公开(公告)号：US07353598B2

公开(公告)日：2008-04-08

申请号：US11268837

申请日：2005-11-07

申请人： Gordon S. W. Craig ,  Ali A. Tootoonchi ,  Randolph W. Eisenhardt ,  Scott Herrmann ,  Mark A. Hadley ,  Paul S. Drzaic

发明人： Gordon S. W. Craig ,  Ali A. Tootoonchi ,  Randolph W. Eisenhardt ,  Scott Herrmann ,  Mark A. Hadley ,  Paul S. Drzaic

IPC分类号： H05K3/32

CPC分类号： G06K19/07752 ,  G06K19/07749 ,  H01L23/49855 ,  H01L24/19 ,  H01L24/24 ,  H01L24/82 ,  H01L24/95 ,  H01L24/97 ,  H01L25/50 ,  H01L29/0657 ,  H01L2223/6677 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/16 ,  H01L2224/20 ,  H01L2224/24101 ,  H01L2224/24227 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/76155 ,  H01L2224/82102 ,  H01L2224/95085 ,  H01L2224/95122 ,  H01L2224/95136 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/10155 ,  H01L2924/10158 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15155 ,  H01L2924/15157 ,  H01L2924/15165 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30105 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49155 ,  H01L2224/82

摘要： Methods and apparatuses for an electronic assembly. A material is selectively printed on a web substrate at one or more selected areas. The web substrate includes a plurality of functional components having integrated circuits. A local printing system equipped with a print head that dispenses the selected material is used to print. The print head is coupled to a guidance system capable of registering an alignment feature on the web substrate.

摘要翻译： 电子组件的方法和装置。 在一个或多个选定区域上将材料选择性地印刷在网状基材上。 网状基板包括具有集成电路的多个功能部件。 使用配备有分配所选材料的打印头的本地打印系统进行打印。 打印头连接到能够在纸幅基材上记录对准特征的引导系统。

公开(公告)号：US07253735B2

公开(公告)日：2007-08-07

申请号：US10807775

申请日：2004-03-23

申请人： Glenn W. Gengel ,  Mark A. Hadley ,  Tom Pounds ,  Kenneth D. Schatz ,  Paul S. Drzaic

发明人： Glenn W. Gengel ,  Mark A. Hadley ,  Tom Pounds ,  Kenneth D. Schatz ,  Paul S. Drzaic

IPC分类号： G08B13/14

CPC分类号： G06K19/07749 ,  D10B2401/18 ,  G06K19/027 ,  G06K19/07722 ,  G06K19/07758 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/24227 ,  H01L2224/76155 ,  H01L2224/82039 ,  H01L2224/82102 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/3011 ,  Y10T29/49018 ,  Y10T29/49155 ,  H01L2924/00

摘要： A Radio Frequency Identification (RFID) tag. The RFID tag comprises a flexible substrate and an integrated circuit embedded within the flexible substrate. The top surface of the integrated circuit is coplanar with the flexible substrate. At least one conductive element is formed on the flexible substrate. The conductive element is electrically connected to the integrated circuit. The conductive element serves as an antenna for the RFID tag.

摘要翻译： 射频识别（RFID）标签。 RFID标签包括柔性基板和嵌入柔性基板内的集成电路。 集成电路的顶表面与柔性基板共面。 在柔性基板上形成至少一个导电元件。 导电元件电连接到集成电路。 导电元件用作RFID​​标签的天线。

公开(公告)号：US07214569B2

公开(公告)日：2007-05-08

申请号：US10769572

申请日：2004-01-30

申请人： Susan Swindlehurst ,  Mark A. Hadley ,  Paul S. Drzaic ,  Gordon S. W. Craig ,  Glenn Gengel ,  Scott Hermann ,  Aly Tootoochi ,  Randolph W. Eisenhardt

发明人： Susan Swindlehurst ,  Mark A. Hadley ,  Paul S. Drzaic ,  Gordon S. W. Craig ,  Glenn Gengel ,  Scott Hermann ,  Aly Tootoochi ,  Randolph W. Eisenhardt

IPC分类号： H01L21/00 ,  H01L21/44

CPC分类号： G06K19/07752 ,  G06K19/077 ,  H01L23/49855 ,  H01L23/5389 ,  H01L24/13 ,  H01L24/19 ,  H01L24/24 ,  H01L24/29 ,  H01L24/81 ,  H01L24/82 ,  H01L24/83 ,  H01L24/90 ,  H01L24/95 ,  H01L24/97 ,  H01L29/0657 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/13019 ,  H01L2224/13099 ,  H01L2224/1319 ,  H01L2224/13499 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/24011 ,  H01L2224/2402 ,  H01L2224/24137 ,  H01L2224/24225 ,  H01L2224/24227 ,  H01L2224/29101 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/29339 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/76155 ,  H01L2224/81201 ,  H01L2224/81205 ,  H01L2224/81207 ,  H01L2224/81224 ,  H01L2224/81801 ,  H01L2224/81898 ,  H01L2224/81903 ,  H01L2224/82102 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2224/83865 ,  H01L2224/83868 ,  H01L2224/83871 ,  H01L2224/83874 ,  H01L2224/95085 ,  H01L2224/95136 ,  H01L2224/97 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01055 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/10158 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15155 ,  H01L2924/15165 ,  H01L2924/3011 ,  H01L2224/82 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2924/00012 ,  H01L2224/05599

摘要： An apparatus incorporating small-feature size and large-feature-size components. The apparatus comprise a strap including a substrate with an integrated circuit contained therein. The integrated circuit coupling to a first conductor disposed on the substrate. The first conductor is made of a thermosetting or a thermoplastic material including conductive fillers. A large-scale component having a second conductor is electrically coupled to the first conductor to electrically couple the large-scale component to the integrated circuit. The large-scale component includes a second substrate.

