公开(公告)号：US20130034934A1

公开(公告)日：2013-02-07

申请号：US13418134

申请日：2012-03-12

申请人： Koichi MEGURO ,  Kanji Otsuka

发明人： Koichi MEGURO ,  Kanji Otsuka

IPC分类号： H01L21/50 ,  H01L21/78

CPC分类号： H01L23/5389 ,  H01L21/561 ,  H01L21/568 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/525 ,  H01L24/03 ,  H01L24/05 ,  H01L24/19 ,  H01L24/20 ,  H01L2224/02331 ,  H01L2224/02379 ,  H01L2224/0345 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/05008 ,  H01L2224/05026 ,  H01L2224/05164 ,  H01L2224/05166 ,  H01L2224/05171 ,  H01L2224/05181 ,  H01L2224/05548 ,  H01L2224/05572 ,  H01L2224/05647 ,  H01L2224/12105 ,  H01L2224/13022 ,  H01L2224/13024 ,  H01L2224/131 ,  H01L2224/94 ,  H01L2224/96 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/12042 ,  H01L2924/15788 ,  H01L2224/03 ,  H01L2924/00012 ,  H01L2224/11 ,  H01L2924/014 ,  H01L2224/05552 ,  H01L2924/00

摘要： A method for manufacturing a wafer level package is provided that enables suppressing the wearing of a cutter and extending the lifetime of the cutter, including forming insulating first resin over the top face of a substrate, which includes a groove for wiring to be formed; forming a film of first metal that is to serve as a portion of the wiring on the top face of the first resin using physical vapor deposition; forming a film of second metal that is to form a portion of the wiring on the top face of the first metal, with a lower hardness than the first metal; setting a cutter at a height corresponding to a place where the film of the first metal is not formed on a side face of the groove or the film thickness is low; and cutting at least the first resin by scanning the cutter.

摘要翻译： 提供一种制造晶片级封装的方法，其能够抑制切割器的磨损并延长切割器的寿命，包括在包括用于要形成的布线的凹槽的基板的顶面上形成绝缘的第一树脂; 使用物理气相沉积形成用作第一树脂顶面上的布线的一部分的第一金属膜; 在所述第一金属的顶面上形成第二金属的膜，所述第二金属的膜形成在所述第一金属的顶面上的一部分布线，硬度低于所述第一金属; 在与凹槽的侧面没有形成第一金属的膜的位置相对应的高度或者膜厚度下设置切割器; 并且通过扫描切割器至少切割第一树脂。

公开(公告)号：US07295032B2

公开(公告)日：2007-11-13

申请号：US10511720

申请日：2003-04-21

申请人： Kanji Otsuka ,  Tamotsu Usami ,  Tetsuya Higuchi ,  Eiichi Takahashi ,  Yuji Kasai ,  Masahiro Murakawa

发明人： Kanji Otsuka ,  Tamotsu Usami ,  Tetsuya Higuchi ,  Eiichi Takahashi ,  Yuji Kasai ,  Masahiro Murakawa

IPC分类号： H03K17/16

CPC分类号： H04B3/04 ,  H01L2224/48227 ,  H01L2924/12032 ,  H01L2924/1305 ,  H01L2924/13091 ,  H01L2924/19107 ,  H04L25/0286 ,  H01L2924/00

摘要： A purpose of a high-speed signal transmission system of the present invention is to pass a high-speed digital signal through an outside-chip line exchanging a signal with a high speed LSI chip with a band higher than GHz. The high-speed signal transmission system of the present invention has a configuration of: insertion of a circuit for feeding back received information and adjusting a waveform at a sending side based on genetic algorithm; a device structure for automatically performing pump up and pump down of a transistor carrier; a transmission line of a wiring out of a transistor; and elimination of a common power source of a circuit.

