is connected between the amplitude controller 105 and the variable current source 109. A switch 107 connects or disconnects the LPF 108 between the amplitude controller 105 and the variable current source 109. The amplitude controller 105 is connected to the variable current source 109 through either the LPF 108 or the switching switch 107.
摘要:
A light-emitting element storing package which ensures the efficient reflection of light emitted by a light-emitting element by a reflector frame and thereby improves the brightness of the emitted light, and a method of manufacturing the same are provided. In a light-emitting element storing package includes: an insulating substrate consisting of a ceramic board, a reflector frame composed of a ceramic material, joined to the upper surface of the substrate along its outer edge and having an inner wall surface defining a light-reflecting surface, and a wiring pattern layer formed on the upper surface of the substrate for connection with a light-emitting element, a light-emitting element storing concave portion, which is defined by the substrate and the reflector frame, and in which the light-emitting element is mounted on the wiring pattern layer, the reflector frame is mainly composed of nitride ceramics and its light-reflecting surface is composed of white ceramics.
摘要:
A method for manufacturing a ceramic substrate having a via hole(s) and a surface wiring pattern electrically connected to the via hole(s). The method includes: preparing a sintered ceramic substrate having a via hole(s); forming over the sintered ceramic substrate a sintered ceramic layer having a hole(s) or opening(s) whose bottom is configured to be at least a part of an exposed end surface of the via hole(s) by post-firing method; forming inside the hole(s) or opening(s) a conductive portion which electrically connects the surface of the sintered ceramic layer and the via hole(s); and forming over the surface of the sintered ceramic layer a surface wiring pattern electrically connected to the conductive portion.
摘要:
A modulation apparatus 24 comprises a monitoring section 207 operable to monitor information about a control voltage applied to a VCO 201 as control voltage information, during any period, when a low-frequency signal having a frequency within a loop band of a PLL circuit is input at least before an LPF 209, a correction table storing section 206 operable to associate the control voltage information monitored by the monitoring section 207 as information about a control voltage after correction with information about a control voltage before correction, and store the associated information as a correction table, and a correction section 204 operable to correct a control voltage applied to the VCO 201 based on the correction table stored in the correction table storing section.
摘要:
Transistors M11 and M12 are cross-coupled to each other so as to form a negative resistance circuit. First and second variable capacitor sections 10 and 20 are connected in parallel with an inductor circuit so as to form a parallel resonant circuit. A first reference voltage Vref1 and a control voltage VT1 corresponding to a carrier wave component are fed to both terminals, respectively, of each of variable capacitors VC11 and VC12 included in the first variable capacitor section 10. A second reference voltage Vref2 and a control voltage VT2 corresponding to a modulated wave component are fed to both terminals, respectively, of each of variable capacitors VC21 and VC22 included in the second variable capacitor section 20. ADC control section 30 includes a resistance R31 interposed between the second reference voltage Vref2 and a common connection point of resistances R21 and R22, and a capacitor C31 for feeding only an AC component included in the modulated wave component to the common connection point of the resistances R21 and R22. Thus, a DC voltage, on which the AC component included in the modulated wave component is superimposed, is changed from a certain DC bias to a DC bias of the second reference voltage Vref2.
摘要:
A package for housing a light-emitting element wherein a via hole for wiring provided so as to pass through an insulating substrate is arranged in such a manner that it is positioned under a reflector frame; a method for manufacturing the above package for housing a light-emitting element which comprises the steps of separately providing a green sheet for the substrate and a green sheet for the frame, causing a paste containing a ceramic powder to be present between the two green sheets to bind them, and subjecting them to degreasing and sintering, to thereby integrate them.
摘要:
A metallized aluminum substrate for mounting a semiconductor device such as LD or LED is provided and a metallized aluminum nitride substrate having excellent dimensional accuracy and high bonding strength of a wiring pattern. An intermediate material substrate is provided, comprising a sintered aluminum nitride substrate having on its surface a wiring pattern constituted of a conductor layer composed of a composition containing at least high-melting point metal powder, aluminum nitride powder and a sintering auxiliary agent for aluminum nitride is prepared. Then, the intermediate material substrate is fired while the sintered aluminum nitride obtained by sintering using a sintering auxiliary agent of the same kind as that of the sintering auxiliary agent contained in the composition is placed so as to be brought into contact with the conductor layer on the surface of the intermediate material substrate or so as to be present in the vicinity of the conductor layer.