摘要:
A nonvolatile memory element comprises a first electrode (103); a second electrode (105); and a resistance variable layer (104) disposed between the first electrode (103) and the second electrode (105), resistance values of the resistance variable layer reversibly changing in response to electric signals applied between the electrodes (103, 105); the resistance variable layer (104) including a first tantalum oxide layer (107) comprising a first tantalum oxide and a second tantalum oxide layer (108) comprising a second tantalum oxide which is different in oxygen content from the first tantalum oxide, the first tantalum oxide layer and the second tantalum oxide layer being stacked together, and being configured such that 0
摘要:
A current steering element which can prevent occurrence of write disturb even when electric pulses having different polarities are applied and can cause large current to flow through a variable resistance element, and with which data can be written without problem. In a storage element (3) including: a variable resistance element (1) whose electric resistance value changes in response to application of electric pulses having a positive polarity and a negative polarity and which maintains the changed electric resistance value; and the current steering element (2) that steers current flowing through the variable resistance element (1) when the electric pulses are applied, the current steering element (2) includes: a first electrode (32); a second electrode (31); and a current steering layer (33) interposed between the first electrode (32) and the second electrode (31). When the current steering layer (33) includes SiNx (0
摘要:
A nonvolatile semiconductor memory device (100) comprises a substrate (102) provided with a transistor (101); a first interlayer insulating layer (103) formed over the substrate to cover the transistor; a first contact plug (104) formed in the first interlayer insulating layer and electrically connected to either of a drain electrode (101a) or a source electrode (101b) of the transistor, and a second contact plug (105) formed in the first interlayer insulating layer and electrically connected to the other of the drain electrode or the source electrode of the transistor; a resistance variable layer (106) formed to cover a portion of the first contact plug; a first wire (107) formed on the resistance variable layer; and a second wire (108) formed to cover a portion of the second contact plug; an end surface of the resistance variable layer being coplanar with an end surface of the first wire.
摘要:
Memory elements (3) arranged in matrix in a memory apparatus (21), each includes a resistance variable element (1) which changes an electrical resistance value in response to an applied electrical pulse having a positive polarity or a negative polarity and maintains the changed electrical resistance value, and a current suppressing element (2) for suppressing a current flowing when the electrical pulse is applied to the resistance variable element. The current suppressing element includes a first electrode, a second electrode, and a current suppressing layer provided between the first electrode and the second electrode, and the current suppressing layer comprises SiNx (x: positive actual number).
摘要:
A semiconductor device having interconnects is reduced in leakage current between the interconnects and improved in the TDDB characteristic. It includes an insulating interlayer 108, and interconnects 160 filled in grooves formed in the insulating interlayer, including a copper layer 124 mainly composed of copper, having the thickness smaller than the depth of the grooves, and a low-expansion metal layer 140, which is a metal layer having a heat expansion coefficient smaller than that of the copper layer, formed on the copper layer.
摘要:
In a semiconductor layer formed on a first insulating film is formed an element isolation groove extending to the first insulating film. Thereafter, a second insulating film is deposited in the element isolation groove by using a vapor deposition method.
摘要:
A top electrode of a thin film capacitor includes a dielectric oxide layer, a first conductive layer on the dielectric oxide layer, and a second conductive layer over the first conductive layer, wherein the first conductive layer processes at least one of a lower oxidizability and a lower diffusability than the second conductive layer.
摘要:
In a method for forming a capacitor in the semiconductor memory, a lower electrode is formed on an interlayer insulator film, and a high dielectric constant insulating film is formed to cover the whole surface including the lower electrode. Furthermore, an upper electrode layer is formed to cover the high dielectric constant insulating film. Thereafter, a plasma treatment is carried out to expose a surface of the upper electrode layer to plasma so that a suctorial layer is uniformly formed at the whole surface of the upper electrode layer, and then, a NSG film is grown on the whole surface of the upper electrode layer by a CVD process using TEOS as a starting material. Thus, an interlayer insulator film of the NSG film can be formed to have a uniform film thickness over the whole surface of the upper electrode.
摘要:
A method of manufacturing a capacitor comprises a step of forming a first dielectric layer composed of a ferroelectric material or a dielectric material possessing high permittivity on a first electrode, a step of sintering the first dielectric layer, a step of forming a second dielectric layer on the first dielectric layer, and a step of forming a second electrode on the second dielectric layer. By forming the second dielectric layer having small crystal grain size on the first dielectric layer having large crystal grain size, the surface of the capacitor insulating layer becomes flat.
摘要:
A working fluid comprising difluoroethane and at least two fluorinated hydrocarbons having a boiling point of not higher than -40.degree. C. under atmospheric pressure selected from the group consisting of methane derivatives and ethane derivatives which consist of one or two carbon atoms, hydrogen atoms and fluorine atoms, which has very small influence on the ozone layer in the stratosphere and is suitable as a substitute working fluid for chlorodifluoromethane.