公开(公告)号：US5261986A

公开(公告)日：1993-11-16

申请号：US799043

申请日：1991-11-26

申请人： Shoichi Kawabata ,  Hiromichi Wakatsuki ,  Norio Sakai ,  Keiichi Okada

发明人： Shoichi Kawabata ,  Hiromichi Wakatsuki ,  Norio Sakai ,  Keiichi Okada

IPC分类号： H01G4/12 ,  B28B3/02 ,  B28B11/00 ,  B28B13/04 ,  H01G4/30 ,  H01G4/40 ,  H05K1/02 ,  H05K1/03 ,  H05K1/09 ,  H05K3/46 ,  C04B37/00

CPC分类号： H05K3/4629 ,  B28B11/003 ,  B28B13/04 ,  B28B3/024 ,  H01G4/308 ,  H01G4/40 ,  H05K3/4638 ,  H05K1/0269 ,  H05K1/0306 ,  H05K1/092 ,  H05K2201/09781 ,  H05K2203/166 ,  Y10T156/1093

摘要： A method of fabricating a ceramic laminated electronic component including the steps of preparing a plurality of ceramic green sheets each having electrode pastes in a plurality of regions and having positioning marks printed in positions having a constant positional relationship to the electrode pastes, removing wrinkles in each of the ceramic green sheets to flatten the ceramic green sheet on a suction plate, and transferring the flattened ceramic green sheet to a laminating stage by a suction chuck, laminating the ceramic green sheet on the laminating stage on the basis of the above positioning marks, and preliminarily fixing the ceramic green sheets to each other in the case of the lamination in obtaining a mother ceramic laminated body for the ceramic laminated electronic component.

摘要翻译： 一种制造陶瓷层压电子部件的方法，包括以下步骤：在多个区域中制备多个具有电极浆料的陶瓷生片，并将定位标记印刷在与电极浆料具有恒定位置关系的位置，从而去除每个 的陶瓷生片将吸附板上的陶瓷生片平坦化，并通过吸盘将平坦化的陶瓷生片转移到层压台，基于上述定位标记将陶瓷生片层压在层压台上， 并且在层叠的情况下，预先将陶瓷生片彼此固定，以获得用于陶瓷层叠电子部件的母陶瓷层叠体。

公开(公告)号：US4848106A

公开(公告)日：1989-07-18

申请号：US158240

申请日：1988-02-19

申请人： Shoichi Hayashi ,  Norio Sakai ,  Hidetoshi Ishihara

发明人： Shoichi Hayashi ,  Norio Sakai ,  Hidetoshi Ishihara

IPC分类号： B30B9/22 ,  D06F47/06

CPC分类号： D06F47/06 ,  B30B9/22

摘要： The invention resides in a compression membrane for wringing liquid out of an object to be compressed, characterized in that its marginal portion whose width is of the order of 15%-35% of the width in the radial direction of the membrane body is made smaller in stretchability than the other portion, whereby no tear of the object to be compressed does not tear during the dehydration thereof.

摘要翻译： 本发明涉及一种用于将液体从待压缩物体中拧出的压缩膜，其特征在于，其宽度为膜体径向宽度的15％-35％的边缘部分变小 在拉伸性方面比其他部分的拉伸性好，因此在其脱水过程中，被压缩物体的撕裂不会撕裂。

公开(公告)号：US4766412A

公开(公告)日：1988-08-23

申请号：US52490

申请日：1987-05-20

申请人： Shin-ichi Takakura ,  Shigehiro Nojiri ,  Norio Sakai

发明人： Shin-ichi Takakura ,  Shigehiro Nojiri ,  Norio Sakai

IPC分类号： H01C13/00 ,  H01F27/00 ,  H01G4/40 ,  H03H1/02

CPC分类号： H01G4/40

摘要： An electronic composite component is composed of a resistor element formed by a resistor film and a functional element such as a capacitor element which is electrically connected in parallel with the resistor element. The functional element has a body and a pair of terminal electrodes formed on respective end surfaces of the body. A serially extending electric insulation layer is formed on the surface of the body to partially cover the pair of terminal electrodes. This electric insulation layer is formed to selectively determine the distance between exposed regions of the terminal electrodes. The resistor film forming the resistor element is provided to partially cover and interconnect the exposed regions of the terminal electrodes and cross the boundary lines between the insulation layer and the exposed regions of the terminal electrodes, to electrically connect the pair of terminal electrodes with each other, through a resistance selectively determined according to the distance between the exposed regions of the terminal electrodes.

