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147 条记录 (耗时 0.032 秒)

    Packaged light emitting devices
    54.
    发明授权
    Packaged light emitting devices 有权
    封装发光器件

    公开(公告)号：US08154043B2

    公开(公告)日：2012-04-10

    申请号：US13080968

    申请日：2011-04-06

    申请人： Peter Andrews ,  Thomas G. Coleman ,  James Ibbetson ,  Michael Leung ,  Gerald H. Negley ,  Eric Tarsa

    发明人： Peter Andrews ,  Thomas G. Coleman ,  James Ibbetson ,  Michael Leung ,  Gerald H. Negley ,  Eric Tarsa

    IPC分类号： H01L33/50 ,  H01L33/60 ,  H01L33/58

    CPC分类号： H01L33/58 ,  H01L33/52 ,  H01L33/60 ,  H01L2924/181 ,  H01L2924/00012

    摘要： Packaged semiconductor light emitting device are provided including a reflector having a lower sidewall portion defining a reflective cavity. A light emitting device is positioned in the reflective cavity. A first quantity of cured encapsulant material having a first index of refraction is provided in the reflective cavity including the light emitting device. A second quantity of cured encapsulant material having a second index of refraction, different from the first index of refraction, is provided on the first quantity of cured encapsulant material. The first and second index of refraction are selected to provide a buried lens in the reflective cavity.

    摘要翻译： 包装半导体发光器件包括具有限定反射腔的下侧壁部分的反射器。 发光器件位于反射腔中。 具有第一折射率的第一量固化的密封剂材料设置在包括发光器件的反射腔中。 在第一量的固化的密封剂材料上提供第二量的具有与第一折射率不同的第二折射率的固化的密封剂材料。 选择第一和第二折射率以在反射腔中提供掩埋透镜。

    Packaged Light Emitting Devices
    55.
    发明申请
    Packaged Light Emitting Devices 有权
    封装发光装置

    公开(公告)号：US20110180834A1

    公开(公告)日：2011-07-28

    申请号：US13080968

    申请日：2011-04-06

    申请人： Peter Andrews ,  Thomas G. Coleman ,  James Ibbetson ,  Michael Leung ,  Gerald H. Negley ,  Eric Tarsa

    发明人： Peter Andrews ,  Thomas G. Coleman ,  James Ibbetson ,  Michael Leung ,  Gerald H. Negley ,  Eric Tarsa

    IPC分类号： H01L33/50 ,  H01L33/60 ,  H01L33/58

    CPC分类号： H01L33/58 ,  H01L33/52 ,  H01L33/60 ,  H01L2924/181 ,  H01L2924/00012

    摘要： Packaged semiconductor light emitting device are provided including a reflector having a lower sidewall portion defining a reflective cavity. A light emitting device is positioned in the reflective cavity. A first quantity of cured encapsulant material having a first index of refraction is provided in the reflective cavity including the light emitting device. A second quantity of cured encapsulant material having a second index of refraction, different from the first index of refraction, is provided on the first quantity of cured encapsulant material. The first and second index of refraction are selected to provide a buried lens in the reflective cavity.

    摘要翻译： 包装半导体发光器件包括具有限定反射腔的下侧壁部分的反射器。 发光器件位于反射腔中。 具有第一折射率的第一量固化的密封剂材料设置在包括发光器件的反射腔中。 在第一量的固化的密封剂材料上提供第二量的具有与第一折射率不同的第二折射率的固化的密封剂材料。 选择第一和第二折射率以在反射腔中提供掩埋透镜。

    Packaged light emitting devices
    57.
    发明授权
    Packaged light emitting devices 有权
    封装发光器件

    公开(公告)号：US07928456B2

    公开(公告)日：2011-04-19

    申请号：US11849530

    申请日：2007-09-04

    申请人： Peter Andrews ,  Thomas G. Coleman ,  James Ibbetson ,  Michael Leung ,  Gerald H. Negley ,  Eric Tarsa

    发明人： Peter Andrews ,  Thomas G. Coleman ,  James Ibbetson ,  Michael Leung ,  Gerald H. Negley ,  Eric Tarsa

    IPC分类号： H01L33/00

    CPC分类号： H01L33/58 ,  H01L33/52 ,  H01L33/60 ,  H01L2924/181 ,  H01L2924/00012

    摘要： Packaged semiconductor light emitting device are provided including a reflector having a lower sidewall portion defining a reflective cavity. A light emitting device is positioned in the reflective cavity. A first quantity of cured encapsulant material having a first index of refraction is provided in the reflective cavity including the light emitting device. A second quantity of cured encapsulant material having a second index of refraction, different from the first index of refraction, is provided on the first quantity of cured encapsulant material. The first and second index of refraction are selected to provide a buried lens in the reflective cavity.

