Method for lowering deposition stress, improving ductility, and enhancing lateral growth in electrodeposited iron-containing alloys
    51.
    发明申请
    Method for lowering deposition stress, improving ductility, and enhancing lateral growth in electrodeposited iron-containing alloys 审中-公开
    降低沉积应力,改善延展性和增强电沉积含铁合金的横向生长的方法

    公开(公告)号:US20060222871A1

    公开(公告)日:2006-10-05

    申请号:US11097538

    申请日:2005-03-31

    IPC分类号: B32B15/04 C25D5/18

    摘要: The present invention provides an electrodeposition/plating method for metal films and alloys in a bath which contain ferric ions and which usually deposit with high stress, but which when electrodeposited under pulse plating conditions in the presence of low valence vanadium or other ions capable of existing in multiple valence states produce low stress films and alloys and furthermore when plated through a mask creep laterally through walls and creep laterally along the surface of the mask to permit formation of overhangers, bridges, heat exchangers, and other complex three dimensional micro structures of low stress.

    摘要翻译: 本发明提供了一种用于金属膜和合金的电沉积/电镀方法,其中含有铁离子并且通常以高应力沉积的金属膜和合金,但是当在低价钒或其它能够存在的其它离子的存在下在脉冲电镀条件下电沉积时 在多价态下产生低应力膜和合金,此外当通过掩模电镀通过壁横向穿过壁并沿着掩模的表面横向蠕变以允许形成悬臂,桥,热交换器以及其它复杂的三维微结构 强调。

    Method of electrodepositing germanium compound materials on a substrate
    56.
    发明授权
    Method of electrodepositing germanium compound materials on a substrate 有权
    在基材上电沉积锗化合物材料的方法

    公开(公告)号:US07918984B2

    公开(公告)日:2011-04-05

    申请号:US11856335

    申请日:2007-09-17

    IPC分类号: C25D5/02

    摘要: A method of electrodepositing germanium compound materials on an exposed region of a substrate structure, which includes forming a plating solution by dissolving at least one germanium salt and at least one salt containing an element other than germanium in water; obtaining a substrate with a clean surface; immersing the substrate in the solution; and electroplating germanium compound materials on the substrate by applying an electrical potential between the substrate and an anode in the plating solution, in which the substrate is included in a semiconductor or phase change device.

    摘要翻译: 一种将锗化合物材料电沉积在基材结构的暴露区域上的方法,其包括通过将至少一种锗盐和至少一种含锗以外的元素的盐溶解在水中形成电镀溶液; 获得具有干净表面的基材; 将基材浸入溶液中; 以及通过在所述基板和所述基板被包括在半导体或相变装置中的所述电镀液中的所述基板和阳极之间施加电位而在所述基板上电镀锗化合物材料。

    SOLAR CELL PANELS AND METHOD OF FABRICATING SAME
    58.
    发明申请
    SOLAR CELL PANELS AND METHOD OF FABRICATING SAME 审中-公开
    太阳能电池板及其制造方法

    公开(公告)号:US20100037933A1

    公开(公告)日:2010-02-18

    申请号:US12189839

    申请日:2008-08-12

    摘要: A solar cell panel and method of forming a solar cell panel. The method includes a: forming an electrically conductive bus bar on a top surface of a bottom cover plate; forming an electrically conductive contact frame proximate to a bottom surface of a top cover plate, the top cover plate transparent to visible light; and placing an array of rows and columns of solar cell chips between the bottom cover plate and the top cover plate, each solar cell chip of the array of solar cell chips comprising an anode adjacent to a top surface and a cathode adjacent to a bottom surface of the solar cell chip, the bus bar electrically contacting each anode of each solar cell chip of the array of solar cell chips and the contact frame contacting each anode of each solar cell chip of the array of solar cell chips.

    摘要翻译: 太阳能电池板及其制造方法。 该方法包括:在底盖板的顶表面上形成导电母线; 形成靠近顶盖板的底表面的导电接触框架,顶盖板对可见光透明; 并且将太阳能电池芯片的行和列阵列放置在底盖板和顶盖板之间,太阳能电池芯片阵列的每个太阳能电池芯片包括与顶表面相邻的阳极和与底表面相邻的阴极 所述母线与所述太阳能电池芯片阵列的每个太阳能电池芯片的每个阳极电接触,并且所述接触框架接触所述太阳能电池芯片阵列的每个太阳能电池芯片的每个阳极。