摘要翻译： 电子复合元件由电阻膜形成的电阻元件和与电阻元件并联电连接的电容器元件等功能元件构成。 功能元件具有形成在主体的相应端表面上的主体和一对端子电极。 在主体的表面上形成一个串联延伸的电绝缘层，以部分地覆盖该对端子电极。 形成电绝缘层以选择性地确定端子电极的暴露区域之间的距离。 形成电阻元件的电阻膜被设置成部分地覆盖和互连端电极的暴露区域并与绝缘层和端子电极的暴露区域之间的边界线交叉，以将该对端子电极彼此电连接 通过根据端子电极的暴露区域之间的距离选择性地确定的电阻。

公开(公告)号：US08308887B2

公开(公告)日：2012-11-13

申请号：US13182465

申请日：2011-07-14

申请人： Kazuhiro Isebo ,  Norio Sakai ,  Kenji Kawakami ,  Nobuaki Ogawa

发明人： Kazuhiro Isebo ,  Norio Sakai ,  Kenji Kawakami ,  Nobuaki Ogawa

IPC分类号： B44C1/17 ,  B44C1/165 ,  C03B29/00 ,  B29C65/00 ,  B23P19/00

CPC分类号： H05K3/4061 ,  G03G15/224 ,  G03G15/225 ,  G03G15/6585 ,  G03G15/6591 ,  H05K1/0306 ,  H05K3/1266 ,  H05K3/4611 ,  H05K3/4629 ,  H05K2203/0143 ,  H05K2203/0156 ,  H05K2203/0517 ,  H05K2203/1189 ,  H05K2203/1545 ,  Y10T29/5313 ,  Y10T29/5317 ,  Y10T156/10 ,  Y10T156/109

摘要： A via hole forming method and a multilayered board manufacturing method improve manufacturing yield by reducing the required processes. The via hole forming method includes a first step of forming a toner image by attaching toner particles, containing a conductive material and having a protruding portion, onto the surface of a first photosensitive member so that the protruding portion is directed to the outside; and a second step of opposing the surface of the first photosensitive member to one principal surface of a green sheet containing an insulating material and transferring the toner image to the one principal surface of the green sheet so that the protruding portions of the toner particles protrude into the green sheet so as to reach the other principal surface of the green sheet and the toner particles are buried in the green sheet. The via holes are formed using an electrophotographic printing method.

摘要翻译： 通孔形成方法和多层板制造方法通过减少所需的工艺来提高制造成品率。 通孔形成方法包括：第一步骤，通过将包含导电材料并具有突出部分的调色剂颗粒附着到第一感光构件的表面上以使得突出部分被引导到外部来形成调色剂图像; 以及将第一感光构件的表面相对于包含绝缘材料的生片的一个主表面并将调色剂图像转印到生片的一个主表面的第二步骤，使得调色剂颗粒的突出部分突出到 生片从而到达生片的另一个主表面和调色剂颗粒被埋在生片中。 通孔使用电子照相印刷法形成。

公开(公告)号：US08031124B2

公开(公告)日：2011-10-04

申请号：US12426369

申请日：2009-04-20

申请人： Noboru Kato ,  Norio Sakai

发明人： Noboru Kato ,  Norio Sakai

IPC分类号： H01Q1/38

CPC分类号： B65D25/20 ,  B65D2203/10 ,  G06K7/10178 ,  H01L2224/16 ,  H01Q1/2283 ,  H01Q1/362 ,  H01Q1/38 ,  H01Q7/00 ,  H01Q11/08

摘要： A container includes an electromagnetic coupling module on an inner surface of a container main body and a radiator made of a metal material on an outer surface of the container main body. The electromagnetic coupling module includes a feeder circuit board, on which a radio IC chip is mounted and in which a feeder circuit including a resonant circuit that has a predetermined resonant frequency and includes an inductance element is provided. The electromagnetic coupling module and the radiator preferably transmit and receive high-frequency signals through electromagnetic coupling. The container thus has an electromagnetic coupling module that includes a radio IC chip that is resistant to a shock applied from the outside and an environmental change, realizes an easy arrangement of a radiator and the electromagnetic coupling module, provides a preferable radiation characteristic, and is suitably used in an RFID system.

摘要翻译： 容器包括在容器主体的内表面上的电磁耦合模块和在容器主体的外表面上由金属材料制成的散热器。 电磁耦合模块包括馈电电路板，其上安装有无线电IC芯片，并且其中提供包括具有预定谐振频率并包括电感元件的谐振电路的馈电电路。 电磁耦合模块和散热器优选通过电磁耦合传输和接收高频信号。 因此，容器具有电磁耦合模块，其包括耐受来自外部施加的冲击和环境变化的无线IC芯片，实现散热器和电磁耦合模块的容易布置，提供优选的辐射特性，并且是 适用于RFID系统。

