公开(公告)号：US09216898B2

公开(公告)日：2015-12-22

申请号：US13467814

申请日：2012-05-09

申请人： Chien-Hung Liu

发明人： Chien-Hung Liu

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L23/40 ,  B81B7/00 ,  H01L21/78 ,  H01L23/00 ,  H01L25/065

CPC分类号： B81B7/007 ,  B81C2203/0792 ,  H01L21/78 ,  H01L24/13 ,  H01L24/19 ,  H01L24/20 ,  H01L24/29 ,  H01L24/32 ,  H01L25/0657 ,  H01L2224/10156 ,  H01L2224/12105 ,  H01L2224/16147 ,  H01L2224/215 ,  H01L2224/29186 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/81191 ,  H01L2224/8385 ,  H01L2225/06513 ,  H01L2924/01029 ,  H01L2924/12041 ,  H01L2924/13091 ,  H01L2924/1461 ,  H01L2924/05442 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01079 ,  H01L2924/00

摘要： An embodiment of the invention provides a chip package which includes: a first substrate; a second substrate disposed on the first substrate, wherein the second substrate has at least one opening penetrating through the second substrate, and the at least one opening defines a plurality of conducting regions electrically insulated from each other in the second substrate; a carrier substrate disposed on the second substrate; an insulating layer disposed on a surface and a sidewall of the carrier substrate, wherein the insulating layer fills the at least one opening of the second substrate; and a conducting layer disposed on the insulating layer on the carrier substrate and electrically contacting with one of the conducting regions.

摘要翻译： 本发明的实施例提供一种芯片封装，其包括：第一基板; 设置在所述第一基板上的第二基板，其中所述第二基板具有穿过所述第二基板的至少一个开口，并且所述至少一个开口限定在所述第二基板中彼此电绝缘的多个导电区域; 设置在所述第二基板上的载体基板; 设置在所述载体基板的表面和侧壁上的绝缘层，其中所述绝缘层填充所述第二基板的所述至少一个开口; 以及导电层，其设置在所述载体基板上的所述绝缘层上并与所述导电区域之一电接触。

公开(公告)号：US09035456B2

公开(公告)日：2015-05-19

申请号：US13467887

申请日：2012-05-09

申请人： Chien-Hung Liu

发明人： Chien-Hung Liu

IPC分类号： H01L23/498 ,  H01L23/00 ,  H01L25/065 ,  H01L21/78 ,  H01L23/31 ,  H01L21/56

CPC分类号： H01L24/92 ,  H01L21/561 ,  H01L21/78 ,  H01L23/3114 ,  H01L23/49838 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/17 ,  H01L25/0657 ,  H01L2224/02371 ,  H01L2224/0401 ,  H01L2224/05124 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/06182 ,  H01L2224/13022 ,  H01L2224/13024 ,  H01L2224/131 ,  H01L2224/16145 ,  H01L2224/17181 ,  H01L2224/9202 ,  H01L2224/94 ,  H01L2225/06513 ,  H01L2924/12041 ,  H01L2924/13091 ,  H01L2924/1461 ,  H01L2924/15788 ,  H01L2224/81 ,  H01L2224/11 ,  H01L2224/03 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/00

摘要： An embodiment of the invention provides a chip package which includes: a first substrate; a second substrate disposed on the first substrate, wherein the second substrate has at least one opening penetrating through the second substrate, and the at least one opening defines a plurality of conducting regions electrically insulated from each other in the second substrate; a first insulating layer disposed on a side of the first substrate and filling in the at least one opening of the second substrate; a carrier substrate disposed on the second substrate; a second insulating layer disposed on a surface and a sidewall of the carrier substrate; and a conducting layer disposed on the second insulating layer on the carrier substrate and electrically contacting with one of the conducting regions.

