摘要:
An apparatus for making a semiconductor device comprises a flexible mat, support shafts for supporting the flexible mat in a substantially horizontal position, a pressing plate having a generally convex body and supported for movement up and down, and a drive mechanism for driving one of the pressing plate and the wafer relative to the other of the pressing plate and the wafer so as to move up and down. The wafer having the first and second surfaces opposite to each other with the chips formed on the first surface thereof is placed on the mat with the chips confronting the flexible mat. The convex body of the pressing plate is pressed against the second surface of the wafer to separate the chips on the wafer individually.
摘要:
A process of die-bonding a semiconductor chip. The semiconductor chip is sucked by a collet and fixed on a preform which is formed on a die pad. A load is applied to the chip and a gas is blown around the semiconductor chip. so as to flatten any of the preform that has gone beyond the interface between the chip and die pad. The entire assembly is heated thereby curing the preform. In a preferred embodiment the semiconductor chip is sucked with the collet via a vacuum pump and an inert gas is blown around the semiconductor chip.
摘要:
A silicon substrate having a thin film circuit layer formed on the surface of the substrate is laid on a metallic base and a semiconductor chip made of compound semiconductor such as gallium arsenide is disposed in a hole defined in the central portion of the silicon substrate so that the semiconductor chip can be directly fixed to the metallic base for dissipating the heat of the semiconductor chip. The connecting terminals of the semiconductor chip are connected to thin film circuit layer formed on the surface of the silicon substrate through wires. The heat generated in the semiconductor chip can be transmitted to the metallic base so that the heat is effectively dissipated.
摘要:
A surface grinding machine comprises a wheel head vertically movably supported; a cup-shaped diamond wheel supported by a rotatable wheel shaft at one end of the wheel head and having an abrasive grain layer of Young's modulus (10-15).times.10.sup.4 kgf/cm.sup.2 at the lower end of the wheel; a wheel shaft driving motor for rotating the cup-shaped diamond wheel supported by the wheel head; a servomotor for vertically moving the wheel head; a suitable number of chuck tables for fixing the surface of a III-V group compound semiconductor wafer on which elements have been fabricated; an index table for rotatably supporting the chuck tables; a chuck table driving motor for turning the chuck tables; a main shaft motor current analysis circuit for detecting the current value of the wheel shaft driving motor; a main shaft rotation number analysis circuit for detecting the number of rotations of the wheel shaft driving motor, and a feed speed control circuit for controlling the serevomotor in such a manner as to decrease the feed speed when the grinding resistance is greater than a predetermined resistance value, and increase the feed speed when the grinding resistance is smaller than the predetermined resistance value.
摘要:
Suction device for handling a semiconductor wafer comprises a handling section having a plurality of suction ports opened in the same plane as the surface of the wafer and located within an area smaller than that of the surface of the wafer, a pressure reduction device connected to the suction port, an opening acts to release negative pressure produced by the pressure reduction device when a finger is released therefrom, and a grip integrally coupled to the handling section.
摘要:
Provided is an organic light emitting element having a high light emission efficiency and a low drive voltage. In the organic light emitting element including a positive electrode, a negative electrode and an organic compound layer disposed between the positive electrode and the negative electrode, the organic compound layer includes a thioxanthone compound represented by the following general formula [1].
摘要:
The present invention provides a novel organic compound that is chemically stable and can be used as a host material for phosphorescence emission.The present invention provides a benzimidazolyl carbazole compound shown by Formula [1] described in the description.
摘要:
A system for transporting red-hot coke including a non-rotary coke receiving car which travels on a first rail for receiving coke from at least one coke oven chamber; at least two rotary coke buckets, the at least two rotary coke buckets being mounted on a turntable, wherein the turntable is operable to orbit the at least two rotary coke buckets around its center, and the turntable travels along a second rail; one or two sets of discharge devices, each containing a discharge chute and a dust collector hood, which is operable to discharge the coke from the non-rotary coke receiving car to the at least two rotary coke buckets; and a hoist for hoisting and transporting the at least two rotary coke buckets to a coke dry quenching unit.
摘要:
An air supply apparatus includes a plurality of movable carriages arranged along a circular carriage path; a movable circular duct arranged along the carriage path and connected to each of the carriages through a connection air duct; a water sealing device including a circular water seal chamber arranged along the carriage path and a water sealing plate having a lower end part thereof sunk in sealing water in the circular water seal chamber; a stationary circular duct arranged along the carriage path and fitted into the movable circular duct through the water sealing device to be freely movable, wherein the movable circular duct and the stationary circular duct form a circular air path; and an atmospheric zone that stops leakage of air in the carriage being provided in a predetermined position of the carriage path, wherein an upper space of the circular water seal chamber on a circular air path side communicates with the circular air path on a movable circular duct side, the circular air path on the movable circular duct side communicates in a circumferential direction, and a connection air duct closing mechanism that closes the connection air duct is provided in the atmospheric zone.
摘要:
It is an object of the present invention to provide a highly reliable optical module circuit board having a sufficient mechanical strength with respect to an external stress. An optical module circuit board according to the present invention includes a flexible printed circuit having at least a multilayered structure in which a layer containing a conductive metal interconnection is sandwiched between insulating layers, wherein the flexible printed circuit includes a main body portion having the multilayered structure, a first surface mounted with an electronic component, and a second surface opposite to the first surface, a neck portion having the multilayered structure and extending from one end of the main body portion, and a head portion positioned at a distal end of the neck portion extending from the one end of the main body portion, having the multilayered structure, and mounted with an optical operation element and a bypass capacitor, Particularly, the neck portion defines the positional relationship between the main body portion and the head portion so as to give the circuit board a sufficient mechanical strength.