公开(公告)号：US07656677B2

公开(公告)日：2010-02-02

申请号：US10554671

申请日：2005-01-05

申请人： Nobuaki Ogawa ,  Norio Sakai

发明人： Nobuaki Ogawa ,  Norio Sakai

IPC分类号： H05K7/00

CPC分类号： H01L23/5384 ,  H01L23/5383 ,  H01L23/5389 ,  H01L2224/16225 ,  H01L2924/09701 ,  H01L2924/15192 ,  H01L2924/1531 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/19105 ,  H01L2924/19106

摘要： A multilayer electronic component includes a multilayer substrate having a first main surface and a second main surface, a resin layer having a mounting surface and a contact surface bonded to the first main surface, a via conductor provided inside the resin layer, and an external terminal electrode disposed on the mounting surface so as to come in contact with the via conductor. The external terminal electrode has a first region on a main surface facing the mounting surface and a second region on a main surface facing away from the mounting surface. The first region is connected to the via conductor while the second region is provided with a bonding member. The second region is arranged such that, when the first region is projected through to the main surface facing away from the mounting surface, the second region is spaced from and does not overlap with a region in which the first region is projected.

摘要翻译： 多层电子部件包括具有第一主表面和第二主表面的多层基板，具有安装表面和与第一主表面接合的接触表面的树脂层，设置在树脂层内部的通孔导体和外部端子 电极，其设置在安装表面上以与通孔导体接触。 外部端子电极在主表面上具有面向安装表面的第一区域和在远离安装表面的主表面上的第二区域。 第一区域连接到通孔导体，而第二区域设置有接合构件。 第二区域布置成使得当第一区域突出到远离安装表面的主表面时，第二区域与第一区域投影的区域间隔开并且不与第一区域突出的区域重叠。

公开(公告)号：US07649252B2

公开(公告)日：2010-01-19

申请号：US10549986

申请日：2004-10-15

申请人： Norio Sakai ,  Jun Harada ,  Satoshi Ishino ,  Yoshihiko Nishizawa

发明人： Norio Sakai ,  Jun Harada ,  Satoshi Ishino ,  Yoshihiko Nishizawa

IPC分类号： H01L23/12 ,  H01L23/06

CPC分类号： H05K1/186 ,  H01L23/5385 ,  H01L25/165 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01078 ,  H01L2924/09701 ,  H01L2924/19105 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/0306 ,  H05K1/113 ,  H05K1/162 ,  H05K3/4605 ,  H05K2201/0154 ,  H05K2201/09436 ,  H05K2203/1581 ,  H01L2224/0401

摘要： A ceramic multilayer substrate has a ceramic laminate including a plurality of ceramic layers laminated, having a first main surface, and including internal circuit elements disposed in the inside, a resin layer having a bonding surface in contact with the first main surface of the ceramic laminate and a mounting surface opposite to the bonding surface, external electrodes, each disposed on the mounting surface of the resin layer and electrically connected to at least one of the internal circuit elements of the ceramic laminate, and a ground electrode, a dummy electrode, or capacitor electrodes disposed at an interface between the first main surface of the ceramic laminate and the bonding surface of the resin layer or in the inside of the resin layer.

摘要翻译： 陶瓷多层基板具有包括多个陶瓷层的陶瓷层叠体，具有第一主表面，并且包括设置在内部的内部电路元件，具有与陶瓷层叠体的第一主表面接触的接合面的树脂层 和与接合面相反的安装面，外部电极，各自设置在树脂层的安装面上，与陶瓷层叠体的至少一个内部电路元件电连接，接地电极，虚拟电极或 设置在陶瓷层叠体的第一主面与树脂层的接合面或树脂层内侧的界面处的电容电极。

公开(公告)号：US07446262B2

公开(公告)日：2008-11-04

申请号：US10549005

申请日：2005-01-06

申请人： Nobuaki Ogawa ,  Norio Sakai ,  Yoshihiko Nishizawa

发明人： Nobuaki Ogawa ,  Norio Sakai ,  Yoshihiko Nishizawa

IPC分类号： H05K1/03

CPC分类号： H01L23/49833 ,  H01L21/4857 ,  H01L23/13 ,  H01L24/97 ,  H01L2224/16225 ,  H01L2224/97 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/19106 ,  H01L2924/30107 ,  H05K1/0306 ,  H05K3/284 ,  Y10T428/24488 ,  Y10T428/24612 ,  Y10T428/24777 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2924/00012

摘要： A laminated electronic component includes a ceramic substrate having a first groove provided on a principal surface thereof and extending to the side surfaces, and a resin sheet. The resin sheet includes a thermosetting resin in a semi-cured state and is compression bonded on the principal surface of the ceramic substrate so as to cover the first groove. The resin sheet is then cured by heating. Thus, a combined laminate is produced. When the resin sheet is compression bonded, air trapped in the interface with the ceramic substrate is discharged outside through the first groove. The combined laminate is divided into separate pieces along the first groove. An outer terminal electrode is formed on the outer surface of a resin layer of the resultant separate piece.

