公开(公告)号：US09967040B2

公开(公告)日：2018-05-08

申请号：US15676611

申请日：2017-08-14

Applicant: Intel Corporation

Inventor： Aleksandar Aleksov ,  Sasha N. Oster ,  Feras Eid ,  Adel A. Elsherbini ,  Johanna M. Swan ,  Amit Sudhir Baxi ,  Vincent S. Mageshkumar ,  Kumar Ranganathan ,  Wen-Ling M. Huang

IPC: H04B13/00 ,  A61B5/021 ,  A61B5/11 ,  A61B5/01 ,  A61B5/00 ,  A61B5/0402 ,  A61B5/145 ,  A61N7/00 ,  A61M5/142 ,  A61N1/04 ,  H04B5/00

CPC classification number: H04B13/005 ,  A61B5/0024 ,  A61B5/01 ,  A61B5/0205 ,  A61B5/021 ,  A61B5/0402 ,  A61B5/0432 ,  A61B5/1102 ,  A61B5/1107 ,  A61B5/1121 ,  A61B5/14532 ,  A61B5/14546 ,  A61B5/4839 ,  A61B5/4869 ,  A61B5/6833 ,  A61F7/007 ,  A61M5/14248 ,  A61N1/0484 ,  A61N1/0492 ,  A61N1/3603 ,  A61N7/00 ,  H04B5/0012

Abstract: Discussed generally herein are methods and devices including or providing a patch system that can help in diagnosing a medical condition and/or provide therapy to a user. A body-area network can include a plurality of communicatively coupled patches that communicate with an intermediate device. The intermediate device can provide data representative of a biological parameter monitored by the patches to proper personnel, such as for diagnosis and/or response.

公开(公告)号：US09954309B2

公开(公告)日：2018-04-24

申请号：US15215531

申请日：2016-07-20

Applicant: Intel Corporation

Inventor： Feras Eid ,  Sasha N. Oster ,  Adel A. Elsherbini ,  Aleksandar Aleksov ,  Johanna M. Swan ,  Amit Sudhir Baxi ,  Vincent S. Mageshkumar

IPC: H01R11/30 ,  H01R13/60 ,  H01R13/62 ,  H01R13/627 ,  H01R13/631

CPC classification number: H01R13/6205 ,  H01R11/30 ,  H01R13/627 ,  H01R13/631

Abstract: Discussed generally herein are methods and devices including or providing a magnetic, detachable, conductive connector to provide an electrical and mechanical connection between parts. A device can include a first substrate, at least one electric component on or at least partially in a first surface of the first substrate, an adhesive on the first surface of the first substrate to temporarily attached the device to skin of a user, a contact pad electrically coupled to an electric component of the at least one electric component, the contact pad on or at least partially in a second surface of the substrate, the first surface opposite the second surface, and a conductive magnetic connector electrically and mechanically connected to the contact pad through a first conductive adhesive.

公开(公告)号：US20170084554A1

公开(公告)日：2017-03-23

申请号：US14860614

申请日：2015-09-21

Applicant: INTEL CORPORATION

Inventor： Georgios C. Dogiamis ,  Sasha N. Oster ,  Telesphor Kamgaing ,  Adel A. Elsherbini ,  Brandon M. Rawlings ,  Feras Eid

IPC: H01L23/66 ,  H01L23/367 ,  H01L23/498

CPC classification number: H01L23/66 ,  H01L23/367 ,  H01L23/3675 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/5383 ,  H01L24/13 ,  H01L24/16 ,  H01L24/73 ,  H01L25/0655 ,  H01L2223/6627 ,  H01L2223/6677 ,  H01L2224/12105 ,  H01L2224/131 ,  H01L2224/16227 ,  H01L2224/73253 ,  H01L2924/1421 ,  H01L2924/1432 ,  H01L2924/1434 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15313 ,  H01L2924/15321 ,  H01L2924/16251 ,  H01L2924/163 ,  H01L2924/014 ,  H01L2924/00014

Abstract: Embodiments of the invention may include a packaged device that includes thermally stable radio frequency integrated circuits (RFICs). In one embodiment the packaged device may include an integrated circuit chip mounted to a package substrate. According to an embodiment, the package substrate may have conductive lines that communicatively couple the integrated circuit chip to one or more external components. One of the external components may be an RFIC module. The RFIC module may comprise an RFIC and an antenna. Additional embodiments may also include a packaged device that includes a plurality of cooling spots formed into the package substrate. In an embodiment the cooling spots may be formed proximate to interconnect lines the communicatively couple the integrated circuit chip to the RFIC.