摘要翻译： 本发明的高速信号传输系统的目的是通过外部芯片线路将高速数字信号与具有高于GHz的频带的高速LSI芯片交换信号。 本发明的高速信号传输系统具有以下结构：基于遗传算法插入用于反馈接收信息的电路和调整发送侧的波形; 用于自动地执行泵浦和泵浦晶体管载体的装置结构; 晶体管的布线传输线; 并消除电路的公共电源。

公开(公告)号：US20060203586A1

公开(公告)日：2006-09-14

申请号：US11360681

申请日：2006-02-24

申请人： Kanji Otsuka ,  Tamotsu Usami

发明人： Kanji Otsuka ,  Tamotsu Usami

IPC分类号： G11C7/00

CPC分类号： H01L27/108 ,  G11C5/063 ,  G11C7/12 ,  G11C7/18 ,  G11C11/405 ,  G11C11/4094 ,  G11C11/4097

摘要： A memory cell MC includes nMOS transistors for a transfer gate configured to be paired with each other, and one capacitor for data storage connected to the nMOS transistor. A gate electrode of the nMOS transistor is connected to a word line WL, and a drain is connected to a bit line BL. A gate electrode of the nMOS transistor is connected to a word line /WL, and a drain and a source are connected to a ground. The capacitor is connected between a source of the nMOS transistor and the ground. A Y selector circuit is connected between a differential bit line BL, /BL and a differential data line DL, /DL. The Y selector circuit has two pairs of nMOS transistors configured to be paired transistors, respectively.

摘要翻译： 存储单元MC包括用于被配置为彼此配对的传输门的nMOS晶体管，以及连接到nMOS晶体管的一个用于数据存储的电容器。 nMOS晶体管的栅电极连接到字线WL，漏极连接到位线BL。 nMOS晶体管的栅电极连接到字线/ WL，漏极和源极连接到地。 电容器连接在nMOS晶体管的源极和地之间。 Y选择电路连接在差分位线BL，/ BL和差分数据线DL / DL之间。 Y选择器电路具有分别配置为成对晶体管的两对nMOS晶体管。

公开(公告)号：US06914502B2

公开(公告)日：2005-07-05

申请号：US09988017

申请日：2001-11-16

申请人： Kanji Otsuka ,  Tamotsu Usami

发明人： Kanji Otsuka ,  Tamotsu Usami

IPC分类号： H05K1/02 ,  H01L21/3205 ,  H01P3/04 ,  H01P3/08

CPC分类号： H01P3/081 ,  H05K1/0237

摘要： A wiring structure for a transmission line has a ground line (2) and a signal line (1). The signal line (1) is disposed so as to face the ground line (2) through a dielectric (3). A surface of the signal line (1) facing the ground line (2) has a groove extending in the transmission direction. A surface of the ground line (2) facing the signal line (1) also has a groove extending in the transmission direction. The grooves restrain that electromagnetic induction is caused in the signal line (1) due to an electromagnetic field generated by other adjacent signal lines (1).

摘要翻译： 传输线的布线结构具有接地线（2）和信号线（1）。 信号线（1）通过电介质（3）设置成与地线（2）相对。 面向地线（2）的信号线（1）的表面具有在传输方向上延伸的凹槽。 接地线（2）的面向信号线（1）的表面还具有沿传输方向延伸的凹槽。 沟槽限制了由于其他相邻信号线（1）产生的电磁场而在信号线（1）中引起电磁感应。

公开(公告)号：US20050040846A1

公开(公告)日：2005-02-24

申请号：US10898874

申请日：2004-07-26

申请人： Kanji Otsuka ,  Tamotsu Usami

发明人： Kanji Otsuka ,  Tamotsu Usami

IPC分类号： H01P3/02 ,  G08C19/00 ,  H01P5/02 ,  H01P5/08 ,  H03K17/041 ,  H03K19/0175 ,  H04B3/02 ,  H04L25/02 ,  H04L25/08 ,  H03K19/003

CPC分类号： H04L25/08 ,  H03K17/04106

摘要： To transmit a high-speed digital signal of several tens GHz via a differential line by connecting a differential line referring to the ground to differential lines not referring to the ground, there is provided a signal transmission system which transmits a digital signal between circuit blocks via a signal transmission line, each of the circuit blocks basically including a functional circuit, a reception/transmission circuit formed separately from the functional circuit and an impedance-matched transmission line (115) formed between reception and transmission ends of the reception/transmission circuit; a differential line (105) referring to the ground (110), led out from a differential output driver, being formed from differential signal lines disposed symmetrically with respect to the ground (110) in the circuit block, only differential pair lines (111, 112) not referring to the ground being extended directly from the differential signal lines disposed symmetrically with respect to the ground in the signal transmission line (115).

