Abstract:
A photonic integrated circuit (PIC) chip comprising an array of modulated sources, each providing a modulated signal output at a channel wavelength different from the channel wavelength of other modulated sources and a wavelength selective combiner having an input optically coupled to received all the signal outputs from the modulated sources and provide a combined output signal on an output waveguide from the chip. The modulated sources, combiner and output waveguide are all integrated on the same chip.
Abstract:
A method for reducing insertion loss in a transition region between a plurality of input or output waveguides to a free space coupler region in a photonic integrated circuit (PIC) includes the steps of forming a passivation layer over the waveguides and region and forming the passivation overlayer such that it monotonically increases in thickness through the transition region to the free space coupler region.
Abstract:
A monolithic optical transmitter photonic integrated circuit (TxPIC) comprises a plurality of integrated modulated sources which, when all operated at constant current, display a power output that varies as a function of array position similar to a quadratic-shaped curve and, further, forming an array of signal channels each having a different wavelength output. An optical combiner/decombiner is integrated in the circuit and has at least one free space region with a plurality of ordered bands along its edge where the zero order band is substantially at a longitudinal centerline of the free space region and where, on either side of this band, is a first order band followed by additional higher order bands. The ends of the output waveguides from the modulated sources are coupled approximate to the free space region edge along a region of the zero order band between one of the adjacent first order bands and a longitudinal centerline of the zero order band so that the inputs of the signal channels to the combiner of are titled or offset with respect to the longitudinal centerline of the combiner free space region so the combined outputs from the optical combiner will be aligned along the slope of the quadric-shaped curve of the combiner output passband envelope. The tilted combiner/decombiner may also be deployed in a receiver photonic integrated circuit (RxPIC) or other circuit employing such a device.
Abstract:
A photonic integrated circuit (PIC) chip comprising an array of modulated sources, each providing a modulated signal output at a channel wavelength different from the channel wavelength of other modulated sources and a wavelength selective combiner having an input optically coupled to received all the signal outputs from the modulated sources and provide a combined output signal on an output waveguide from the chip. The modulated sources, combiner and output waveguide are all integrated on the same chip.
Abstract:
Disclosed are apparatus and methods of reducing insertion loss, passivation, planarization and in-wafer testing of integrated optical components and in-wafer chips in photonic integrated circuits (PICs).
Abstract:
A photonic integrated circuit (PIC) chip comprising an array of modulated sources, each providing a modulated signal output at a channel wavelength different from the channel wavelength of other modulated sources and a wavelength selective combiner having an input optically coupled to received all the signal outputs from the modulated sources and provide a combined output signal on an output waveguide from the chip. The modulated sources, combiner and output waveguide are all integrated on the same chip.
Abstract:
A method is disclosed for optimizing optical channel signal demultiplexing in a monolithic receiver photonic integrated circuit (RxPIC) chip by providing an integrated channel signal demultiplexing with multiple waveguide input verniers provided to an WDM signal demultiplexer. The RxPIC chip may optionally include an integrated amplifier in at least some of the waveguide input verniers. The RxPIC chip may be comprised of, in monolithic form, a plurality of optional semiconductor optical amplifiers (SOAs) at the input of the chip to receive a WDM signal from an optical link which is provided along a plurality of waveguide input verniers to an integrated optical demultiplexer, such as, but not limited to, an arrayed waveguide grating (AWG), as a WDM signal demultiplexer. Thus, optical outputs from the respective semiconductor laser amplifiers are provided as vernier inputs to the optical demultiplexer forming a plurality of input verniers at the input to the optical demultiplexer. One of the vernier inputs to the chip is selected for operation in the RxPIC chip that corresponds to an optimum performance in matching a WDM channel signal wavelength grid of the received WDM signal to a wavelength grid of the on-chip optical demultiplexer.
Abstract:
A monolithic photonic integrated circuit (PIC) chip comprises an array of modulated sources providing a plurality of channel signals of different wavelengths and an optical combiner coupled to receive the channel signals and produce a combined output of the channel signals. The arrays of modulated sources are formed as ridge waveguides to enhance the output power from the respective modulated sources so that the average output power from the sources is approximately 2 to 4 times higher than in the case of comparable arrays of modulated sources formed as buried waveguides.
Abstract:
A method for forming and apparatus comprising a free space coupler region having a plurality of optical waveguides coupled to the space coupler region at an interface region, the waveguides converging with one another to the interface region, and a trench formed between adjacent waveguides, the depth of the trench or trenches extending from an outer point to the interface region and monotonically decreasing in depth from the outer point to the interface region.
Abstract:
A photonic integrated circuit (PIC) chip comprising an array of modulated sources, each providing a modulated signal output at a channel wavelength different from the channel wavelength of other modulated sources and a wavelength selective combiner having an input optically coupled to received all the signal outputs from the modulated sources and provide a combined output signal on an output waveguide from the chip. The modulated sources, combiner and output waveguide are all integrated on the same chip.