公开(公告)号：US20150163904A1

公开(公告)日：2015-06-11

申请号：US14102757

申请日：2013-12-11

Applicant: Intel Corporation

Inventor： Omkar G. Karhade ,  John S. Guzek ,  Johanna M. Swan ,  Christopher J. Nelson ,  Nitin A. Deshpande ,  William J. Lambert ,  Charles A. Gealer ,  Feras Eid ,  Islam A. Salama ,  Kemal Aygun ,  Sasha N. Oster ,  Tyler N. Osborn

IPC: H05K1/11 ,  H05K1/18 ,  H05K3/40 ,  G06F1/18

CPC classification number: H01L25/16 ,  H01L23/5383 ,  H01L23/5386 ,  H01L23/5387 ,  H01L24/50 ,  H01L24/86 ,  H01L25/00 ,  H01L25/0655 ,  H01L2224/0405 ,  H01L2224/04105 ,  H01L2224/05568 ,  H01L2224/056 ,  H01L2224/05647 ,  H01L2224/29078 ,  H01L2224/86203 ,  H01L2224/86815 ,  H05K1/185 ,  Y10T29/49155 ,  H01L2924/00014 ,  H01L2924/014

Abstract: A microelectronic package of the present description may comprises a first microelectronic device having at least one row of connection structures electrically connected thereto and a second microelectronic device having at least one row of connection structures electrically connected thereto, wherein the connection structures within the at least one first microelectronic device row are aligned with corresponding connection structures within the at least one second microelectronic device row in an x-direction. An interconnect comprising an interconnect substrate having a plurality of electrically isolated conductive traces extending in the x-direction on a first surface of the interconnect substrate may be attached to the at least one first microelectronic device connection structure row and the at least one second microelectronic device connection structure row, such that at least one interconnect conductive trace forms a connection between a first microelectronic device connection structure and its corresponding second microelectronic device connection structure.

Abstract translation: 本说明书的微电子封装可以包括具有与其电连接的至少一行连接结构的第一微电子器件和具有与其电连接的至少一排连接结构的第二微电子器件，其中所述至少一个 第一微电子器件行与X方向上的至少一个第二微电子器件行内的对应连接结构对准。 包括具有在互连衬底的第一表面上沿x方向延伸的多个电隔离导电迹线的互连衬底的互连可以附接到所述至少一个第一微电子器件连接结构行和所述至少一个第二微电子器件 连接结构行，使得至少一个互连导电迹线形成第一微电子器件连接结构与其对应的第二微电子器件连接结构之间的连接。

公开(公告)号：US11658418B2

公开(公告)日：2023-05-23

申请号：US17317332

申请日：2021-05-11

Applicant: Intel Corporation

Inventor： Feras Eid ,  Sasha N. Oster ,  Telesphor Kamgaing ,  Georgios C. Dogiamis ,  Aleksandar Aleksov

IPC: H01Q1/24 ,  H01Q1/38 ,  H01Q9/04 ,  H01L21/56 ,  H01L23/31 ,  H01L23/495 ,  H01L23/552 ,  H01L23/66 ,  H01Q1/22 ,  H01Q1/52 ,  H01Q19/22 ,  H01L23/367

CPC classification number: H01Q9/0414 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/49541 ,  H01L23/552 ,  H01L23/66 ,  H01Q1/2283 ,  H01Q1/241 ,  H01Q1/526 ,  H01Q19/22 ,  H01L23/3675 ,  H01L2223/6672 ,  H01L2223/6677

Abstract: Embodiments of the invention include a microelectronic device that includes a first substrate having radio frequency (RF) components and a second substrate that is coupled to the first substrate. The second substrate includes a first conductive layer of an antenna unit for transmitting and receiving communications at a frequency of approximately 4 GHz or higher. A mold material is disposed on the first and second substrates. The mold material includes a first region that is positioned between the first conductive layer and a second conductive layer of the antenna unit with the mold material being a dielectric material to capacitively couple the first and second conductive layers of the antenna unit.

公开(公告)号：US20230077949A1

公开(公告)日：2023-03-16

申请号：US17958300

申请日：2022-09-30

Applicant: Intel Corporation

Inventor： Telesphor Kamgaing ,  Adel A. Elsherbini ,  Sasha N. Oster

IPC: H01L23/66 ,  H01L21/48 ,  H01L23/498

Abstract: In various embodiments, disclosed herein are systems and methods directed to the fabrication of a coreless semiconductor package (e.g., a millimeter (mm)-wave antenna package) having an asymmetric build-up layer count that can be fabricated on both sides of a temporary substrate (e.g., a core). The asymmetric build-up layer count can reduce the overall layer count in the fabrication of the semiconductor package and can therefore contribute to fabrication cost reduction. In further embodiments, the semiconductor package (e.g., a millimeter (mm)-wave antenna packages) can further comprise dummification elements disposed near one or more antenna layers. Further, the dummification elements disposed near one or more antenna layers can reduce image current and thereby increasing the antenna gain and efficiency.