摘要翻译： 通过将差分线连接到不涉及地面的差分线，通过差分线路传输数十GHz的高速数字信号，提供了一种信号传输系统，其通过电路块之间的数字信号经由 信号传输线，每个电路块基本上包括功能电路，与功能电路分开形成的接收/发送电路和形成在接收/发送电路的接收和发送端之间的阻抗匹配传输线路（115）; 从差分输出驱动器引出的对地（110）的差分线（105）由相对于电路块中的接地（110）对称设置的差分信号线形成，仅差分对线（111， 112），而不是直接从在信号传输线路（115）中相对于地面对称设置的差动信号线延伸的地面。

公开(公告)号：US06731153B2

公开(公告)日：2004-05-04

申请号：US09963500

申请日：2001-09-27

申请人： Kanji Otsuka ,  Tamotsu Usami

发明人： Kanji Otsuka ,  Tamotsu Usami

IPC分类号： H03K1704

CPC分类号： H03K19/01707

摘要： A CMOS line driver is made up of p- and nMOS transistors. A pMOS varactor is interposed between the source of the pMOS transistor and a power supply, while an nMOS varactor is interposed between the source of the nMOS transistor and ground. The sizes of each of these MOS varactors may be the same as those of the p- or nMOS transistor. Alternatively, each of these MOS varactors may have a channel area twice greater than that of the p- or nMOS transistor. The inverted version of a signal input to the line driver is supplied to the gates of the MOS varactors. In this manner, the MOS transistors, making up the line driver, can switch at a high speed.

摘要翻译： CMOS线路驱动器由p-和nMOS晶体管组成。 pMOS变容二极管介于pMOS晶体管的源极和电源之间，而nMOS变容二极管插在nMOS晶体管的源极和地之间。 这些MOS可变电抗器的尺寸可以与p型或nMOS晶体管的尺寸相同。 或者，这些MOS变容二极管中的每一个可以具有比p型或nMOS晶体管的沟道面积的两倍的沟道面积。 将输入到线路驱动器的信号的反相形式提供给MOS可变电抗器的栅极。 以这种方式，构成线路驱动器的MOS晶体管可以高速切换。

公开(公告)号：US06522173B1

公开(公告)日：2003-02-18

申请号：US09280652

申请日：1999-03-29

申请人： Kanji Otsuka

发明人： Kanji Otsuka

IPC分类号： H01P308

CPC分类号： H01L23/50 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K1/0216 ,  H05K1/0237 ,  H01L2924/00

摘要： An electronic device includes a wiring board, and at least one pair of signal lines that is provided on the wiring board in parallel and has an equal length. A chip is mounted on the wiring board and includes at least one differential driver which outputs complementary digital transmit signals to said at least one of lines. A pair of power system lines is provided to supply first and second power supply voltages to the above-mentioned at least one differential driver. The power system lines are parallel to each other and have an equal length.

公开(公告)号：US06373275B1

公开(公告)日：2002-04-16

申请号：US09456303

申请日：1999-12-08

申请人： Kanji Otsuka ,  Tamotsu Usami

发明人： Kanji Otsuka ,  Tamotsu Usami

IPC分类号： H03K19003

CPC分类号： H01L24/49 ,  G06F13/4086 ,  H01L23/66 ,  H01L24/06 ,  H01L24/48 ,  H01L2223/6611 ,  H01L2224/05554 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01052 ,  H01L2924/01056 ,  H01L2924/01058 ,  H01L2924/01059 ,  H01L2924/01061 ,  H01L2924/01063 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01084 ,  H01L2924/01094 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/1305 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/30111 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

摘要： An electronic device which improves speed of signal transmission in a bus wiring system by specifying circuit configuration of a driver circuit and transmission line characteristic impedance. An input/output circuit combines a differential driver of current switch type with a bus wiring system having a transmission line for transmitting a differential complementary digital signal and a termination end resistor matching the transmission line. An integrated circuit chip including the differential driver is mounted on a wiring board including the transmission line and the termination end resistor. The transmission line includes wires having an equal length which have characteristic impedance of 25&OHgr; or less. In combination with the current switch type differential driver, this transmission line structure restricts attenuation of signal energy during transmission and restricts electromagnetic interference between transmission lines close to each other.

