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114 条记录 (耗时 0.16 秒)

    High Performance LED Package
    52.
    发明申请
    High Performance LED Package 有权
    高性能LED封装

    公开(公告)号：US20080173883A1

    公开(公告)日：2008-07-24

    申请号：US11624954

    申请日：2007-01-19

    申请人： Christopher P. Hussell ,  David T. Emerson ,  Michael J. Bergmann

    发明人： Christopher P. Hussell ,  David T. Emerson ,  Michael J. Bergmann

    IPC分类号： H01L33/00

    CPC分类号： H01L33/60 ,  G02B6/0073 ,  H01L33/486 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2924/00014

    摘要： A light emitting diode lamp is disclosed that includes a resin package that defines a recess in the shape of a solid polygon or another three-dimensional solid. The recess includes a floor, two side walls along the respective longer sides of the floor, and two end walls along the respective shorter sides of the floor. The two side walls define an angle therebetween greater than 3°, and the two end walls define an angle therebetween greater than 40°. A light emitting diode chip is positioned on the rectangular floor of the package.

    摘要翻译： 公开了一种发光二极管灯，其包括限定具有实心多边形或另一立体固体形状的凹部的树脂封装。 凹部包括地板，沿着地板的相应长边的两个侧壁以及沿着地板的相应短边的两个端壁。 两个侧壁在它们之间限定了大于3°的角度，并且两个端壁在它们之间限定了大于40°的角度。 发光二极管芯片位于封装的矩形地板上。

    GAS COOLED LED LAMP
    57.
    发明申请
    GAS COOLED LED LAMP 有权
    气体冷却LED灯

    公开(公告)号：US20130271987A1

    公开(公告)日：2013-10-17

    申请号：US13467670

    申请日：2012-05-09

    申请人： Christopher P. Hussell ,  John Adam Edmond ,  Gerald H. Negley ,  Curt Progl ,  Mark Edmond ,  Praneet Athalye

    发明人： Christopher P. Hussell ,  John Adam Edmond ,  Gerald H. Negley ,  Curt Progl ,  Mark Edmond ,  Praneet Athalye

    IPC分类号： F21V29/00 ,  H05K13/00

    CPC分类号： F21V29/65 ,  F21K9/232 ,  F21V3/10 ,  F21V29/506 ,  F21V29/60 ,  F21V29/63 ,  F21V29/67 ,  F21V29/85 ,  F21Y2107/00 ,  F21Y2107/30 ,  F21Y2115/10 ,  H01K1/00 ,  Y10T29/49002

    摘要： A gas cooled LED lamp and submount is disclosed. The centralized nature of the LEDs allows the LEDs to be configured near the central portion of the optical envelope of the lamp. In example embodiments, the LEDs can be cooled and/or cushioned by a gas in thermal communication with the LED array to enable the LEDs to maintain an appropriate operating temperature for efficient operation and long life. In some embodiments, the LED assembly is mounted on a glass stem. In some embodiments a thermal resistant path is created that prevents overtemperature of the LED array during the making of the lamp. In some embodiments the LED assembly comprises a lead frame and/or metal core board that is bent into a three-dimensional shape to create a desired light pattern in the enclosure or an extruded submount formed into a three-dimensional shape.

    摘要翻译： 公开了一种气体冷却的LED灯和底座。 LED的集中性使得LED可以配置在灯的光学外壳的中心部分附近。 在示例性实施例中，可以通过与LED阵列热连通的气体来冷却和/或缓冲LED，以使得LED能够保持适当的操作温度以有效地操作和长寿命。 在一些实施例中，LED组件安装在玻璃杆上。 在一些实施例中，产生耐热路径，其防止在制造灯时LED阵列的过热。 在一些实施例中，LED组件包括引导框架和/或金属芯板，其被弯曲成三维形状以在外壳中产生期望的光图案或形成为三维形状的挤压式基座。

