摘要:
An optical device may include a slab, a first waveguide extending from a first portion of the slab to supply multiple first optical signals to the first portion of the slab, multiple second waveguides coupled to a second portion and to a third portion of the slab. The optical device may include multiple third waveguides provided extending from a fourth portion of the slab to direct a corresponding one of the multiple first optical signals away from the slab, a fourth waveguide extending from the fourth portion of the slab to supply multiple second optical signals to the fourth portion of the slab, and multiple fifth waveguides extending from the first portion of the slab to direct a corresponding one of the multiple second optical signals away from the slab. The optical device may include circuits to receive the first optical signals, the second optical signals, and local oscillator signals.
摘要:
A Raman pump may include a dual output laser configured to output two optical signals; a delay interferometer configured to delay a first of the two optical signals to decorrelate the two optical signals from each other; and a combiner configured to combine the delayed first of the two optical signals and a second of the two optical signals to provide a Raman amplification signal.
摘要:
A semiconductor optical amplifier module may include a beam splitter to split an optical signal into two polarization optical signals including a first polarization optical signal with a Transverse Magnetic (TM) polarization provided along a first path of two paths, and a second polarization optical signal with a Transverse Electric (TE) polarization provided along a second path of the two paths; a first rotator to rotate the TM polarization of the first polarization optical signal to TE polarization; a first semiconductor optical amplifier to amplify the rotated first polarization optical signal to output a first resultant optical signal; a second semiconductor optical amplifier to amplify the second polarization optical signal; and a second rotator to rotate the polarization of the amplified second polarization optical signal to output a second resultant optical signal; and a beam combiner to combine the first resultant optical signal and the second resultant optical signal.
摘要:
A high capacity optical transmitter implemented on a photonic integrated circuit chip comprises a single light source which supplies a continuous wave having a particular wavelength to a plurality of modulators to form modulated optical information signals. A phase shifter is coupled to at least one of the modulators and is used to shift the phase of the corresponding modulated optical information signal associated with a particular modulator. A polarization beam combiner receives each of the modulated optical information signals from the modulators and the modulated optical information signal from the phase shifter and combines each of these signals to form a polarization multiplexed differential quadrature phase-shift keying signal. The light source, the plurality of modulators, the phase shifter and the polarization beam combiner are all integrated on the chip.
摘要:
A high capacity optical transmitter implemented on a photonic integrated circuit chip comprises a single light source which supplies a continuous wave having a particular wavelength to a plurality of modulators to form modulated optical information signals. A phase shifter is coupled to at least one of the modulators and is used to shift the phase of the corresponding modulated optical information signal associated with a particular modulator. A polarization beam combiner receives each of the modulated optical information signals from the modulators and the modulated optical information signal from the phase shifter and combines each of these signals to form a polarization multiplexed differential quadrature phase-shift keying signal. The light source, the plurality of modulators, the phase shifter and the polarization beam combiner are all integrated on the chip.
摘要:
A photonic integrated circuit that includes a plurality of active and passive components on a substrate where one of the components is an optical combiner/decombiner having at least one free space coupler region and a plurality of longitudinal ridge waveguides each extending in the circuit from a first region of the waveguide and coupled at a second region of the waveguide at the free space coupler region. A first dielectric layer formed over the ridge waveguides and the free space coupler region. The first dielectric layer monotonically increases in cross-sectional thickness from the waveguide first region to the second region to reduce signal insertion losses in transitioning from the ridge waveguides to the free space coupler region. The first dielectric layer may be covered with a second passivation layer. The first dielectric layer may be SiOx, SiNx or SixONy and the second passivation layer may be BCB, ZnS or ZnSe.
摘要:
Disclosed is a method of adjusting a center channel wavelength of a group of channel wavelengths from of a plurality of modulated sources, integrated in a photonic integrated circuit (PIC), relative to the center of a wavelength passband of an optical combiner, such as an arrayed waveguide array (AWG), also integrated in the photonic integrated circuit (PIC) and optically coupled to outputs from the modulated sources.
摘要:
A photonic integrated circuit (PIC) comprises a plurality of integrated optically coupled components formed in a surface of the PIC and a passivating layer overlies at least a portion of the PIC surface. The overlying passivating layer comprises a material selected from the group consisting of BCB, ZnS and ZnSe. Also, when the circuits are PIC chips are die in the semiconductor wafer, a plurality of linear cleave streets are formed in a wafer passivation layer where a pattern of the cleave streets define separate PIC chips in the wafer for their subsequent singulation from the wafer.
摘要:
A method for reducing insertion loss in a transition region between a plurality of input or output waveguides to a free space coupler region in a photonic integrated circuit (PIC) includes the steps of forming a passivation layer over the waveguides and region and forming the passivation overlayer such that it monotonically increases in thickness through the transition region to the free space coupler region.
摘要:
A method of in-wafer testing is provided for a monolithic photonic integrated circuit (PIC) formed in a semiconductor wafer where each such in-wafer circuit comprises two or more integrated electro-optic components, one of each in tandem forming a signal channel in the circuit. The method includes the provision of a first integrated photodetector at a rear end of each signal channel and a second integrated photodetector at forward end of each signal channel. Then, the testing is accomplished, first, by sequentially operating a first of a selected channel electro-optic component in a selected circuit to monitor light output from a channel via its first corresponding channel photodetector and adjusting its operating characteristics by detecting that channel electro-optic component output via its second corresponding channel photodetector to provide first calibration data. Second, by sequentially operating a second of a selected channel electro-optic component in the selected circuit to monitor signal output from the second selected channel electro-optic component via its second corresponding channel photodetector and adjusting its operating characteristics by detecting that channel electro-optic component output via its second corresponding channel photodetector to provide second calibration data. The first and second calibration data for each circuit channel for the selected circuit are then stored for future reference.