摘要翻译： 一种通过指定驱动电路的电路结构和传输线特性阻抗来提高总线布线系统中的信号传输速度的电子设备。 输入/输出电路将电流开关类型的差分驱动器与具有传输差分互补数字信号的传输线的总线布线系统和匹配传输线的终端电阻相结合。 包括差分驱动器的集成电路芯片安装在包括传输线和端接电阻器的布线板上。 传输线包括具有等于25MEGA或更小的特征阻抗的具有相同长度的导线。 结合当前的开关式差分驱动器，该传输线结构限制了传输期间信号能量的衰减，并限制了彼此靠近的传输线之间的电磁干扰。

公开(公告)号：US5365402A

公开(公告)日：1994-11-15

申请号：US800268

申请日：1991-11-29

申请人： Toshio Hatada ,  Shigeo Ohashi ,  Tadakatsu Nakajima ,  Heikichi Kuwahara ,  Hitoshi Matsushima ,  Motohiro Sato ,  Hiroshi Inouye ,  Takao Ohba ,  Akira Yamagiwa ,  Kanji Otsuka ,  Yuuji Shirai

发明人： Toshio Hatada ,  Shigeo Ohashi ,  Tadakatsu Nakajima ,  Heikichi Kuwahara ,  Hitoshi Matsushima ,  Motohiro Sato ,  Hiroshi Inouye ,  Takao Ohba ,  Akira Yamagiwa ,  Kanji Otsuka ,  Yuuji Shirai

IPC分类号： H01L23/36 ,  H01L23/367 ,  H01L23/40 ,  H01L23/433 ,  H05K7/20

CPC分类号： H01L23/433 ,  H01L23/3677 ,  H01L23/4006 ,  H01L2023/405 ,  H01L2224/32188 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2924/00014 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/16195

摘要： A cooling apparatus for an electronic device of high calorific density including an elastomer interposed between a semiconductor chip and a heat sink so as to connect them thermally. The elastomer may also be in close contact with a large number of semiconductor chips having various configurations which are mounted on a board, so that the elastomer is thermally connected with them, whereby the elastomer absorbs thermal deformations.

摘要翻译： 一种用于高热密度的电子装置的冷却装置，包括插入在半导体芯片和散热片之间的弹性体，以便将它们热连接。 弹性体还可以与安装在板上的具有各种构造的大量半导体芯片紧密接触，使得弹性体与它们热连接，由此弹性体吸收热变形。

公开(公告)号：US5304844A

公开(公告)日：1994-04-19

申请号：US889397

申请日：1992-05-28

申请人： Osamu Horiuchi ,  Gen Murakami ,  Hiromichi Suzuki ,  Hajime Hasebe ,  Kanji Otsuka ,  Yuuji Shirai ,  Takayuki Okinaga ,  Takashi Emata

发明人： Osamu Horiuchi ,  Gen Murakami ,  Hiromichi Suzuki ,  Hajime Hasebe ,  Kanji Otsuka ,  Yuuji Shirai ,  Takayuki Okinaga ,  Takashi Emata

IPC分类号： H01L21/60 ,  H01L23/495 ,  H01L23/498 ,  H01L23/48 ,  H01L29/44 ,  H01L29/52

CPC分类号： H01L23/49527 ,  H01L23/49537 ,  H01L23/49558 ,  H01L23/49861 ,  H01L24/49 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49109 ,  H01L2224/49111 ,  H01L2224/49171 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/30107

摘要： A semiconductor device is provided having a semiconductor pellet that is arranged on a substantially central part of a film base in which a metal plate is overlaid with an insulating member, while inner leads are arranged on a peripheral part of the film base in a state in which they are electrically isolated from the metal plate of the film base. External terminals for a power source among external terminals of the semiconductor pellet and middle parts of the metal plate of the film base, as well as inner leads for the power source among the inner leads and peripheral parts of the metal plate are electrically connected by pieces of bonding wire, respectively.

摘要翻译： 提供一种半导体器件，其具有半导体芯片，该半导体芯片布置在薄膜基座的大致中央部分，金属板上覆盖有绝缘构件，而内部引线设置在薄膜基座的周边部分处于 它们与膜基底的金属板电隔离。 用于半导体芯片的外部端子和薄膜基座的金属板的中间部分之间的电源的外部端子以及金属板的内部引线和外围部分之间的用于电源的内部引线被电连接 的接合线。