公开(公告)号：US20050146847A1

公开(公告)日：2005-07-07

申请号：US11073576

申请日：2005-03-08

申请人： Yasushi Hara ,  Hideki Tanaka ,  Hideyuki Motoyama ,  Hiroshi Yamada

发明人： Yasushi Hara ,  Hideki Tanaka ,  Hideyuki Motoyama ,  Hiroshi Yamada

IPC分类号： B60R11/00 ,  B60R11/02 ,  G06F1/16

CPC分类号： G06F1/1622 ,  B60R11/0252 ,  B60R2011/0075 ,  G06F1/1616 ,  G06F1/1632 ,  Y10T307/305

摘要： An information processing apparatus (100) includes a main unit (110) including a keyboard and having a generally rectangular major surface, and includes a display device (130) including a display screen and having a generally rectangular major surface. A bottom of the major surface of the display device can be selectively placed in a first position in which the bottom extends substantially along a first side of the major surface of the main unit, and a second position in which the bottom extends substantially along a second side of the major surface of the main unit that is substantially perpendicular to the first side. The information processing apparatus (100) further comprises power supply and information communications connectors in the main unit on a third side of the major surface of the main unit that is opposite and substantially parallel to the second side. The connector is connectable through another connector on a car docking station.

摘要翻译： 一种信息处理装置（100），包括具有大致矩形主表面的键盘的主单元（110），并且包括显示装置（130），显示屏幕具有大致矩形的主表面。 显示装置的主表面的底部可以选择性地放置在第一位置，其中底部基本上沿着主单元的主表面的第一侧延伸，并且第二位置，底部基本上沿第二位置延伸 主单元的主表面的大致垂直于第一侧的侧面。 信息处理设备（100）还包括在主单元的主表面的与第二侧相对并基本平行的第三侧的主单元中的电源和信息通信连接器。 连接器可通过汽车对接站上的另一个连接器连接。

公开(公告)号：US20050143952A1

公开(公告)日：2005-06-30

申请号：US11003829

申请日：2004-12-06

申请人： Masayuki Tomoyasu ,  Hin Oh ,  Hideki Tanaka

发明人： Masayuki Tomoyasu ,  Hin Oh ,  Hideki Tanaka

IPC分类号： H01J37/32 ,  G06F101/14

CPC分类号： H01J37/32935

摘要： According to the present invention, multivariate analysis model expressions are generated for a plasma processing apparatus 100A and a plasma processing apparatus 100B by executing a multivariate analysis of detection data provided by a plurality of sensors included in each plasma processing apparatus when the plasma processing apparatuses 100A and 100B operate based upon first setting data. Then, when the plasma processing apparatus 100A operates based upon new second setting data, detection data provided by the plurality of sensors in the plasma processing apparatus 100A are used to generate a corresponding multivariate analysis model expression, and by using the new multivariate analysis model expression corresponding to the plasma processing apparatus 100A generated based upon the second setting data and to the plasma processing apparatus 100B, a multivariate analysis model expression corresponding to the new second setting data is generated four the plasma processing apparatus 100B.

摘要翻译： 根据本发明，对等离子体处理装置100A和等离子体处理装置100B，通过对等离子体处理装置中包含的多个传感器所提供的检测数据进行多元分析，生成多变量分析模型表达式 设备100A和100​​B基于第一设置数据进行操作。 然后，当等离子体处理装置100A基于新的第二设定数据进行动作时，使用等离子体处理装置100A中的多个传感器提供的检测数据来生成相应的多变量分析模型表达式，并且通过使用新的多变量分析 对应于基于第二设定数据生成的等离子体处理装置100A的模型表达式和等离子体处理装置100B，生成与新的第二设定数据对应的多变量分析模型表达式四等离子体处理装置100B。

公开(公告)号：US20050128684A1

公开(公告)日：2005-06-16

申请号：US10990556

申请日：2004-11-18

申请人： Yousuke Miyaki ,  Kazuo Katai ,  Hideki Tanaka ,  Kiyonori Hinoki

发明人： Yousuke Miyaki ,  Kazuo Katai ,  Hideki Tanaka ,  Kiyonori Hinoki

IPC分类号： H01G4/005 ,  H01G9/00 ,  H01G9/04 ,  H01G11/22 ,  H01G11/24 ,  H01G11/26 ,  H01G11/38 ,  H01G11/42 ,  H01G11/68 ,  H01G11/86 ,  H01G13/00 ,  H01M4/02 ,  C23C14/00

CPC分类号： H01G9/155 ,  H01G11/48 ,  H01G11/56 ,  Y02E60/13 ,  Y10T29/417

摘要： The present invention is an electrode for an electrochemical capacitor provided with a collector having electronic conductivity and a porous body layer having electronic conductivity, the porous body layer containing porous particles having electronic conductivity and a binder which is able to bind the porous particles with one another, wherein the content of the porous particles in the porous body layer is in a range from 88 to 92% by mass on the basis of the total amount of the porous body layer, and the porous body layer has an apparent density in a range from 0.62 to 0.70 g/cm3.