摘要翻译： 本发明的实施例提供一种芯片封装，其包括：第一基板; 设置在所述第一基板上的第二基板，其中所述第二基板具有穿过所述第二基板的至少一个开口，并且所述至少一个开口限定在所述第二基板中彼此电绝缘的多个导电区域; 第一绝缘层，设置在所述第一基板的一侧并填充所述第二基板的所述至少一个开口; 设置在所述第二基板上的载体基板; 设置在所述载体基板的表面和侧壁上的第二绝缘层; 以及导电层，其设置在所述载体基板上的所述第二绝缘层上并与所述导电区域中的一个电接触。

公开(公告)号：US08975106B2

公开(公告)日：2015-03-10

申请号：US13176667

申请日：2011-07-05

申请人： Chien-Hung Liu

发明人： Chien-Hung Liu

IPC分类号： H01L21/302 ,  H01L21/28 ,  B81C1/00

CPC分类号： B81C1/00333

摘要： A method for forming a chip package includes: providing a substrate having a first and a second surfaces; removing a portion of the substrate to form openings in the substrate, wherein the openings extend from the first surface towards the second surface or from the second surface towards the first surface; after forming the openings, at least a first portion of the substrate serves as a first movable bulk, and at least a second portion of the substrate serves as a second movable bulk, wherein the first movable bulk and the second movable bulk are respectively located between the openings; disposing a protecting substrate on the second surface of the substrate; forming a through-hole in the protecting substrate; and forming a conducting layer on the protecting substrate, wherein the conducting layer extends from a surface of the protecting substrate into the through-hole to electrically connect the second movable bulk.

摘要翻译： 一种用于形成芯片封装的方法，包括：提供具有第一和第二表面的衬底; 去除衬底的一部分以在衬底中形成开口，其中开口从第一表面朝向第二表面或从第二表面朝向第一表面延伸; 在形成开口之后，衬底的至少第一部分用作第一可移动体，并且衬底的至少第二部分用作第二可移动体，其中第一可移动体和第二活动体分别位于 开口; 在衬底的第二表面上设置保护衬底; 在保护衬底中形成通孔; 以及在所述保护衬底上形成导电层，其中所述导电层从所述保护衬底的表面延伸到所述通孔中以电连接所述第二可移动体。

公开(公告)号：US08724062B2

公开(公告)日：2014-05-13

申请号：US13549798

申请日：2012-07-16

申请人： Chien-Hung Liu

发明人： Chien-Hung Liu

IPC分类号： G02F1/1337 ,  G02F1/1362

CPC分类号： G02F1/136259 ,  G02F2001/136263

摘要： One aspect of the present disclosure relates to a common repair structure for repairing scanning and/or data line defects in a liquid crystal display panel. In one embodiment, the common repair structure includes a plurality of “H” shaped structures, where each “H” shaped structure is placed over a corresponding segment of two neighboring scanning lines located between and associated with two neighboring pixels along the second direction or a corresponding segment of two neighboring data lines located between and associated with two neighboring pixels along the first direction.

摘要翻译： 本公开的一个方面涉及用于修复液晶显示面板中的扫描和/或数据线缺陷的常见修复结构。 在一个实施例中，公共修复结构包括多个“H”形结构，其中每个“H”形结构被放置在沿着第二方向位于两个相邻像素之间并与之相关联的两个相邻扫描线的对应段上，或者 两个相邻数据线的对应段位于沿着第一方向的两个相邻像素之间并与之相关联。

公开(公告)号：US08508606B2

公开(公告)日：2013-08-13

申请号：US12622720

申请日：2009-11-20

申请人： Chien-Hung Liu

发明人： Chien-Hung Liu

IPC分类号： H04N5/228 ,  H04N5/217

CPC分类号： G06T5/003 ,  G06T2207/20201 ,  H04N5/217 ,  H04N5/23248 ,  H04N5/772 ,  H04N5/781 ,  H04N5/907

摘要： An image deblurring system deblurs motion blurred images of a video stream captured from a moving object. An image deblurring method selects a blurred image from the video stream, selects blurred pixels from the blurred image, and calculates a movement offset for each of the blurred pixels according to coordinates of the blurred pixel in a frequency domain during the movement of the moving object. The method generates a point spread function according to the movement offset, and generates an image conversion formula according to the point spread function. The method converts each of the blurred pixels into a sharp pixel according to the image conversion formula, and generates a sharp image based on all of the sharp pixels.

