公开(公告)号：US4908696A

公开(公告)日：1990-03-13

申请号：US97124

申请日：1987-09-16

申请人： Shousaku Ishihara ,  Hitoshi Yokono ,  Tsuyoshi Fujita ,  Ryohei Satoh ,  Kiyotaka Wasai

发明人： Shousaku Ishihara ,  Hitoshi Yokono ,  Tsuyoshi Fujita ,  Ryohei Satoh ,  Kiyotaka Wasai

IPC分类号： H01L21/52 ,  H01L23/34 ,  H01L23/538 ,  H01R13/66 ,  H05K1/02 ,  H05K3/34

CPC分类号： H05K1/0212 ,  H01L23/345 ,  H01L23/5384 ,  H01L23/5385 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/01322 ,  H01L2924/15311 ,  H05K2201/10378 ,  H05K2201/10704 ,  H05K2201/10734 ,  H05K2203/1115 ,  H05K3/3436 ,  H05K3/3447 ,  H05K3/3494

摘要： The present invention relates to a connector structure for soldering a wiring substrate such as a ceramic wiring substrate to a connector provided on a printed board and also pertains to semiconductor device packages using the same. It is an object of the present invention to provide a connector structure which provides highly reliable electrical connection, together with semiconductor device package using the same. The object is attained by soldering a ceramic wiring substrate to a connector which involves a heater.

摘要翻译： 本发明涉及一种用于将诸如陶瓷布线基板的布线基板焊接到设置在印刷电路板上的连接器的连接器结构，并且还涉及使用该连接器结构的半导体器件封装。 本发明的目的是提供一种提供高可靠性电连接的连接器结构，以及使用其的半导体器件封装。 该目的是通过将陶瓷布线基板焊接到涉及加热器的连接器来实​​现的。

公开(公告)号：US4804559A

公开(公告)日：1989-02-14

申请号：US91457

申请日：1987-08-31

申请人： Jiro Ushio ,  Osamu Miyazawa ,  Hitoshi Yokono ,  Akira Tomizawa

发明人： Jiro Ushio ,  Osamu Miyazawa ,  Hitoshi Yokono ,  Akira Tomizawa

IPC分类号： C23C18/44 ,  C23C3/02

CPC分类号： C23C18/44 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/01047 ,  H01L2924/10253 ,  Y10T428/12396 ,  Y10T428/12528 ,  Y10T428/12611 ,  Y10T428/12826 ,  Y10T428/1284 ,  Y10T428/12889

摘要： An electroless gold plating solution comprising a thiosulfato gold(I) complex, a thiosulfate, thiourea, a pH regulator and a stabilizer. The electroless gold plating solution shows a plating rate and a plating solution stability comparable to those of conventional gold plating solutions containing cyanide ions, and requires a smaller amount of reducing agent to be used therein. Further, the electroless gold plating solution is safe because it does not contain cyanide ions.

摘要翻译： 包含硫代硫酸金（I）络合物，硫代硫酸盐，硫脲，pH调节剂和稳定剂的无电镀金溶液。 化学镀金液显示了与含有氰化物离子的常规金镀液相当的电镀速率和电镀液稳定性，并且需要更少量的还原剂用于其中。 此外，无电镀金液是不含氰化物离子的安全的。

公开(公告)号：US4736012A

公开(公告)日：1988-04-05

申请号：US625968

申请日：1984-06-29

申请人： Fusaji Shoji ,  Akihiro Kenmotsu ,  Isao Obara ,  Hitoshi Yokono ,  Takeshi Komaru

发明人： Fusaji Shoji ,  Akihiro Kenmotsu ,  Isao Obara ,  Hitoshi Yokono ,  Takeshi Komaru

IPC分类号： C08G73/00 ,  C08G73/10 ,  H01L23/06 ,  H01L23/29 ,  H01L23/31 ,  H01L23/556 ,  C08G69/26

CPC分类号： H01L23/3171 ,  H01L23/293 ,  H01L23/556 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/16152 ,  H01L2924/3025

摘要： A semiconductor device containing an .alpha.-rays shielding resin layer on at least active portion of a semiconductor element, said .alpha.-rays shielding resin being a special polyimide resin, is excellent in thermal resistance at the time of sealing the semiconductor element, adhesion of the .alpha.-rays shielding layer to the semiconductor element, and .alpha.-rays shielding ability.