摘要翻译： 本发明是一种电化学电容器用电极，其具有具有电子导电性的集电体和具有电子导电性的多孔体层，多孔体层含有具有电子导电性的多孔粒子和能够将多孔粒子彼此结合的粘合剂 其特征在于，多孔体层的多孔质粒的含量相对于多孔体层的总量为88〜92质量％，多孔体层的表观密度为 0.62至0.70g / cm 3。

公开(公告)号：US20050095418A1

公开(公告)日：2005-05-05

申请号：US10698585

申请日：2003-10-31

申请人： Toshio Nakano ,  Hideki Tanaka ,  Yoshikatsu Michimasa ,  Asanori Yoshida ,  Kazuhiro Kamon ,  Sadayuki Nishimiya

发明人： Toshio Nakano ,  Hideki Tanaka ,  Yoshikatsu Michimasa ,  Asanori Yoshida ,  Kazuhiro Kamon ,  Sadayuki Nishimiya

IPC分类号： C08J5/18 ,  B32B5/22 ,  C08L23/04 ,  C08L23/06 ,  C08L71/02 ,  C09K3/16

CPC分类号： C08J5/18 ,  C08J2323/06 ,  C08L23/06 ,  C08L71/02 ,  C08L2201/04 ,  C09K3/16 ,  Y10T428/249986 ,  C08L2666/22

摘要： To provide an antistatic film, an antistatic foam sheet or an antistatic bubble sheet which has favorable physical properties, such as a continued antistatic effect and a high strength, and which causes little contamination of rollers or other devices when the sheet is formed. The antistatic film according to the present invention is characterized in that it is made of a polyethylene-based resin composition containing a polyethylene-based resin and a high-polymer-type, polyether-based antistatic agent. Furthermore, the antistatic foam sheet and the bubble sheet according to the present invention are characterized in that they are made of a polyolefin-based resin composition containing a polyolefin-based resin and a high-polymer-type antistatic agent.

摘要翻译： 为了提供抗静电膜，抗静电泡沫片或抗静电泡沫片，其具有良好的物理性能，例如持续的抗静电效果和高强度，并且当形成片材时，几乎不会导致辊或其它装置的污染。 根据本发明的抗静电膜的特征在于它由含有聚乙烯类树脂和高分子型聚醚类抗静电剂的聚乙烯类树脂组合物制成。 此外，根据本发明的抗静电泡沫片材和泡沫片材的特征在于它们由含有聚烯烃类树脂和高分子型抗静电剂的聚烯烃类树脂组合物制成。

公开(公告)号：US20050017962A1

公开(公告)日：2005-01-27

申请号：US10893232

申请日：2004-07-19

申请人： Kazuaki Sakata ,  Yoshichika Sato ,  Tsutomu Tokunaga ,  Hideki Tanaka ,  Hideto Nakamura

发明人： Kazuaki Sakata ,  Yoshichika Sato ,  Tsutomu Tokunaga ,  Hideki Tanaka ,  Hideto Nakamura

IPC分类号： H04N5/66 ,  G09G3/20 ,  G09G3/28 ,  G09G3/288 ,  G09G3/291 ,  G09G3/292 ,  G09G3/294 ,  G09G3/298 ,  G09G5/00

CPC分类号： G09G3/2029 ,  G09G3/2935 ,  G09G3/2937 ,  G09G3/2965 ,  G09G2310/066

摘要： An apparatus for driving a display panel can execute quality image display. To allow discharge cells operating as pixels of the display panel to repeatedly perform sustain discharge, a fall period of a last sustain pulse of sustain pulses repeatedly applied to row electrodes includes a first voltage drop period in which a voltage value gently drops, a voltage constant period which follows the first voltage drop period and in which the voltage value remains constant for a predetermined period, and a second voltage drop period which follows the voltage constant period and in which the voltage value drops more gently than in the first voltage drop period.