    摘要翻译： 包装半导体发光器件包括具有限定反射腔的下侧壁部分的反射器。 发光器件位于反射腔中。 具有第一折射率的第一量固化的密封剂材料设置在包括发光器件的反射腔中。 在第一量的固化的密封剂材料上提供第二量的具有与第一折射率不同的第二折射率的固化的密封剂材料。 选择第一和第二折射率以在反射腔中提供掩埋透镜。

    MOLDED CHIP FABRICATION METHOD AND APPARATUS
    58.
    发明申请
    MOLDED CHIP FABRICATION METHOD AND APPARATUS 审中-公开
    模制芯片制造方法和装置

    公开(公告)号：US20090278156A1

    公开(公告)日：2009-11-12

    申请号：US12506989

    申请日：2009-07-21

    申请人： MICHAEL S. LEUNG ,  Eric J. Tarsa ,  James Ibbetson

    发明人： MICHAEL S. LEUNG ,  Eric J. Tarsa ,  James Ibbetson

    IPC分类号： H01L33/00

    CPC分类号： H01L33/504 ,  H01L21/565 ,  H01L24/96 ,  H01L27/15 ,  H01L33/50 ,  H01L2224/2518 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2933/0041 ,  H01L2924/00

    摘要： A light emitting diode (LED) is disclosed comprising a plurality of semiconductor layers with a first contact on the bottom surface of the semiconductor layers and a second contact on the top surface of the semiconductor layer. A coating is included that comprises a cured binder and a conversion material that at least partially covers the semiconductor layers, wherein the second contact extends through the coating and is exposed on the same plane as the top surface of the coating. An electrical signal applied to the first and second contacts is conducted through the coating to the semiconductor layers causing the LED to emit light. In other embodiments first and second contacts are accessible from one side of the LED. A coating is included that comprises a cured binder and a conversion material. The coating at least partially covers the semiconductor layers, with the first and second contacts extending through the coating and exposed on the same plane as a surface of the coating. An electrical signal applied to the first and second contacts is conducted through the coating to the semiconductor layers causing the LED to emit light.

    摘要翻译： 公开了一种发光二极管（LED），其包括在半导体层的底表面上具有第一接触的多个半导体层和在半导体层的顶表面上的第二接触。 包括涂层，其包括固化的粘合剂和至少部分地覆盖半导体层的转化材料，其中第二接触延伸穿过涂层并且暴露在与涂层的顶表面相同的平面上。 施加到第一和第二触点的电信号通过涂层传导到半导体层，导致LED发光。 在其他实施例中，第一和第二触点可从LED的一侧接近。 包括包含固化的粘合剂和转化材料的涂层。 涂层至少部分地覆盖半导体层，第一和第二触点延伸穿过涂层并暴露在与涂层的表面相同的平面上。 施加到第一和第二触点的电信号通过涂层传导到半导体层，导致LED发光。

    Flip-chip phosphor coating method and devices fabricated utilizing method
    59.
    发明申请
    Flip-chip phosphor coating method and devices fabricated utilizing method 有权
    倒装芯片荧光粉涂布方法和使用方法制造的器件

    公开(公告)号：US20090179207A1

    公开(公告)日：2009-07-16

    申请号：US12008477

    申请日：2008-01-11

    申请人： Ashay Chitnis ,  James Ibbetson ,  Bernd Keller

    发明人： Ashay Chitnis ,  James Ibbetson ,  Bernd Keller

    IPC分类号： H01L33/00

    CPC分类号： H01L33/44 ,  H01L27/15 ,  H01L33/08 ,  H01L33/10 ,  H01L33/502 ,  H01L33/505 ,  H01L33/62 ,  H01L33/64 ,  H01L2224/13 ,  H01L2933/0041 ,  H01L2933/0066

    摘要： Methods for fabricating light emitting diode (LED) chips one of which comprises flip-chip mounting a plurality of LEDs on a surface of a submount wafer and forming a coating over said LEDs. The coating comprising a conversion material at least partially covering the LEDs. The coating is planarized to the desired thickness with the coating being continuous and unobstructed on the top surface of the LEDs. The LEDs chips are then singulated from the submount wafer. An LED chip comprising a lateral geometry LED having first and second contacts, with the LED flip-chip mounted to a submount by a conductive bonding material. A phosphor loaded binder coats and at least partially covers the LED. The binder provides a substantially continuous and unobstructed coating over the LED. The phosphor within the coating absorbs and converts the wavelength of at least some of the LED light with the coating planarized to achieve the desired emission color point of the LED chip.

    摘要翻译： 制造发光二极管（LED）芯片的方法，其中之一包括倒装芯片，将多个LED安装在底座晶片的表面上并在所述LED上形成涂层。 所述涂层包含至少部分地覆盖所述LED的转化材料。 将涂层平坦化到所需的厚度，涂层在LED的顶表面上是连续的并且不受阻碍。 然后将LED芯片从底座晶片分离。 一种LED芯片，包括具有第一和第二触点的侧向几何形状LED，其中LED倒装芯片通过导电接合材料安装到基座。 荧光体负载的粘合剂涂层并且至少部分地覆盖LED。 粘合剂在LED上提供基本上连续且无障碍的涂层。 涂层内的荧光体吸收并转换至少一些LED光的波长，使涂层平坦化，以达到LED芯片的期望的发射色点。