摘要翻译： 一种在半导体元件的至少有效部分上含有α-阵列屏蔽树脂层的半导体器件，所述α-阵列屏蔽树脂是特殊的聚酰亚胺树脂，其密封半导体元件时的耐热性优异， 半导体元件的α-阵列屏蔽层和α射线屏蔽能力。

公开(公告)号：US4473662A

公开(公告)日：1984-09-25

申请号：US445580

申请日：1982-11-30

申请人： Yasuo Hira ,  Susumu Tsuzuku ,  Masao Gotoh ,  Hitoshi Yokono

发明人： Yasuo Hira ,  Susumu Tsuzuku ,  Masao Gotoh ,  Hitoshi Yokono

IPC分类号： C08G18/00 ,  C08G18/18 ,  C08G18/22 ,  B01J31/02 ,  B01J31/12

CPC分类号： C08G18/1883

摘要： In a composition for producing polyurethane foam which comprises an organic polyisocynate compound, a compound having at least one active hydrogen atom in the molecule, a foaming agent and a catalyst as essential components, an aminoalkylsilane represented by the following general formula is contained: ##STR1## wherein n is 1 or 2, and R.sub.1 to R.sub.5 are alkyl groups. By use of such a catalyst polyurethane foam having a even color distribution and excellent mechanical properties is produced.

摘要翻译： 在含有有机多异氰酸酯化合物，分子中具有至少一个活性氢原子的化合物，发泡剂和作为必须成分的催化剂的聚氨酯泡沫塑料用组合物中，含有以下通式表示的氨基烷基硅烷：其中n为1或2，R 1至R 5为烷基。 通过使用具有均匀颜色分布和优异的机械性能的这种催化剂聚氨酯泡沫。

公开(公告)号：US4444704A

公开(公告)日：1984-04-24

申请号：US340657

申请日：1982-01-19

申请人： Yasuo Hira ,  Susumu Tsuzuku ,  Masao Gotoh ,  Hitoshi Yokono ,  Reishi Naka

发明人： Yasuo Hira ,  Susumu Tsuzuku ,  Masao Gotoh ,  Hitoshi Yokono ,  Reishi Naka

IPC分类号： C08G18/20 ,  C08G18/50 ,  B29D27/00

CPC分类号： C08G18/20 ,  C08G18/5033 ,  C08G2101/0033 ,  C08G2120/00 ,  C08G2350/00

摘要： Integral skin polymethane foams can be produced in a short time by impingement mixing a solution comprising polyols containing as an essential component a polyol derived from aromatic amine, a blowing agent and a special catalyst of tertiary amine salt having a hetero ring in the molecule, with a solution comprising one or more polyisocyanates, followed by injection into a closed mold and foaming and curing therein.

摘要翻译： 整体皮肤多甲苯泡沫体可以在短时间内通过冲击混合包含作为必需组分的多元醇的溶液，衍生自芳族胺的多元醇，发泡剂和在分子中具有杂环的叔胺盐的特殊催化剂与 包含一种或多种多异氰酸酯的溶液，然后注入封闭的模具中并在其中发泡和固化。

公开(公告)号：US4387311A

公开(公告)日：1983-06-07

申请号：US247269

申请日：1981-03-25

申请人： Tsuguo Kobayashi ,  Tetsuo Ishikawa ,  Kenichi Hironaka ,  Hideo Umetsu ,  Masatsugu Ogata ,  Hitoshi Yokono