摘要翻译： 用于驱动显示面板的装置可以执行质量图像显示。 为了使作为显示面板的像素工作的放电单元反复进行维持放电，重复施加到行电极的维持脉冲的最后维持脉冲的下降周期包括其中电压值轻微下降的第一电压下降周期，电压常数 在第一电压下降周期之后，电压值保持恒定一段时间，以及在电压恒定周期之后的第二电压下降周期，并且其中电压值比第一电压下降期间更缓慢地下降。

公开(公告)号：US06784533B2

公开(公告)日：2004-08-31

申请号：US10212104

申请日：2002-08-06

申请人： Hiroya Shimizu ,  Asao Nishimura ,  Tosiho Miyamoto ,  Hideki Tanaka ,  Hideo Miura

发明人： Hiroya Shimizu ,  Asao Nishimura ,  Tosiho Miyamoto ,  Hideki Tanaka ,  Hideo Miura

IPC分类号： H01L2352

CPC分类号： H01L24/10 ,  H01L23/50 ,  H01L23/5286 ,  H01L23/552 ,  H01L23/645 ,  H01L23/66 ,  H01L24/13 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05022 ,  H01L2224/05024 ,  H01L2224/05569 ,  H01L2224/05571 ,  H01L2224/05572 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor device is provided which is highly reliable and operable at fast speed and low noises. In this semiconductor device, there are provided a power wiring section 1003a, a ground wiring section 1003b and a signal wiring section 1003c are formed on one level. The power wiring section or the ground wiring section is formed adjacently on both sides of at least one part of the signal wiring section.

摘要翻译： 提供了一种高度可靠并且以高速度和低噪声操作的半导体器件。 在该半导体装置中，在一个层上形成有电力配线部1003a，接地配线部1003b以及信号配线部1003c。 功率配线部或接地配线部形成在信号配线部的至少一部分的两侧上。

公开(公告)号：US06723181B2

公开(公告)日：2004-04-20

申请号：US10120727

申请日：2002-04-11

申请人： Hanji Ishikawa ,  Masato Otsuka ,  Satoshi Suzuki ,  Hideki Tanaka ,  Junichi Katsuki ,  Takashi Yamauchi ,  Naoto Hiramatsu

发明人： Hanji Ishikawa ,  Masato Otsuka ,  Satoshi Suzuki ,  Hideki Tanaka ,  Junichi Katsuki ,  Takashi Yamauchi ,  Naoto Hiramatsu

IPC分类号： C22C3842

CPC分类号： C22C38/004 ,  C21D8/04 ,  C21D8/0405 ,  C21D8/0463 ,  C21D8/0473 ,  C22C38/001 ,  C22C38/42 ,  C22C38/44 ,  C22C38/58

摘要： A new soft stainless steel sheet has an austenite-stability index Md30 controlled in a range of −120 to −10 and a stacking fault formability index SFI controlled not less than 30, and involves precipitates whose Cu concentration is controlled not more than 1.0%, so as to maintain concentration of dissolved Cu at 1-5%. The stainless steel sheet preferably contains up to 0.06%(C+N), up to 2.0% Si, up to 5% Mn, 15-20% Cr, 5-9% Ni, 1.0-4.0% Cu, up to 0.003% Al, up to 0.005% S, and optionally one or more of up to 0.5% Ti, up to 0.5% Nb, up to 0.5% Zr, up to 0.5% V, up to 3.0% Mo, up to 0.03% B, up to 0.02% REM (rare earth metals) and up to 0.03% Ca. The stainless steel sheet can be plastically deformed to an objective shape without any cracks even at a part heavily-worked part by multi-stage deep drawing or compression deforming. Md30(° C.)=551−462(C+N)−9.2Si−8.1Mn−29(Ni+Cu)−13.7Cr−18.5Mo SFI(mJ/m2)=2.2Ni+6Cu−1.1Cr−13Si−1.2Mn+32.

摘要翻译： 新的软质不锈钢板的奥氏体稳定性指数Md30控制在-120〜-10的范围内，堆积层错性成形性指数SFI控制在30以上，并且将Cu浓度控制在1.0％以下的析出物， 以使溶解的Cu的浓度保持在1-5％。 不锈钢板优选含有高达0.06％（C + N），至多2.0％Si，至多5％Mn，15-20％Cr，5-9％Ni，1.0-4.0％Cu，至多0.003％ Al，至多0.005％的S，以及任选的一种或多种至多0.5％的Ti，至多0.5％的Nb，至多0.5％的Zr，至多0.5％的V，至多3.0％的Mo，至多0.03％的B， 高达0.02％的REM（稀土金属）和高达0.03％的Ca。 不锈钢板可以通过多级深冲压或压缩变形而塑造变形为客观形状，也不会在部分重型加工部分产生任何裂缝。

公开(公告)号：US06521981B2

公开(公告)日：2003-02-18

申请号：US09765376

申请日：2001-01-22

申请人： Chuichi Miyazaki ,  Yukiharu Akiyama ,  Masanori Shibamoto ,  Tomoaki Kudaishi ,  Ichiro Anjoh ,  Kunihiko Nishi ,  Asao Nishimura ,  Hideki Tanaka ,  Ryosuke Kimoto ,  Kunihiro Tsubosaki ,  Akio Hasebe