摘要翻译： 层叠电子部件包括具有设置在其主表面上并延伸到侧表面的第一凹槽的陶瓷基板和树脂片。 树脂片包括半固化状态的热固性树脂，并且被压接在陶瓷基片的主表面上以覆盖第一凹槽。 然后通过加热固化树脂片。 因此，制造组合的层压体。 当树脂片被压接时，捕获在与陶瓷衬底的界面中的空气通过第一凹槽被排出到外部。 组合的层压板沿着第一凹槽被分成多个分开的部件。 外部端子电极形成在所得分离片的树脂层的外表面上。

公开(公告)号：US20070026196A1

公开(公告)日：2007-02-01

申请号：US10549005

申请日：2005-01-06

申请人： Nobuaki Ogawa ,  Norio Sakai ,  Yoshihiko Nishizawa

发明人： Nobuaki Ogawa ,  Norio Sakai ,  Yoshihiko Nishizawa

IPC分类号： B32B3/02

CPC分类号： H01L23/49833 ,  H01L21/4857 ,  H01L23/13 ,  H01L24/97 ,  H01L2224/16225 ,  H01L2224/97 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/19106 ,  H01L2924/30107 ,  H05K1/0306 ,  H05K3/284 ,  Y10T428/24488 ,  Y10T428/24612 ,  Y10T428/24777 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2924/00012

摘要： A laminated electronic component includes a ceramic substrate having a first groove provided on a principal surface thereof and extending to the side surfaces, and a resin sheet. The resin sheet includes a thermosetting resin in a semi-cured state and is compression bonded on the principal surface of the ceramic substrate so as to cover the first groove. The resin sheet is then cured by heating. Thus, a combined laminate is produced. When the resin sheet is compression bonded, air trapped in the interface with the ceramic substrate is discharged outside through the first groove. The combined laminate is divided into separate pieces along the first groove. An outer terminal electrode is formed on the outer surface of a resin layer of the resultant separate piece.

摘要翻译： 层叠电子部件包括具有设置在其主表面上并延伸到侧表面的第一凹槽的陶瓷基板和树脂片。 树脂片包括半固化状态的热固性树脂，并且被压接在陶瓷基片的主表面上以覆盖第一凹槽。 然后通过加热固化树脂片。 因此，制造组合的层压体。 当树脂片被压接时，捕获在与陶瓷衬底的界面中的空气通过第一凹槽被排出到外部。 组合的层压板沿着第一凹槽被分成多个分开的部件。 外部端子电极形成在所得分离片的树脂层的外表面上。

公开(公告)号：US06860006B2

公开(公告)日：2005-03-01

申请号：US10242424

申请日：2002-09-13

申请人： Norio Sakai ,  Isao Kato ,  Kazuhiro Isebo

发明人： Norio Sakai ,  Isao Kato ,  Kazuhiro Isebo

IPC分类号： H05K3/46 ,  H01L23/12 ,  H01L23/498 ,  H05K1/03 ,  H05K1/11 ,  H05K3/40 ,  H01K3/10

CPC分类号： H01L23/49822 ,  H01L23/49838 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/73204 ,  H01L2224/85399 ,  H01L2924/0102 ,  H01L2924/01046 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15174 ,  H01L2924/15192 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19106 ,  H05K1/0306 ,  H05K1/113 ,  H05K3/4053 ,  H05K3/4611 ,  H05K3/4629 ,  Y10T29/43 ,  Y10T29/435 ,  Y10T29/49126 ,  Y10T29/49163 ,  Y10T29/49165 ,  Y10T428/24917 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/00012

摘要： A monolithic electronic component includes a composite body having a plurality of stacked ceramic layers. The ceramic layers include interconnecting conductors provided in each of the ceramic layers, including first terminals, arranged on a first end surface in the stacking direction of the composite body, for defining connections with an interconnection substrate, and second terminals, arranged on a second end surface opposite of the first end surface of the composite, for defining connections with a mounted component. The first terminals are defined by conductor layers provided on the first end surface and the second terminals are defined by exposed end surfaces of terminal via-hole conductors which extend from the inner portion of the composite to the second end surface. The exposed end surfaces of the terminal via-hole conductors are flat and are on substantially the same plane as the second end surface.

摘要翻译： 单片电子部件包括具有多个层叠陶瓷层的复合体。 陶瓷层包括设置在每个陶瓷层中的互连导体，包括第一端子，其布置在复合体的层叠方向上的第一端面上，用于限定与互连衬底的连接，以及布置在第二端上的第二端子 与复合材料的第一端面相对的表面，用于限定与安装部件的连接。 第一端子由设置在第一端面上的导体层限定，第二端子由从复合体的内部延伸到第二端面的端子通孔导体的暴露的端面限定。 端子通孔导体的露出端面是平坦的，并且与第二端面基本上在同一平面上。