Guard aperture to control ion angular distribution in plasma processing
    51.
    发明授权
    Guard aperture to control ion angular distribution in plasma processing 有权
    保护孔径来控制等离子体处理中的离子角分布

    公开(公告)号:US09514918B2

    公开(公告)日:2016-12-06

    申请号:US14502794

    申请日:2014-09-30

    IPC分类号: C23C16/50 H01J37/32 C23C16/04

    摘要: A guard aperture is described to control the ion angular distribution in plasma processing in one example a workpiece processing system has a plasma chamber, a plasma source to generate a plasma containing gas ions in the plasma chamber, the plasma forming a sheath above the workpiece, the sheath having an electric field, a workpiece holder in the chamber to apply a bias voltage to the workpiece to attract ions across the plasma sheath to be incident on the workpiece, a control aperture between the sheath and the workpiece, the aperture being positioned to modify an angular distribution of the ions that are incident on the workpiece, and a guard aperture between the sheath and the control aperture to isolate an electrical field of the control aperture from the plasma sheath.

    摘要翻译: 在一个示例中描述了保护孔以控制等离子体处理中的离子角分布,工件处理系统具有等离子体室,等离子体源,以产生在等离子体室中包含气体离子的等离子体,等离子体在工件上形成鞘, 所述护套具有电场,所述腔室中的工件保持器用于向所述工件施加偏置电压以将离子穿过所述等离子体护套以入射到所述工件上,所述护套和所述工件之间的控制孔,所述孔定位成 修改入射在工件上的离子的角度分布,以及护套和控制孔之间的保护孔,以将控制孔的电场与等离子体鞘隔开。

    METHOD AND SYSTEM FOR ION-ASSISTED PROCESSING
    53.
    发明申请
    METHOD AND SYSTEM FOR ION-ASSISTED PROCESSING 有权
    离子辅助加工方法与系统

    公开(公告)号:US20140038393A1

    公开(公告)日:2014-02-06

    申请号:US13563056

    申请日:2012-07-31

    摘要: A method of processing a substrate includes performing a first exposure that comprises generating a plasma containing reactive gas ions in a plasma chamber and generating a bias voltage between the substrate and the plasma chamber. The method also includes providing a plasma sheath modifier having an aperture disposed between the plasma and substrate and operable to direct the reactive gas ions toward the substrate, and establishing a pressure differential between the plasma chamber and substrate region while the reactive gas ions are directed onto the substrate.

    摘要翻译: 一种处理衬底的方法包括执行第一曝光,其包括在等离子体室中产生含有反应气体离子的等离子体,并在衬底和等离子体室之间产生偏置电压。 该方法还包括提供等离子体护套改性剂,其具有设置在等离子体和衬底之间的孔,并可操作以将反应性气体离子引向衬底,并且在反应性气体离子被引导到等离子体室和衬底区域之间建立压力差 底物。

    ANISOTROPIC SURFACE ENERGY MODULATION BY ION IMPLANTATION
    54.
    发明申请
    ANISOTROPIC SURFACE ENERGY MODULATION BY ION IMPLANTATION 审中-公开
    通过离子植入进行的各向异性表面能量调节

    公开(公告)号:US20140037858A1

    公开(公告)日:2014-02-06

    申请号:US13563046

    申请日:2012-07-31

    IPC分类号: C23C14/48

    摘要: Methods of modulating a material's surface energies through the implantation of ions, such as by using a plasma processing apparatus with a plasma sheath modifier, are disclosed. Two or more ion implants may be performed, where the implant regions of two of the ion implants overlap. The species implanted by a first implant may increase the hydrophobicity of the surface, wherein the species implanted by the second implant may decrease the hydrophobicity of the surface. In this way, a workpiece can be implanted such that different portions of its surface have different surface energies.

    摘要翻译: 公开了通过离子注入来调制材料的表面能的方法,例如通过使用具有等离子体护套改性剂的等离子体处理装置。 可以执行两个或更多个离子植入物,其中两个离子植入物的植入区域重叠。 通过第一植入植入的物种可以增加表面的疏水性,其中由第二植入物植入的物种可以降低表面的疏水性。 以这种方式,可以植入工件,使得其表面的不同部分具有不同的表面能。

    N-type doping of zinc telluride
    55.
    发明授权
    N-type doping of zinc telluride 失效
    碲化锌的N型掺杂

    公开(公告)号:US08288255B2

    公开(公告)日:2012-10-16

    申请号:US13364415

    申请日:2012-02-02

    IPC分类号: H01L21/265 H01L21/425

    摘要: ZnTe is implanted with a first species selected from Group III and a second species selected from Group VII. This may be preformed using sequential implants, implants of the first species and second species that are at least partially simultaneous, or a molecular species comprising an atom selected from Group III and an atom selected from Group VII. The implants may be performed at an elevated temperature in one instance between 70° C. and 800° C.