发明人： Chuichi Miyazaki ,  Yukiharu Akiyama ,  Masanori Shibamoto ,  Tomoaki Kudaishi ,  Ichiro Anjoh ,  Kunihiko Nishi ,  Asao Nishimura ,  Hideki Tanaka ,  Ryosuke Kimoto ,  Kunihiro Tsubosaki ,  Akio Hasebe

IPC分类号： H01L23498

CPC分类号： H01L23/49816 ,  H01L23/49827 ,  H01L23/4985 ,  H01L24/06 ,  H01L24/45 ,  H01L24/48 ,  H01L24/50 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/06136 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48465 ,  H01L2224/48472 ,  H01L2224/50 ,  H01L2224/73215 ,  H01L2224/85951 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  Y10T29/4913 ,  Y10T29/49169 ,  H01L2924/20753 ,  H01L2224/05599

摘要： A ball grid array type semiconductor package includes a semiconductor chip formed with bonding pads, an elastomer bonded to the semiconductor chip, a flexible wiring substrate bonded to the elastomer and formed with wirings connected at one end of the bonding pads of the semiconductor chip, a solder resist formed on the main surface of the flexible wiring substrate and solder bump electrodes connected to the other ends of the wirings. The elastomer is bonded to the flexible wiring substrate on the side of the tape, the solder resist is formed on the side of the wirings, and the solder bump electrodes are connected with the wirings by way of through holes formed in the solder resist.

公开(公告)号：US06342728B2

公开(公告)日：2002-01-29

申请号：US09760733

申请日：2001-01-17

申请人： Chuichi Miyazaki ,  Yukiharu Akiyama ,  Masanori Shibamoto ,  Tomoaki Kudaishi ,  Ichiro Anjoh ,  Kunihiko Nishi ,  Asao Nishimura ,  Hideki Tanaka ,  Ryosuke Kimoto ,  Kunihiro Tsubosaki ,  Akio Hasebe

发明人： Chuichi Miyazaki ,  Yukiharu Akiyama ,  Masanori Shibamoto ,  Tomoaki Kudaishi ,  Ichiro Anjoh ,  Kunihiko Nishi ,  Asao Nishimura ,  Hideki Tanaka ,  Ryosuke Kimoto ,  Kunihiro Tsubosaki ,  Akio Hasebe

IPC分类号： H01L23495

CPC分类号： H01L23/49816 ,  H01L23/49827 ,  H01L23/4985 ,  H01L24/06 ,  H01L24/45 ,  H01L24/48 ,  H01L24/50 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/06136 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48465 ,  H01L2224/48472 ,  H01L2224/50 ,  H01L2224/73215 ,  H01L2224/85951 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  Y10T29/4913 ,  Y10T29/49169 ,  H01L2924/20753 ,  H01L2224/05599

摘要： A ball grid array type semiconductor package includes a semiconductor chip formed with bonding pads, an elastomer bonded to the semiconductor chip, a flexible wiring substrate bonded to the elastomer and formed with wirings connected at one end of the bonding pads of the semiconductor chip, a solder resist formed on the main surface of the flexible wiring substrate and solder bump electrodes connected to the other ends of the wirings. The elastomer is bonded to the flexible wiring substrate on the side of the tape, the solder resist is formed on the side of the wirings, and the solder bump electrodes are connected with the wirings by way of through holes formed in the solder resist.

摘要翻译： 球栅阵列型半导体封装包括形成有接合焊盘的半导体芯片，接合到半导体芯片的弹性体，与弹性体接合并形成有连接在半导体芯片的接合焊盘的一端的布线的柔性布线基板， 在柔性布线基板的主表面上形成的阻焊剂和连接到布线的另一端的焊料凸块电极。 弹性体在带的一侧粘接到柔性布线基板上，在布线侧形成阻焊剂，并且焊料凸块电极通过形成在阻焊剂中的通孔与布线连接。

公开(公告)号：US06330045B1

公开(公告)日：2001-12-11

申请号：US09503951

申请日：2000-02-14

申请人： Hideki Tanaka

发明人： Hideki Tanaka

IPC分类号： G02F11333

CPC分类号： G02F1/133385

摘要： In a liquid-crystal display device comprising a liquid-crystal display panel, a light source provided in proximity to the liquid-crystal display panel for illuminating the liquid-crystal display panel, a transformer of the light source provided in proximity to the liquid-crystal display panel, and an enclosure for housing the liquid-crystal display panel, the light source and the transformer, a gasket is provided between the liquid-crystal display panel and the enclosure for controlling a thermal gradient of the liquid-crystal display panel.

摘要翻译： 在包括液晶显示面板的液晶显示装置中，设置在用于照亮液晶显示面板的液晶显示面板附近的光源，设置在液晶显示面板附近的光源的变压器， 水晶显示面板和用于容纳液晶显示面板，光源和变压器的外壳，在液晶显示面板和外壳之间设置有用于控制液晶显示面板的热梯度的垫圈。