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    LIGHT-EMITTING DEVICE PACKAGE
    51.
    发明申请
    LIGHT-EMITTING DEVICE PACKAGE 审中-公开
    发光装置包装

    公开(公告)号：US20130003344A1

    公开(公告)日：2013-01-03

    申请号：US13614144

    申请日：2012-09-13

    申请人： Chia-Liang Hsu

    发明人： Chia-Liang Hsu

    IPC分类号： H01L33/60 ,  G09F13/04

    CPC分类号： H01L25/0753 ,  G02B6/0025 ,  G02B6/0031 ,  G02B6/0073 ,  H01L33/48 ,  H01L33/486 ,  H01L33/507 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/00014

    摘要： A light-emitting diode device is disclosed. The light-emitting diode device includes a carrier including a platform; a transparent substrate formed on the platform including a first surface; a multi-LED structure including a first light-emitting structure formed on the first surface, the first light-emitting structure including a first first-type semiconductor layer, a first second-type semiconductor layer, and a first active layer formed between the first first-type semiconductor layer and the first second-type semiconductor layer; a second light-emitting structure formed on the first surface, the second light-emitting structure including a second first-type semiconductor layer, a second second-type semiconductor layer, and a second active layer formed between the second first-type semiconductor layer and the second second-type semiconductor layer; and a connecting layer formed between the first light-emitting structure and the second light-emitting structure; wherein an angle between the first surface of the transparent substrate and the platform is not equal to zero.

    摘要翻译： 公开了一种发光二极管器件。 发光二极管装置包括：载体，包括平台; 形成在所述平台上的透明基板，包括第一表面; 包括形成在第一表面上的第一发光结构的多LED结构，所述第一发光结构包括第一第一类型半导体层，第一第二类型半导体层和形成在第一表面之间的第一有源层 第一类型半导体层和第一第二类型半导体层; 第二发光结构，形成在第一表面上，第二发光结构包括第二第一类型半导体层，第二第二类型半导体层和形成在第二第一类型半导体层和第二有源层之间的第二有源层， 所述第二二次半导体层; 以及形成在所述第一发光结构和所述第二发光结构之间的连接层; 其中所述透明基板的第一表面和所述平台之间的角度不等于零。

    OPTOELECTRONIC DEVICE AND THE MANUFACTURING METHOD THEREOF
    52.
    发明申请
    OPTOELECTRONIC DEVICE AND THE MANUFACTURING METHOD THEREOF 有权
    光电器件及其制造方法

    公开(公告)号：US20120256164A1

    公开(公告)日：2012-10-11

    申请号：US13528059

    申请日：2012-06-20

    申请人： Shih-I Chen ,  Chia-Liang Hsu ,  Tzu-Chieh Hsu ,  Chun-Yi Wu ,  Chien-Fu Huang

    发明人： Shih-I Chen ,  Chia-Liang Hsu ,  Tzu-Chieh Hsu ,  Chun-Yi Wu ,  Chien-Fu Huang

    IPC分类号： H01L33/06

    CPC分类号： H01L33/46 ,  H01L33/22 ,  H01L33/42 ,  H01L33/44

    摘要： An optoelectronic device has a substrate and a first window layer on the substrate with a first sheet resistance, a first thickness, and a first impurity concentration. A second window layer has a second sheet resistance, a second thickness, and a second impurity concentration. A semiconductor system is between the first window layer and the second window layer. The second window layer has a semiconductor material different from the semiconductor system, and the second sheet resistance is greater than the first sheet resistance. A method for manufacturing is provided, having the steps of providing a substrate, forming a semiconductor system on the substrate, and forming a window layer on the semiconductor system. The window layer has a semiconductor material different from the semiconductor system. Selectively removing the window layer forms a width difference greater than 1 micron between the window layer and semiconductor system.

    摘要翻译： 光电器件具有衬底和衬底上的第一窗口层，具有第一薄层电阻，第一厚度和第一杂质浓度。 第二窗口层具有第二薄层电阻，第二厚度和第二杂质浓度。 半导体系统在第一窗口层和第二窗口层之间。 第二窗口层具有与半导体系统不同的半导体材料，第二薄层电阻大于第一薄层电阻。 提供一种制造方法，其具有以下步骤：提供衬底，在衬底上形成半导体系统，并在半导体系统上形成窗口层。 窗口层具有与半导体系统不同的半导体材料。 选择性地去除窗口层在窗口层和半导体系统之间形成大于1微米的宽度差。

    Single chip multicolor package
    53.
    发明授权
    Single chip multicolor package 有权
    单芯片多色封装

    公开(公告)号：US08217559B2

    公开(公告)日：2012-07-10

    申请号：US12628546

    申请日：2009-12-01

    申请人： Chia-Liang Hsu

    发明人： Chia-Liang Hsu

    IPC分类号： H05B33/02 ,  H05B33/04 ,  H05B33/14 ,  H05B33/22

    CPC分类号： H01L33/50 ,  H01L33/46 ,  H01L2224/48091 ,  H01L2224/8592 ,  H01L2924/00014

    摘要： An opto-electronic device package structure for multicolor light is disclosed. The package structure comprises a transparent carrier, a circuit layer on the transparent carrier, an opto-electronic device emitting the light of the first wavelength and is electrically connecting with the circuit layer on the transparent carrier, a first wavelength conversion structure on the lateral side of the opto-electronic device, a reflective layer on the first wavelength conversion structure, and a transparent material for package on the reflective layer and on the opto-electronic device.