摘要翻译： 包含小特征尺寸和大特征尺寸组件的装置。 该装置包括带状物，其带有包含集成电路的基板。 集成电路耦合到设置在基板上的第一导体。 第一导体由包括导电填料的热固性或热塑性材料制成。 具有第二导体的大规模部件电耦合到第一导体，以将大尺寸部件电耦合到集成电路。 大规模部件包括第二基板。

公开(公告)号：US06498114B1

公开(公告)日：2002-12-24

申请号：US09651710

申请日：2000-08-31

申请人： Karl Amundson ,  Paul S. Drzaic ,  Jianna Wang ,  Gregg Duthaler ,  Peter Kazlas

发明人： Karl Amundson ,  Paul S. Drzaic ,  Jianna Wang ,  Gregg Duthaler ,  Peter Kazlas

IPC分类号： H01L2131

CPC分类号： H01L51/0016 ,  B41J3/4076 ,  G02F1/1334 ,  G02F1/1345 ,  G02F1/1362 ,  H01L27/28 ,  H01L51/0002 ,  H01L51/0004 ,  H01L51/0014 ,  H01L51/0015 ,  H01L51/0019 ,  H01L51/0508 ,  H01L51/0512 ,  H01L51/0516 ,  H01L51/0541 ,  H01L51/0545

摘要： A process for forming a pattern in a semiconductor film is provided. The process comprises the steps of: providing a substrate; providing an organic semiconductor film adjacent the substrate; and providing a destructive agent adjacent selected portions of the organic semiconductor film, the destructive agent changing a property of selected portions of the organic semiconductor film substantially through the full thickness of the organic semiconductor film such that the property of the selected portions of the organic semiconductor film differs from the property of remaining portions of the organic semiconductor film. A method for manufacturing a transistor comprises the steps of: providing a substrate; providing a gate electrode adjacent the substrate; providing a gate dielectric adjacent the substrate and the gate electrode; providing a source electrode and a drain electrode adjacent the gate dielectric; providing a mask adjacent the gate dielectric in a pattern such that the source electrode, the drain electrode, and a portion of the gate dielectric remain exposed; and providing a semiconductor layer comprising one of an organic semiconductor and a plurality of inorganic colloidal particles, adjacent the source electrode, the drain electrode, the portion of the gate dielectric and the mask, thereby forming the transistor, the semiconductor layer having a thickness less than a thickness of the mask.

摘要翻译： 提供了一种在半导体膜中形成图案的工艺。 该方法包括以下步骤：提供衬底; 提供邻近所述衬底的有机半导体膜; 并且在所述有机半导体膜的选定部分附近提供破坏性试剂，所述破坏剂基本上改变所述有机半导体膜的全部厚度以改变所述有机半导体膜的选定部分的性质，使得所述有机半导体膜的选定部分的性质 膜与有机半导体膜的剩余部分的性质不同。 一种制造晶体管的方法，包括以下步骤：提供衬底; 在所述衬底附近提供栅电极; 在所述衬底和所述栅极附近提供栅极电介质; 提供邻近栅极电介质的源电极和漏电极; 以图案提供与栅极电介质相邻的掩模，使得源电极，漏电极和栅电介质的一部分保持暴露; 并且提供包括有机半导体和多个无机胶体粒子之一的半导体层，与源电极，漏电极，栅极电介质的部分和掩模相邻，从而形成晶体管，半导体层的厚度较小 比掩模的厚度。

公开(公告)号：US5484552A

公开(公告)日：1996-01-16

申请号：US416555

申请日：1995-04-04

申请人： Mark F. Wartenberg ,  Harriette Atkins ,  Robert H. Reamey ,  Laurence Welsh ,  James Strain ,  Janusz Wojtowicz ,  Wayne Montoya ,  Paul S. Drzaic ,  John Havens ,  Akira Tomita ,  Aldrich N. K. Lau

发明人： Mark F. Wartenberg ,  Harriette Atkins ,  Robert H. Reamey ,  Laurence Welsh ,  James Strain ,  Janusz Wojtowicz ,  Wayne Montoya ,  Paul S. Drzaic ,  John Havens ,  Akira Tomita ,  Aldrich N. K. Lau

IPC分类号： G02F1/1334 ,  C09K19/02 ,  C09K19/54 ,  C09K19/58 ,  G02F1/1333 ,  G02F1/137 ,  G02F1/13

CPC分类号： C09K19/544 ,  C09K19/54 ,  C09K19/58 ,  G02F1/1334

摘要： A liquid crystal display is made from an encapsulated liquid crystal structure comprising a liquid crystal composition dispersed in a containment medium. Selected additives may be added to the encapsulated liquid crystal structure to improve performance characteristics such as the operating field, the hysteresis, and the voltage holding ratio.