摘要:
A solid-state imaging device is provided, which comprises unit pixel portions. Each unit pixel portion comprises a first conductivity type substrate, a second conductivity type semiconductor layer, a first conductivity type well region, a light receiving region for generating electric charges when irradiated with light, an electric charge accumulation region for accumulating the electric charges from the light receiving region, and a transistor capable of reading out a signal corresponding to an amount of the electric charges accumulated in the electric charge accumulation region. A surface of the light receiving region is covered with an insulating film made of the same material as that of a gate insulating film of the transistor.
摘要:
Purpose: To present a vertical probe card capable of reusing without replacing a broken probe if a probe is broken. Constitution: A vertical probe card having vertical probes 100, being used in measurement of electric characteristics of an LSI chip 610 to be measured, comprising a main substrate 300 forming conductive patterns 310, a plurality of probes 100 drooping vertically from the main substrate 300, and a probe support 200 provided at the back side of the main substrate 300 for supporting the probes 100, in which the probe support 200 is disposed parallel to the main substrate 300, and has an upper guide plate 210 and a lower guide plate 220 for supporting the probes 100 by passing the through-holes 211,221 opened in each, and the lower guide plate 220 is composed of three substrates 220A, 220B, 220C laminated separably.
摘要:
A semiconductor storage device includes a plurality of memory elements and a redundancy circuit. Each of the memory elements includes (i) a gate electrode provided on a semiconductor layer, a gate insulating film intervening between the gate electrode and the semiconductor layer, (ii) a channel region provided under the gate electrode, (iii) diffusion regions respectively provided at both sides of the channel region, the diffusion regions having a conductivity type which is opposite a conductivity type of the channel region, and (iv) memory functioning members respectively provided at both sides of the gate electrode, the memory functioning members having a function of holding charge. The redundancy circuit includes an addressing arrangement for a single chip memory including cells associated with a plurality of redundant lines. A decoder for selecting a redundant row is selected by an address signal, and the decoder is programmed. The redundancy circuit requires no additional package pin, and programming is executed after packaging is completed. The semiconductor storage device further includes an arrangement for permanently inactivating any further programming of the redundancy circuit, in order to prevent a user from performing inadvertent programming.
摘要:
The present invention provides a semiconductor memory device including: a memory cell array in which memory cells are arranged; a plurality of terminals for accepting commands issued by an external user; a command interface circuit for interfacing between the external user and the memory cell array; a write state machine for controlling the programming and erasing operations; and an output circuit for outputting an internal signal to the plurality of terminals, wherein the memory cell includes a gate electrode formed over a semiconductor layer via a gate insulating film, a channel region disposed below the gate electrode, diffusion regions disposed on both sides of the channel region and having a conductive type opposite to that of the channel region, and memory functional elements formed on both sides of the gate electrode and having the function of retaining charges.
摘要:
A semiconductor storage device is provided with a gate electrode, a semiconductor layer, a gate insulating film sandwiched between the gate electrode and the semiconductor layer, a channel region under the gate electrode, diffusion regions provided respectively on two sides of the channel regions and being of the other conductivity region than the channel region, memory elements 1 provided respectively on two sides of the gate electrode and having a function of holding charges, and a word line driver circuit, in which the CMOS technique is used. The driver circuit includes a common node for supplying a potential for activating an output inverter for driving a row word line. While the semiconductor storage device is in a read mode, a CMOS inverter other than the output inverter controls a signal at the common node, the CMOS inverter connected to a read input line. While the semiconductor storage device is in writing/erasing mode, a plurality of writing/erasing transistors connected in series to the node are activated in accordance with an address signal, in order to lower the common node to a low potential.
摘要:
There is provided a monitoring apparatus for preventing paper breakage. For this monitoring apparatus, a light source 9 is disposed on the upper side of a wet paper 1, and a light emitting face thereof faces downward. An operation-side camera 5a and a drive-side camera 5b are disposed on the side opposite to the light source 9 with respect to the wet paper 1, and a lens face thereof faces upward. Light 9a of the light source 9 passes through the wet paper 1 after being reflected from a mirror 11, and is caught by the cameras 5a and 5b. Thus, the cameras 5a and 5b photograph a silhouette (image) of the light 9a of the light source 9, which has passed through the wet paper 1. This image is sent to an image processing unit 6, where the image is processed. The coordinates of a boundary line such that the wet paper 1 separates from a center roll 2 is detected from the images photographed from two directions. This coordinate value is sent to a computer 8. The computer 8 converts the value into a movement amount in each sampling cycle to determine the change amount and frequency of a separation point 3 and the whole shape of separation lines 3a and 3b. Thereby, a machine trouble resulting in paper breakage can be predicted.
摘要:
A first assembly configuration features in including: a plurality of probes having a buckling portion to buckle, upon a contact by an end of a contact portion onto an electrode of semiconductor integrated circuit; a first board provided with a first wiring pattern connected with a connecting portion of the probe; a second board removably fastened with the first board and provided with a second wiring pattern connected with the first wiring pattern; housing members mounted with the second board for holding the contact portion of the probe. Next configuration features in including: two kinds of probes; measurement probes and connection probes anew, and a plurality of connection probes include buckling portions to buckle, upon a contact by an end of contact portion onto the wiring pattern provided with the first board when inserted into holes provided with the a second board; wherein through holes provided with the second board are positioned to align to the arrangement of wiring pattern provided with the first board. Thereby, undesirable deviation of contact point by the probe is avoided and a suitable contact pressure is preferably kept, and further convenience in the work of exchanging damaged probes is brought about.
摘要:
A semiconductor device having a device separation region and an active region includes a gate oxide film, a source/drain region, and an electrode which is electrically coupled to the source/drain region. The active region is in contact with the gate oxide film at a first face, a portion of the source/drain regions being located above the first face. The electrode is in contact with the source/drain region at a second face, the second face constituting an angle with respect to the first face.
摘要:
A semiconductor device and a fabrication method thereof are disclosed. A silicon nitride film is formed over a silicon semiconductor substrate. Impurity ions are then implanted into desired areas of the silicon semiconductor substrate, so that nitrogen atoms and silicon atoms from the silicon nitride film are incorporated into the surface of the silicon semiconductor substrate together with introduction of impurity ions. The silicon semiconductor substrate has a minimized content of oxygen mixed thereinto and restored crystal defects filled by nitrogen atoms upon implanting of impurity ions. The fabricated semiconductor device is free from a trade-off relation between gate-electrode depletion and junction current leakage, and short-channel effects.
摘要:
A cap assembly of a front end of an inserting portion of an endoscope and a cap to be attached to the front end of the endoscope, comprising; a first engaging portion provided on the front end of the inserting portion of the endoscope; and, a second engaging portion provided on the cap being disengageably engaged with the first engaging portion of the endoscope. The front end of the inserting portion of the endoscope is provided with a projection whose diameter being smaller than a diameter of the front end, the projection being connected to the front end through a stepped portion.