    Solid state lighting device
    59.
    发明授权
    Solid state lighting device 有权
    固态照明装置

    公开(公告)号：US08497522B2

    公开(公告)日：2013-07-30

    申请号：US13082699

    申请日：2011-04-08

    申请人： Christopher P. Hussell

    发明人： Christopher P. Hussell

    IPC分类号： H01L33/62

    CPC分类号： H01L33/62 ,  H01L25/0753 ,  H01L33/486 ,  H01L33/642 ,  H01L2224/48465 ,  H01L2224/49113 ,  H01L2924/12032 ,  Y10T29/49002 ,  H01L2924/00

    摘要： A light emission package includes at least one solid state emitter, a leadframe, and a body structure encasing a portion of the leadframe. At least one aperture is defined in an electrical lead to define multiple electrical lead segments, with at least a portion of the aperture disposed outside an exterior side wall of the package. A recess may be defined in the exterior side wall to receive a bent portion of an electrical lead. A body structure cavity may be bounded by a floor, and side wall portions and end wall portions that are separated by transition wall portions including a curved or segmented upper edge, with different wall portions being disposed at different angles of inclination.

    摘要翻译： 发光封装包括至少一个固态发射器，引线框架和封装引线框架的一部分的主体结构。 至少一个孔限定在电引线中以限定多个电引线段，孔的至少一部分设置在封装的外侧壁的外侧。 可以在外侧壁中限定凹部以容纳电引线的弯曲部分。 身体结构腔可以由地板界定，并且侧壁部分和端壁部分被过渡壁部分分隔开，该过渡壁部分包括弯曲或分段的上边缘，其中不同的壁部分以不同的倾斜角度设置。

    Side view surface mount LED
    60.
    发明授权
    Side view surface mount LED 有权
    侧视表面贴装LED

    公开(公告)号：US08487337B2

    公开(公告)日：2013-07-16

    申请号：US13046982

    申请日：2011-03-14

    申请人： Christopher P. Hussell ,  Michael J. Bergmann ,  Brian T. Collins ,  David T. Emerson

    发明人： Christopher P. Hussell ,  Michael J. Bergmann ,  Brian T. Collins ,  David T. Emerson

    IPC分类号： H01L33/00

    CPC分类号： H01L33/502 ,  C09K11/7731 ,  C09K11/7734 ,  C09K11/7774 ,  G02B6/0023 ,  G02B6/0068 ,  G02B6/0073 ,  H01L33/486 ,  H01L33/52 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2924/01322 ,  H01L2933/0091 ,  Y02B20/181 ,  H01L2924/00014 ,  H01L2924/00

    摘要： A light emitting diode is disclosed. The diode includes a package support and a semiconductor chip on the package support, with the chip including an active region that emits light in the visible portion of the spectrum. Metal contacts are in electrical communication with the chip on the package. A substantially transparent encapsulant covers the chip in the package. A phosphor in the encapsulant emits a frequency in the visible spectrum different from the frequency emitted by the chip and in response to the wavelength emitted by the chip. A display element is also disclosed that combines the light emitting diode and a planar display element. The combination includes a substantially planar display element with the light emitting diode positioned on the perimeter of the display element and with the package support directing the output of the diode substantially parallel to the plane of the display element.

    摘要翻译： 公开了一种发光二极管。 二极管包括封装支撑件和封装支撑件上的半导体芯片，其中芯片包括在光谱的可见部分中发光的有源区域。 金属触点与封装上的芯片电连通。 基本上透明的密封剂覆盖封装中的芯片。 密封剂中的荧光体发射可见光谱中与芯片发射的频率不同的频率，并响应芯片发出的波长。 还公开了组合发光二极管和平面显示元件的显示元件。 该组合包括基本上平面的显示元件，其中发光二极管位于显示元件的周边上，并且封装支撑件引导二极管的输出基本上平行于显示元件的平面。