公开(公告)号：US20080313576A1

公开(公告)日：2008-12-18

申请号：US11860530

申请日：2007-09-24

Applicant: Lex Kosowsky ,  Robert Fleming

Inventor： Lex Kosowsky ,  Robert Fleming

IPC: G06F17/50 ,  G06F19/00

CPC classification number: G06F17/5068 ,  H05K1/0254 ,  H05K1/0259 ,  H05K1/0293 ,  H05K1/0373 ,  H05K3/0005 ,  H05K2201/0738 ,  H05K2203/105

Abstract: A substrate device is designed by identifying one or more criteria for handling of a transient electrical event on the substrate device. The one or more criteria may be based at least in part on an input provided from a designer. From the one or more criteria, one or more characteristics may be determined for integrating VSD material as a layer within or on at least a portion of the substrate device. The layer of VSD material may be positioned to protect one or more components of the substrate from the transient electrical condition

Abstract translation: 通过识别用于处理衬底装置上的瞬态电事件的一个或多个标准来设计衬底装置。 该一个或多个标准可以至少部分地基于从设计者提供的输入。 根据一个或多个标准，可以确定一个或多个特性，用于将VSD材料整合为衬底装置的至少一部分内或之上的层。 可以将VSD材料层定位成保护衬底的一个或多个部件免受瞬态电气条件的影响

公开(公告)号：US09320135B2

公开(公告)日：2016-04-19

申请号：US13035791

申请日：2011-02-25

Applicant: Lex Kosowsky ,  Robert Fleming ,  Bhret Graydon ,  Daniel Vasquez

Inventor： Lex Kosowsky ,  Robert Fleming ,  Bhret Graydon ,  Daniel Vasquez

IPC: H05K1/18 ,  H05K1/02

CPC classification number: H05K1/0254 ,  H05K1/0259 ,  H05K1/181 ,  H05K2201/0738 ,  H05K2203/304

Abstract: Printed circuit boards including voltage switchable dielectric materials (VSDM) are disclosed. The VSDMs are used to protect electronic components, arranged on or embedded in printed circuit boards, against electric discharges, such as electrostatic discharges or electric overstresses. During an overvoltage event, a VSDM layer shunts excess currents to ground, thereby preventing electronic components from destruction or damage.

Abstract translation: 公开了包括可切换电介质材料（VSDM）的印刷电路板。 VSDM用于保护布置在印刷电路板上或嵌入印刷电路板中的电子部件，以防止放电，例如静电放电或电动过载。 在过电压事件期间，VSDM层将多余的电流分流到地，从而防止电子部件破坏或损坏。

公开(公告)号：US09144151B2

公开(公告)日：2015-09-22

申请号：US12284790

申请日：2008-09-24

Applicant: Lex Kosowsky

Inventor： Lex Kosowsky

IPC: H05K1/03 ,  H05K1/09 ,  H05K1/02 ,  C25D5/54 ,  H05K3/18 ,  H05K1/16 ,  H05K3/42

CPC classification number: H05K1/0254 ,  C25D5/54 ,  H05K1/0373 ,  H05K1/167 ,  H05K3/188 ,  H05K3/423 ,  H05K3/426 ,  H05K2201/0215 ,  H05K2201/0738 ,  H05K2203/105 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155

Abstract: A method comprises providing a voltage switchable dielectric material having a characteristic voltage, exposing the voltage switchable dielectric material to a source of ions associated with an electrically conductive material, and creating a voltage difference between the source and the voltage switchable dielectric material that is greater than the characteristic voltage. Electrical current is allowed to flow from the voltage switchable dielectric material, and the electrically conductive material is deposited on the voltage switchable dielectric material. A body comprises a voltage switchable dielectric material and a conductive material deposited on the voltage switchable dielectric material using an electrochemical process. In some cases, the conductive material is deposited using electroplating.