摘要翻译： 图像去模糊系统消除从移动物体捕获的视频流的运动模糊图像。 图像去模糊方法从视频流中选择模糊图像，从模糊图像中选择模糊像素，并根据移动物体运动期间的频域中的模糊像素的坐标来计算每个模糊像素的移动偏移 。 该方法根据移动偏移产生点扩散函数，并根据点扩散函数生成图像转换公式。 该方法根据图像转换公式将每个模糊像素转换成锐利像素，并且基于所有尖锐像素产生清晰图像。

公开(公告)号：US08502380B2

公开(公告)日：2013-08-06

申请号：US12899258

申请日：2010-10-06

申请人： Chien-Hung Liu

发明人： Chien-Hung Liu

IPC分类号： H01L23/48

CPC分类号： H01L24/03 ,  H01L21/6835 ,  H01L24/32 ,  H01L2221/68372 ,  H01L2224/0236 ,  H01L2224/02377 ,  H01L2224/02381 ,  H01L2224/03002 ,  H01L2224/0401 ,  H01L2224/11849 ,  H01L2224/13024 ,  H01L2224/131 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15788 ,  H01L2924/00

摘要： A chip package and a fabrication method thereof are provided. The chip package includes a semiconductor substrate containing a semiconductor component and a conductive pad thereon. A through hole penetrates the semiconductor substrate from a backside thereof to expose the conductive pad. A redistribution layer is below the backside of the semiconductor substrate and electrically connected to the conductive pad in the through hole. A conductive trace layer is below the redistribution layer and extended along a sidewall of the semiconductor substrate to electrically contact with an edge of the redistribution layer.

摘要翻译： 提供了芯片封装及其制造方法。 芯片封装包括其上包含半导体部件和导电焊盘的半导体衬底。 通孔从其背面穿透半导体衬底以露出导电焊盘。 再分配层位于半导体衬底的背面下方并且与通孔中的导电焊盘电连接。 导电迹线层位于再分布层之下并且沿着半导体衬底的侧壁延伸以与再分布层的边缘电接触。

公开(公告)号：US08350150B2

公开(公告)日：2013-01-08

申请号：US12860941

申请日：2010-08-23

申请人： Chien-Hung Liu ,  Po-Chuan Hsieh ,  Yu-Chang Pai

发明人： Chien-Hung Liu ,  Po-Chuan Hsieh ,  Yu-Chang Pai

IPC分类号： H05K5/00

CPC分类号： H05K9/0041 ,  B21D28/10 ,  Y10T29/49 ,  Y10T29/49826

摘要： An enclosure of an electronic device includes a plate. The plate defines a number of through holes. Each through hole has a pair of tabs connected to each other and with the through hole. Each pair of tabs are slantingly bent towards an inside of the enclosure. The enclosure with the shields can shield the electronic device from electro-magnetic interference.

摘要翻译： 电子设备的外壳包括板。 该板限定了多个通孔。 每个通孔具有彼此连接并与通孔连接的一对突片。 每对翼片朝向机壳的内侧倾斜弯曲。 带屏蔽的外壳可以屏蔽电子设备免受电磁干扰。

公开(公告)号：US08253509B2

公开(公告)日：2012-08-28

申请号：US12823147

申请日：2010-06-25

申请人： Yu-Chang Pai ,  Chien-Hung Liu ,  Po-Chuan Hsieh

发明人： Yu-Chang Pai ,  Chien-Hung Liu ,  Po-Chuan Hsieh

IPC分类号： H04B3/28

CPC分类号： H05K1/0224 ,  H01P1/20381 ,  H01P3/026 ,  H05K1/0245 ,  H05K1/165

摘要： A printed circuit board includes a signal layer and a ground layer adjacent to the signal layer. The signal layer includes a pair of differential transmission lines. The ground layer includes a first void, a second void, a third void, and a common mode filter. The first void and the second void are respectively arranged at opposite sides of a projection of the pair of differential transmission lines on the ground layer, and are bridged with the third void. The common mode filter includes a first filter portion positioned in the first void, and a second filter portion positioned in the second void. Each of the first and second filter portions includes a number of coils arranged side by side along a direction parallel to the projection of the pair of differential transmission lines.