    摘要翻译： 公开了一种用于多色光的光电器件封装结构。 封装结构包括透明载体，透明载体上的电路层，发射第一波长的光并与透明载体上的电路层电连接的光电器件，在侧面上的第一波长转换结构 的光电器件，第一波长转换结构上的反射层，以及用于在反射层和光电器件上封装的透明材料。

    LIGHT EMITTING STRUCTURE AND MANUFACTURING METHOD THEREOF
    56.
    发明申请
    LIGHT EMITTING STRUCTURE AND MANUFACTURING METHOD THEREOF 有权
    发光结构及其制造方法

    公开(公告)号：US20120056229A1

    公开(公告)日：2012-03-08

    申请号：US13227841

    申请日：2011-09-08

    申请人： Chia-Liang Hsu

    发明人： Chia-Liang Hsu

    IPC分类号： H01L33/58 ,  H01L33/50

    CPC分类号： H01L33/60 ,  H01L33/0079 ,  H01L33/38 ,  H01L33/486 ,  H01L33/507 ,  H01L33/54 ,  H01L33/58 ,  H01L33/62 ,  H01L2224/16 ,  H01L2933/0033 ,  H01L2933/0066

    摘要： A light-emitting structure comprises a semiconductor light-emitting element which includes a first connection point and a second connection point. The light-emitting structure further includes a first electrode electrically connected to the first connection point, and a second electrode electrically connected the second connection point. The first electrode and the second electrode can form a concave on which the semiconductor light-emitting element is located.

    摘要翻译： 发光结构包括包括第一连接点和第二连接点的半导体发光元件。 发光结构还包括电连接到第一连接点的第一电极和与第二连接点电连接的第二电极。 第一电极和第二电极可以形成半导体发光元件所在的凹部。

    Light-emitting device
    57.
    发明授权
    Light-emitting device 有权
    发光装置

    公开(公告)号：US07973331B2

    公开(公告)日：2011-07-05

    申请号：US12318552

    申请日：2008-12-31

    申请人： Chia-Liang Hsu ,  Chih-Chiang Lu ,  Chien-Fu Huang ,  Chun-Yi Wu

    发明人： Chia-Liang Hsu ,  Chih-Chiang Lu ,  Chien-Fu Huang ,  Chun-Yi Wu

    IPC分类号： H01L33/00

    CPC分类号： H01L33/385 ,  H01L24/24 ,  H01L24/82 ,  H01L33/20 ,  H01L33/32 ,  H01L33/486 ,  H01L33/62 ,  H01L2924/12041 ,  H01L2924/00

    摘要： The present invention is related to a light-emitting device. The present invention illustrates a vertical light-emitting device in one embodiment, comprising the following elements: a conductive substrate includes a through-hole, a patterned semiconductor structure disposed on a first surface of the substrate, a first bonding pad and a second bonding pad disposed on a second surface of the substrate, a conductive line passing through the through-hole connecting electrically the semiconductor structure layer, and an insulation layer on at least one sidewall of the through-hole insulates the conductive line form the substrate. The present invention illustrates a horizontal light-emitting device in another embodiment, comprising the following elements: a substrate includes a first tilted sidewall, a patterned semiconductor structure disposed on a first surface of the substrate, a first conductive line is disposed on at least the first tilted sidewall of the substrate and connecting electrically the patterned semiconductor structure.

    摘要翻译： 本发明涉及一种发光装置。 本发明示出了一个实施例中的垂直发光器件，其包括以下元件：导电衬底包括通孔，设置在衬底的第一表面上的图案化半导体结构，第一焊盘和第二焊盘 设置在所述基板的第二表面上，穿过所述半导体结构层电连接的所述通孔的导电线以及所述通孔的至少一个侧壁上的绝缘层将所述导线与所述基板绝缘。 本发明示出了另一实施例中的水平发光器件，其包括以下元件：衬底包括第一倾斜侧壁，设置在衬底的第一表面上的图案化半导体结构，第一导线设置在至少 基板的第一倾斜侧壁和电连接图案化的半导体结构。

    Light-emiting device package
    59.
    发明申请
    Light-emiting device package 有权
    发光装置封装

    公开(公告)号：US20090122521A1

    公开(公告)日：2009-05-14

    申请号：US12292161

    申请日：2008-11-13

    申请人： Chia-Liang Hsu

    发明人： Chia-Liang Hsu

    IPC分类号： G02F1/13357 ,  F21V21/00

    CPC分类号： G02B6/0073 ,  G02B6/0025 ,  G02B6/0031 ,  G02F1/1336 ,  H01L33/48 ,  H01L33/486 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/00014

    摘要： A light-emitting device package is disclosed and comprises at least one light-emitting device and a carrier. The light-emitting device includes a light-emitting diode chip attached to a first surface of a transparent substrate, wherein the chip comprises a first type conductivity semiconductor layer, an active layer and a second type conductivity semiconductor layer. The carrier comprises a p electrode, an n electrode, a platform and a reflective inside wall. The transparent substrate of the light-emitting device is attached to the platform by an adhering layer. In addition, an angle between the first surface of the transparent substrate and the platform is not equal to zero degree, and the better is about 90 degree.

    摘要翻译： 公开了一种发光器件封装，并且包括至少一个发光器件和载体。 发光装置包括附着到透明基板的第一表面的发光二极管芯片，其中芯片包括第一类型的导电半导体层，有源层和第二类型的导电半导体层。 载体包括p电极，n电极，平台和反射内壁。 发光装置的透明基板通过粘附层附着在平台上。 此外，透明基板的第一表面与平台之间的角度不等于零度，并且更好地为大约90度。