发明人： Tsuguo Kobayashi ,  Tetsuo Ishikawa ,  Kenichi Hironaka ,  Hideo Umetsu ,  Masatsugu Ogata ,  Hitoshi Yokono

IPC分类号： H02K3/30 ,  H02K3/44 ,  H02K5/08 ,  H02K1/04 ,  B32B27/36 ,  C08K7/14 ,  C08L67/06

CPC分类号： H02K5/08 ,  Y10S428/921 ,  Y10T428/31794

摘要： In a dynamoelectric machine having a stator assembly of coil windings and a core, a heat-dissipating, uninflammable, electro-insulative housing encapsulates the coil windings and the core. The housing is made of a cured molded article or material formed of a resin-filler composition which comprises a liquid unsaturated polyester resin, a finely divided calcium carbonate powder, an inorganic mineral particulate having a particle size larger than that of the calcium carbonate powder, a chopped glass fiber and an aluminum hydroxide powder, wherein the ratio by weight of the calcium carbonate to the mineral particulate is 0.3 to 4, the ratio of the weight of glass fiber to the total weight of the composition is 0.05 to 0.25, the ratio of the weight of the polyester resin to the total weight of the composition is 0.1 to 0.4, the weight ratio of the calcium carbonate powder, the mineral particulate and the glass fiber to the total weight of the composition is 0.15 to 0.80, and the weight ratio of the aluminum hydroxide powder to the total weight of the composition is 0.1 to 0.6.

摘要翻译： 在具有线圈绕组和铁心的定子组件的电动机中，散热不可燃的电绝缘壳体封装线圈绕组和芯。 壳体由固化的模制品或由树脂填料组合物形成的材料制成，该组合物包括液体不饱和聚酯树脂，细碎碳酸钙粉末，粒径大于碳酸钙粉末的无机矿物颗粒， 短切玻璃纤维和氢氧化铝粉末，其中碳酸钙与矿物颗粒的重量比为0.3〜4，玻璃纤维重量与组合物总重量的比例为0.05〜0.25，比例 聚酯树脂的重量相对于组合物的总重量为0.1〜0.4，碳酸钙粉末，矿物颗粒和玻璃纤维的重量比相对于组合物的总重量为0.15〜0.80，重量 氢氧化铝粉末与组合物总重量的比例为0.1〜0.6。

公开(公告)号：US4100118A

公开(公告)日：1978-07-11

申请号：US620760

申请日：1975-10-08

申请人： Shun-ichi Numata ,  Hitoshi Yokono ,  Junji Mukai

发明人： Shun-ichi Numata ,  Hitoshi Yokono ,  Junji Mukai

IPC分类号： C08G18/00 ,  C08G18/58 ,  C08G59/12 ,  C08G59/22 ,  C08G59/40 ,  C08G73/06

CPC分类号： C08G59/12 ,  C08G18/58 ,  C08G59/226 ,  C08G59/4028

摘要： A novel thermosetting resin composition consisting essentially of (a) one equivalent of a polyfunctional epoxy compound containing 10 to 80% by weight of a polyglycidyl ester of a fatty acid, (b) 1.5 to 5 equivalents of a polyfunctional isocyanate compound and (c) 0.01 to 10% by weight of a curing catalyst based on the total weight of the polyfunctional epoxy compound and the polyfunctional isocyanate compound. A cured product having excellent thermal resistance and excellent thermal shock resistance which is suitable for the molding of a large apparatus can be obtained by heating said thermosetting resin composition.

摘要翻译： 一种新型热固性树脂组合物，主要由（a）1当量的含有10至80重量％的脂肪酸​​多缩水甘油酯的多官能环氧化合物，（b）1.5至5当量的多官能异氰酸酯化合物和（c） 基于多官能环氧化合物和多官能异氰酸酯化合物的总重量，固化催化剂为0.01〜10重量％。 通过加热所述热固性树脂组合物，可以获得适合于大型装置成型的耐热性优异和耐热冲击性优异的固化物。