    摘要翻译: ZnTe植入选自III族的第一种和选自第VII组的第二种。 这可以使用顺序植入物,第一物质的植入物和至少部分同时的第二物质,或包含选自III族的原子和选自VII族的原子的分子物质来进行。 植入物可以在70℃和800℃之间的一个高温下进行。

    HYDROPHOBIC PROPERTY ALTERATION USING ION IMPLANTATION
    57.
    发明申请
    HYDROPHOBIC PROPERTY ALTERATION USING ION IMPLANTATION 审中-公开
    使用离子植入进行疏水性改造

    公开(公告)号:US20120137971A1

    公开(公告)日:2012-06-07

    申请号:US12973057

    申请日:2010-12-20

    摘要: A template used for printing is implanted to change the properties of the materials it is composed of. This template may have multiple surfaces that define indentations. The ion species that is implanted may be C, N, H, F, He, Ar, B, As, P, Ge, Ga, Si, Zn, and Al and is configured to render the implanted regions hydrophobic in one instance. This will reduce adhesion of a polymer to the template during a printing process. The implant may be at a plurality of angles so all surfaces of the template are implanted. In other instances, a film on the surface of the template is knocked in or hardened using the ion species.

    摘要翻译: 植入用于印刷的模板以改变其所组成的材料的性质。 此模板可能有多个表面定义缩进。 注入的离子种类可以是C,N,H,F,He,Ar,B,As,P,Ge,Ga,Si,Zn和Al, 这将在印刷过程中降低聚合物对模板的粘附性。 植入物可以是多个角度,因此植入模板的所有表面。 在其他情况下,使用离子种类将模板表面上的膜敲入或硬化。

    Workpiece patterning with plasma sheath modulation
    58.
    发明授权
    Workpiece patterning with plasma sheath modulation 有权
    工件图案化等离子体鞘调制

    公开(公告)号:US08187979B2

    公开(公告)日:2012-05-29

    申请号:US12646407

    申请日:2009-12-23

    IPC分类号: H01L31/18

    摘要: Methods to texture or fabricate workpieces are disclosed. The workpiece may be, for example, a solar cell. This texturing may involve etching or localized sputtering using a plasma where a shape of a boundary between the plasma and the plasma sheath is modified with an insulating modifier. The workpiece may be rotated in between etching or sputtering steps to form pyramids. Regions of the workpiece also may be etched or sputtered with ions formed from a plasma adjusted by an insulating modifier and doped. A metal layer may be formed on these doped regions.

    摘要翻译: 公开了纹理或制造工件的方法。 工件可以是例如太阳能电池。 这种纹理化可能包括使用等离子体进行蚀刻或局部溅射,其中等离子体和等离子体护套之间的边界的形状用绝缘改性剂改性。 可以在蚀刻或溅射步骤之间旋转工件以形成金字塔。 工件的区域也可以用由通过绝缘改性剂调节的等离子体形成的离子进行蚀刻或溅射并掺杂。 可以在这些掺杂区域上形成金属层。

    METHOD AND SYSTEM FOR MODIFYING PHOTORESIST USING ELECTROMAGNETIC RADIATION AND ION IMPLANTATION
    59.
    发明申请
    METHOD AND SYSTEM FOR MODIFYING PHOTORESIST USING ELECTROMAGNETIC RADIATION AND ION IMPLANTATION 有权
    使用电磁辐射和离子植入修饰光电子的方法和系统

    公开(公告)号:US20120082942A1

    公开(公告)日:2012-04-05

    申请号:US12896036

    申请日:2010-10-01

    IPC分类号: G03F7/20

    摘要: A method of reducing surface roughness of a resist feature disposed on a substrate includes generating a plasma having a plasma sheath and ions therein. A shape of the boundary between the plasma and plasma sheath is modified using a plasma sheath modifier, so that a portion of the boundary facing the substrate is not parallel to a plane defined by the substrate. During a first exposure, the resist feature is exposed to electromagnetic radiation having a desired wavelength and the ions are accelerated across the boundary having the modified shape toward the resist features over an angular range.

    摘要翻译: 减少设置在基板上的抗蚀剂特征的表面粗糙度的方法包括产生具有等离子体鞘和其中的离子的等离子体。 使用等离子体护套改性剂改变等离子体和等离子体护套之间的边界的形状,使得面对衬底的边界的一部分不平行于由衬底限定的平面。 在第一曝光期间,抗蚀剂特征暴露于具有所需波长的电磁辐射,并且离子在角度范围内被加速跨过具有改变形状的边界朝向抗蚀剂特征。

    METHOD FOR PATTERNING A SUBSTRATE USING ION ASSISTED SELECTIVE DEPOSITION
    60.
    发明申请
    METHOD FOR PATTERNING A SUBSTRATE USING ION ASSISTED SELECTIVE DEPOSITION 有权
    使用离子辅助选择性沉积方式绘制基板的方法

    公开(公告)号:US20110259408A1

    公开(公告)日:2011-10-27

    申请号:US13091289

    申请日:2011-04-21

    摘要: A method of patterning a substrate includes providing a focusing plate adjacent to a plasma chamber containing a plasma, the focusing plate configured to extract ions from the plasma through at least one aperture that provides focused ions towards the substrate. The method further includes directing first ions through the at least one aperture to one or more first regions of the substrate so as to condense first gaseous species provided in ambient of the substrate on the one or more first regions of the substrate.

    摘要翻译: 图案化衬底的方法包括提供邻近包含等离子体的等离子体室的聚焦板,该聚焦板被配置为通过至少一个孔向等离子体提取离子,所述孔向衬底提供聚焦离子。 该方法还包括将第一离子引导通过至少一个孔到基底的一个或多个第一区域,以便在衬底的一个或多个第一区域上冷凝在衬底环境中提供的第一气态物质。