摘要:
A smelting reduction method comprising (a) charging a carbonaceous material and an ore into a reacting furnace to directly contact the carbonaceous material and the ore; (b) reducing the ore until at least a part of the ore is metallized, the resultant reduced ore containing at least a part of metallized metal being produced; (c) charging the carbonaceous material and the ore containing at least a part of the metallized metal from step (b) into a smelting furnace having a metal bath; and (d) blowing a gas containing 20% or more of oxygen into the metal bath in the smelting furnace to produce molten iron.
摘要:
An optical module comprises a photodiode, an amplifying device, and a die capacitor. The die capacitor has at least a center pad, the photodiode is mounted thereon, and other pads on both side of the center pad. The die capacitor is mounted on a mounting surface of the module so as to locate the photodiode to be center of the surface. The amplifying device has a signal pad and a plural ground pad surrounding the signal pad. The signal pad is connected to the photodiode, while the ground pads are connected to the mounting surface through other pads on both side of the die capacitor.
摘要:
It is an object of present invention to provide a low-cost photoelectric conversion module in which a signal for compensating noise caused by changes in temperature and variations in power supply is obtained. In the photoelectric conversion module according to the present invention, a first amplifier having an input terminal connected to the anode of a light-receiving element for converting an optical signal into an electrical signal amplifies the electrical signal to obtain an amplified signal. A second amplifier having an input terminal connected to one electrode of a capacitor outputs an amplified signal for compensating noise of the electrical signal amplified by the first amplifier. The other electrode of the capacitor is connected to the cathode of the light-receiving element. The capacitor has a capacitance value equal to the capacitance of the light-receiving element.
摘要:
A silicon substrate having a thin film circuit layer formed on the surface of the substrate is laid on a metallic base and a semiconductor chip made of compound semiconductor such as gallium arsenide is disposed in a hole defined in the central portion of the silicon substrate so that the semiconductor chip can be directly fixed to the metallic base for dissipating the heat of the semiconductor chip. The connecting terminals of the semiconductor chip are connected to thin film circuit layer formed on the surface of the silicon substrate through wires. The heat generated in the semiconductor chip can be transmitted to the metallic base so that the heat is effectively dissipated.
摘要:
A surface grinding machine comprises a wheel head vertically movably supported; a cup-shaped diamond wheel supported by a rotatable wheel shaft at one end of the wheel head and having an abrasive grain layer of Young's modulus (10-15).times.10.sup.4 kgf/cm.sup.2 at the lower end of the wheel; a wheel shaft driving motor for rotating the cup-shaped diamond wheel supported by the wheel head; a servomotor for vertically moving the wheel head; a suitable number of chuck tables for fixing the surface of a III-V group compound semiconductor wafer on which elements have been fabricated; an index table for rotatably supporting the chuck tables; a chuck table driving motor for turning the chuck tables; a main shaft motor current analysis circuit for detecting the current value of the wheel shaft driving motor; a main shaft rotation number analysis circuit for detecting the number of rotations of the wheel shaft driving motor, and a feed speed control circuit for controlling the serevomotor in such a manner as to decrease the feed speed when the grinding resistance is greater than a predetermined resistance value, and increase the feed speed when the grinding resistance is smaller than the predetermined resistance value.
摘要:
Holes are formed in a major surface of a hybrid IC insulating substrate mounting an optical semiconductor element, and terminal pins of a package are connected and fixed to the substrate while head portions of the terminal pins are inserted in the corresponding holes. Since the terminal pins do not protrude outside the major surface of the insulating substrate, a space therefor can be omitted, and the terminal pins are directly connected to the insulating substrate without being separated from each other. Furthermore, since the head portions of the terminal pins are inserted in the corresponding holes of the insulating substrate, they can be automatically aligned. In case that each hole has a tapered inner surface, insertion of the terminal pins can be further facilitated.
摘要:
A packaging method includes the steps of supplying auxiliary bags, adding an adhesive layer to one of the surfaces of each auxiliary bag, feeding a continuous sheet-like wrapping material to a forming and filling assembly, attaching the auxiliary bags by the adhesive layer to the wrapping material during travel thereof, at an interval corresponding to a length required for forming each package and each at a portion thereof which becomes an inner surface of the package other than sealed portions thereof, forming the wrapping material into a tubular shape with the auxiliary bags inside, supplying articles into the tubular wrapping material and sealing the same to form the packages.
摘要:
Suction device for handling a semiconductor wafer comprises a handling section having a plurality of suction ports opened in the same plane as the surface of the wafer and located within an area smaller than that of the surface of the wafer, a pressure reduction device connected to the suction port, an opening acts to release negative pressure produced by the pressure reduction device when a finger is released therefrom, and a grip integrally coupled to the handling section.
摘要:
According to a photographing apparatus of this invention, tilt angles of a photographing optical system at least at two points on a plane and a lens position in an in-focus state or in a zooming state are prestored before a photographing operation. When an object moving on the plane is photographed in practice, the focusing or zooming operation of the photographing lens system is appropriately performed in accordance with the tilt angle of the optical photographing system directed toward the object and the prestored data.
摘要:
A television camera in accordance with this invention includes an objective lens for receiving a light from a scene, said objective lens including a front lens part and a rear lens part, a color-separating combination prism disposed adjacent to said objective lens at its image side, an image-taking devices for sensing color-separated images which are formed by both said objective lens and said prism, a test pattern chart, a light-guiding path for conducting a light passed through said front lens part to illuminate said test chart, and an image-transmitting path for conducting a light from said test chart to said rear lens part to provide an image of the test chart to said image-taking devices.