Abstract translation: 一种方法包括提供具有特征电压的电压可切换电介质材料，将电压可切换电介质材料暴露于与导电材料相关的离子源，并且产生电源和可切换电介质材料之间的电压差大于 特征电压。 允许电流从电压可切换介电材料流出，并且导电材料沉积在可开关电介质材料上。 身体包括电​​压可​​切换电介质材料和使用电化学过程沉积在可开关电介质材料上的导电材料。 在一些情况下，使用电镀沉积导电材料。

公开(公告)号：US08399773B2

公开(公告)日：2013-03-19

申请号：US12694702

申请日：2010-01-27

Applicant: Lex Kosowsky ,  Bhret Graydon ,  Djabbar Moustafaev ,  Shurui Shang ,  Robert Fleming

Inventor： Lex Kosowsky ,  Bhret Graydon ,  Djabbar Moustafaev ,  Shurui Shang ,  Robert Fleming

IPC: H05K9/00 ,  G06F17/50 ,  B05D5/12 ,  H05K1/11

CPC classification number: H05K1/0259 ,  H05K1/0271 ,  H05K1/036 ,  H05K1/0373 ,  H05K3/0005 ,  H05K2201/068 ,  H05K2201/0738 ,  H05K2201/09136 ,  Y10T428/24917 ,  Y10T428/24942

Abstract: Various aspects provide for incorporating a VSDM into a substrate to create an ESD-protected substrate. In some cases, a VSDM is incorporated in a manner that results in the ESD-protected substrate meeting one or more specifications (e.g., thickness, planarity, and the like) for various subsequent processes or applications. Various aspects provide for designing a substrate (e.g., a PCB) incorporating a VSDM, and adjusting one or more aspects of the substrate to design a balanced, ESD-protected substrate. Certain embodiments include molding a substrate having a VSDM layer into a first shape.

公开(公告)号：US08310064B2

公开(公告)日：2012-11-13

申请号：US13034450

申请日：2011-02-24

Applicant: Lex Kosowsky

Inventor： Lex Kosowsky

IPC: H01L23/48

CPC classification number: H01L23/60 ,  H01L21/563 ,  H01L23/3128 ,  H01L23/62 ,  H01L24/11 ,  H01L24/13 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/94 ,  H01L2224/1132 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/274 ,  H01L2224/32013 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/81801 ,  H01L2224/83102 ,  H01L2224/8592 ,  H01L2224/92125 ,  H01L2924/0001 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15183 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: Semiconductor devices are provided that employ voltage switchable materials for over-voltage protection. In various implementations, the voltage switchable materials are substituted for conventional die attach adhesives, underfill layers, and encapsulants. While the voltage switchable material normally functions as a dielectric material, during an over-voltage event the voltage switchable material becomes electrically conductive and can conduct electricity to ground. Accordingly, the voltage switchable material is in contact with a path to ground such as a grounded trace on a substrate, or a grounded solder ball in a flip-chip package.

Abstract translation: 提供了使用用于过电压保护的可切换电压材料的半导体器件。 在各种实施方案中，电压可切换材料代替常规的芯片附着粘合剂，底部填充层和密封剂。 虽然电压可切换材料通常用作介电材料，但是在过电压事件期间，电压可切换材料变得导电并且可以将电传导到地面。 因此，电压可切换材料与衬底上的接地迹线或倒装芯片封装中的接地焊球接地。

公开(公告)号：US20120212904A1

公开(公告)日：2012-08-23

申请号：US13358506

申请日：2012-01-25

Applicant: Robert Fleming ,  Lex Kosowsky ,  Junjun Wu

Inventor： Robert Fleming ,  Lex Kosowsky ,  Junjun Wu

IPC: H05K1/03

CPC classification number: H01B1/18 ,  H01C7/1006 ,  H01L27/0288 ,  H05K1/0259 ,  H05K1/036 ,  H05K1/0373 ,  H05K1/0393 ,  H05K1/167 ,  H05K2201/0738

Abstract: Embodiments described herein provide for flexible circuits and flexible substrates comprising VSD material that has superior characteristics for its use as an integral structural component of a device.

Abstract translation: 本文描述的实施例提供了柔性电路和包括VSD材料的柔性基底，其具有优异的特性，用作其作为装置的整体结构部件。

公开(公告)号：US20120200963A1

公开(公告)日：2012-08-09

申请号：US13291090

申请日：2011-11-07

Applicant: Daniel Vasquez ,  Lex Kosowsky

Inventor： Daniel Vasquez ,  Lex Kosowsky

IPC: H02H9/04 ,  G06F17/50

CPC classification number: G06F17/5068 ,  H05K1/0259 ,  H05K1/0293 ,  H05K1/0373 ,  H05K3/0005 ,  H05K2201/0738 ,  H05K2203/105

Abstract: Embodiments described herein provide for programmatic design or simulation of substrates carrying electrical elements to integrate voltage switchable dielectric (“VSD”) material as a protective feature. In particular, VSD material may be incorporated into the design of a substrate device for purpose of providing protection against transient electrical conditions, such as electrostatic discharge (ESD).