摘要翻译： 印刷电路板包括与信号层相邻的信号层和接地层。 信号层包括一对差动传输线。 接地层包括第一空隙，第二空隙，第三空隙和共模滤波器。 第一空隙和第二空隙分别布置在接地层上的一对差动传输线的突起的相对侧，并与第三空隙桥接。 共模过滤器包括位于第一空隙中的第一过滤器部分和位于第二空隙中的第二过滤器部分。 第一和第二滤波器部分中的每一个包括沿着平行于一对差动传输线的突起的方向并排布置的多个线圈。

公开(公告)号：US08116902B2

公开(公告)日：2012-02-14

申请号：US12713181

申请日：2010-02-26

申请人： Chien-Hung Liu ,  Wen-Yuh Jywe ,  Yi-Tsung Li

发明人： Chien-Hung Liu ,  Wen-Yuh Jywe ,  Yi-Tsung Li

IPC分类号： G06F19/00 ,  G01B11/02

CPC分类号： G05B19/401 ,  B23Q1/5437 ,  B23Q17/2233 ,  B23Q17/2495 ,  G01B11/03 ,  G01B11/27 ,  G01B21/045 ,  G05B2219/37008 ,  G05B2219/37275 ,  Y10T409/305824

摘要： A method of detecting a dynamic path of a five-axis machine tool having a spindle and a turntable and has a preparing step, a correcting step and a detecting step. The preparing step includes mounting a detector on the spindle, mounting a cat-eye reflector on the turntable, emitting a laser light to the cat-eye reflector, reflecting the laser light to the detector and splitting into two light beams. One of the light beams is emitted to a four-quadrant position sensitive detector. The correcting step includes rotating the detector, detecting a signal of the laser light by the four-quadrant position sensitive detector to eliminate an offset between the detecting assembly and the spindle. The detecting step includes detecting the dynamic path of the five-axis machine tool by detecting the positions of at least two of the linear axes and at least one of the rotation axes of the five-axis machine tool.

摘要翻译： 一种检测具有主轴和转盘的五轴机床的动态路径的方法，具有准备步骤，校正步骤和检测步骤。 制备步骤包括将检测器安装在心轴上，将猫眼反射器安装在转盘上，向猫眼反射器发射激光，将激光反射到检测器并分成两束光束。 一个光束被发射到四象限位置敏感检测器。 校正步骤包括旋转检测器，通过四象限位置敏感检测器检测激光的信号，以消除检测组件和主轴之间的偏移。 检测步骤包括通过检测五轴机床中至少两个线性轴线和至少一个旋转轴线的位置来检测五轴机床的动态路径。

公开(公告)号：US08076744B2

公开(公告)日：2011-12-13

申请号：US11657733

申请日：2007-01-25

申请人： Chien-Hung Liu

发明人： Chien-Hung Liu

IPC分类号： H01L31/0232

CPC分类号： H01L27/14618 ,  H01L2224/13

摘要： A photosensitizing chip package construction and manufacturing method thereof is comprised of photosensitizing chips constructed on one side of a wafer using a bonding layer; a color attachment array being disposed over those photosensitizing chips; a glass substrate provided with weir and covered up over the color attachment array; a proper gap being defined between the glass substrate and the color attachment array to promote permeability of stream of light by direct receiving stream of light from those photosensitizing chips constructed over the wafer.

摘要翻译： 光敏芯片封装结构及其制造方法由使用结合层的晶片一侧构成的光敏芯片构成; 在这些光敏芯片上设置着色附件阵列; 设置有堰并覆盖在附着阵列上的玻璃基板; 在玻璃基板和颜色附着阵列之间限定适当的间隙，以通过直接接收来自在晶片上构成的光敏芯片的光直接接收光来促进光流的透过性。