公开(公告)号：US11031666B2

公开(公告)日：2021-06-08

申请号：US16325301

申请日：2016-09-30

Applicant: Intel Corporation

Inventor： Adel A. Elsherbini ,  Sasha N. Oster ,  Georgios C. Dogiamis ,  Telesphor Kamgaing ,  Shawna M. Liff ,  Aleksandar Aleksov ,  Johanna M. Swan ,  Brandon M. Rawlings ,  Richard J. Dischler

IPC: H01P3/16 ,  H01P11/00 ,  H01P3/12 ,  H01P3/127

Abstract: An apparatus comprises a waveguide including: an elongate waveguide core including a dielectric material, wherein the waveguide core includes at least one space arranged lengthwise along the waveguide core that is void of the dielectric material; and a conductive layer arranged around the waveguide core.

公开(公告)号：US10969576B2

公开(公告)日：2021-04-06

申请号：US16072164

申请日：2016-04-01

Applicant: Intel Corporation

Inventor： Aleksandar Aleksov ,  Feras Eid ,  Sasha N. Oster ,  Shawna M. Liff ,  Johanna M. Swan ,  Thomas L. Sounart ,  Baris Bicen ,  Valluri R. Rao

IPC: G02B26/10 ,  G02B26/08 ,  G02B1/14

Abstract: Disclosed herein are maskless imaging tools and display systems that include piezoelectrically actuated mirrors and methods of forming such devices. The maskless imaging tool may include a light source. Additionally, the tool may include one or more piezoelectrically actuated mirrors for receiving light from the light source. The piezoelectrically actuated mirrors are actuatable about one or more axes to reflect the light from the light source to a workpiece positioned to receive light from the piezoelectrically actuated mirror. Disclosed herein is a maskless imaging tool that is a laser direct imaging lithography (LDIL) tool. The maskless imaging tool may also be a via-drill tool. Disclosed herein is also a piezoelectrically actuated mirror used in a projection system. For example, the projection system may be integrated into a pair of glasses.

公开(公告)号：US10921524B2

公开(公告)日：2021-02-16

申请号：US15859477

申请日：2017-12-30

Applicant: Intel Corporation

Inventor： Adel A. Elsherbini ,  Georgios C. Dogiamis ,  Sasha N. Oster ,  Erich N. Ewy ,  Telesphor Kamgaing ,  Johanna M. Swan

IPC: G02B6/28 ,  H04W4/38 ,  H04W4/48 ,  H01P5/107 ,  H04L12/40 ,  G02B6/12 ,  G02B6/38 ,  G05D1/00 ,  H01Q1/32

Abstract: Embodiments include a sensor node, a method of forming the sensor node, and a vehicle with a communication system that includes sensor nodes. A sensor node includes an interconnect with an input connector, an output connector, and an opening on one or more sidewalls. The sensor node also includes a package with one or more sidewalls, a top surface, and a bottom surface, where at least one of the sidewalls of the package is disposed on the opening of interconnect. The sensor node may have a control circuit on the package, a first millimeter-wave launcher on the package, and a sensor coupled to the control circuit, where the sensor is coupled to the control circuit with an electrical cable. The sensor node may include that at least one of the sidewalls of the package is crimped by the opening and adjacent and co-planar to an inner wall of the interconnect.

公开(公告)号：US10816733B2

公开(公告)日：2020-10-27

申请号：US16072240

申请日：2016-04-01

Applicant: Intel Corporation

Inventor： Sasha N. Oster ,  Johanna M. Swan ,  Feras Eid ,  Thomas L. Sounart ,  Aleksandar Aleksov ,  Shawna M. Liff ,  Baris Bicen ,  Valluri R. Rao

IPC: G02B6/35 ,  H04Q11/00 ,  G02B26/08 ,  H04B10/25

Abstract: Embodiments of the invention include an optical routing device that includes an organic substrate. According to an embodiment, an array of cavities are formed into the organic substrate and an array of piezoelectrically actuated mirrors may be anchored to the organic substrate with each piezoelectrically actuated mirror extending over a cavity. In order to properly rout incoming optical signals, the optical routing device may also include a routing die mounted on the organic substrate. The routing die may be electrically coupled to each of the piezoelectrically actuated mirrors and is able to generated a voltage across the first and second electrodes of each piezoelectrically actuated mirror. Additionally, a photodetector may be electrically coupled to the routing die. According to an embodiment, an array of fiber optic cables may be optically coupled with one of the piezoelectrically actuated mirrors and optically coupled with the photodetector.