Abstract translation: 本文描述的实施例提供了用于编程设计或模拟承载电气元件的基板以将可切换电压（“VSD”）材料集成为保护特征。 特别地，可以将VSD材料并入衬底装置的设计中，以便提供对诸如静电放电（ESD）等瞬态电气条件的保护。

公开(公告)号：US20120119168A9

公开(公告)日：2012-05-17

申请号：US12407346

申请日：2009-03-19

Applicant: Robert Fleming ,  Lex Kosowsky ,  Ning Shi ,  Junjun Wu

Inventor： Robert Fleming ,  Lex Kosowsky ,  Ning Shi ,  Junjun Wu

IPC: H01B1/24 ,  H01B1/20 ,  C08L63/00

CPC classification number: H01B1/22 ,  H01L23/60 ,  H01L27/0248 ,  H01L27/101 ,  H01L2924/0002 ,  H01L2924/12044 ,  H01L2924/00

Abstract: A composition is provided that includes a polymer binder, and one or more classes of particle constituents. At least one class of particle constituents includes semiconductive particles that individually have a band gap that is no greater than 2 eV. As VSD material, the composition is (i) dielectric in absence of a voltage that exceeds a characteristic voltage level, and (ii) conductive with application of said voltage that exceeds the characteristic voltage level.

Abstract translation: 提供了包括聚合物粘合剂和一种或多种类型的颗粒成分的组合物。 至少一类颗粒成分包括单独具有不大于2eV的带隙的半导体颗粒。 作为VSD材料，组成是（i）不存在超过特征电压电平的电压的介质，和（ii）施加超过特征电压电平的所述电压导电。

公开(公告)号：US20110211319A1

公开(公告)日：2011-09-01

申请号：US13035791

申请日：2011-02-25

Applicant: Lex Kosowsky ,  Robert Fleming ,  Bhret Graydon ,  Daniel Vasquez

Inventor： Lex Kosowsky ,  Robert Fleming ,  Bhret Graydon ,  Daniel Vasquez

IPC: H05K1/18

CPC classification number: H05K1/0254 ,  H05K1/0259 ,  H05K1/181 ,  H05K2201/0738 ,  H05K2203/304

Abstract: Printed circuit boards including voltage switchable dielectric materials (VSDM) are disclosed. The VSDMs are used to protect electronic components, arranged on or embedded in printed circuit boards, against electric discharges, such as electrostatic discharges or electric overstresses. During an overvoltage event, a VSDM layer shunts excess currents to ground, thereby preventing electronic components from destruction or damage.

Abstract translation: 公开了包括可切换电介质材料（VSDM）的印刷电路板。 VSDM用于保护布置在印刷电路板上或嵌入印刷电路板中的电子部件，以防止放电，例如静电放电或电动过载。 在过电压事件期间，VSDM层将多余的电流分流到地，从而防止电子部件破坏或损坏。

公开(公告)号：US20110132645A1

公开(公告)日：2011-06-09

申请号：US12954605

申请日：2010-11-24

Applicant: Ning Shi ,  Robert Fleming ,  Junjun Wu ,  Lex Kosowsky

Inventor： Ning Shi ,  Robert Fleming ,  Junjun Wu ,  Lex Kosowsky

IPC: H05K1/09 ,  C01G9/02 ,  C01G29/00 ,  C01G41/02 ,  C01B19/04 ,  B32B15/04 ,  H01C17/06

CPC classification number: H01C7/105 ,  C01G9/02 ,  C01G29/00 ,  C01G41/02 ,  C01P2006/40 ,  H01C7/10 ,  H01C7/112 ,  H01C17/06 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2224/73265 ,  H05K1/0257 ,  H05K1/0259 ,  H05K2201/0738 ,  Y10T29/49099 ,  Y10T428/31678 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Embodiments described include a non-polymeric voltage switchable dielectric (VSD) material comprising substantially of a grain structure formed from only a single compound, processes for making same, and applications for using such non-polymeric VSD materials.

Abstract translation: 所描述的实施例包括基本上由仅由单一化合物形成的晶粒结构，其制备方法和使用这种非聚合物VSD材料的应用的非聚合物电压可切换电介质（VSD）材料。