公开(公告)号：US20080050586A1

公开(公告)日：2008-02-28

申请号：US10585141

申请日：2004-12-28

申请人： Takashi Kikuchi ,  Hiroyuki Tsuji ,  Hisayasu Kaneshiro

发明人： Takashi Kikuchi ,  Hiroyuki Tsuji ,  Hisayasu Kaneshiro

IPC分类号： B32B7/12 ,  B29C67/24 ,  B32B15/08

CPC分类号： B32B15/08 ,  B32B7/12 ,  B32B27/34 ,  C09J179/08 ,  Y10T156/1002 ,  Y10T428/2852 ,  Y10T428/31681

摘要： It is an object of the present invention to provide an adhesive film which is used for producing, by a laminating method, a flexible metal-clad laminate in which the change in dimensions is suppressed, a flexible metal-clad laminate including the adhesive film, and a production method therefor. The present invention relates to an adhesive film including a polyimide film and an adhesive layer containing a thermoplastic polyimide, the adhesive layer being disposed on at least one surface of the polyimide film, a flexible metal-clad laminate produced by laminating a metal foil to the adhesive film with a thermal roll laminator, and a production method therefor, wherein the polyimide film is formed by a process including step (A) of mixing a polyamic acid solution, a dehydrating agent, and an imidization catalyst, and casting and applying the mixture onto a support to form a gel film; step (B) of stripping off the gel film and fixing both ends of the gel film; and step (C) of heating and transporting the film with both ends being fixed in a state loosened in the TD direction.

摘要翻译： 本发明的目的是提供一种粘合膜，其用于通过层压方法制造其中尺寸变化被抑制的柔性覆金属层压板，包括粘合剂膜的柔性覆金属层压板， 及其制造方法。 本发明涉及包括聚酰亚胺膜和含有热塑性聚酰亚胺的粘合剂层的粘合剂膜，粘合剂层设置在聚酰亚胺膜的至少一个表面上，柔性覆金属层压板通过将金属箔层压到 具有热辊层压机的粘合膜及其制造方法，其中通过包括将聚酰胺酸溶液，脱水剂和酰亚胺化催化剂混合的步骤（A）的方法形成所述聚酰亚胺膜，以及将所述混合物 在支撑体上形成凝胶膜; 步骤（B）剥离凝胶膜并固定凝胶膜的两端; 并且将两端的加热和输送的步骤（C）固定在TD方向松动的状态。

公开(公告)号：US20070263953A1

公开(公告)日：2007-11-15

申请号：US11605348

申请日：2006-11-29

申请人： Roshan Thapliya ,  Shigetoshi Nakamura ,  Takashi Kikuchi

发明人： Roshan Thapliya ,  Shigetoshi Nakamura ,  Takashi Kikuchi

IPC分类号： G02F1/295 ,  G02B6/10 ,  G02B6/26 ,  G02B6/42

CPC分类号： G02F1/3132 ,  G02F1/3136 ,  G02F2001/217 ,  G02F2202/07

摘要： An optical switching element comprising: a multimode waveguide having an electro-optical effect; one or a plurality of first single mode waveguides; a plurality of second single mode waveguides; a first electrode arranged in the vicinity of one edge on one side of the multimode waveguide; a second electrode arranged in the vicinity of the other edge on the same side of the multimode waveguide; and a third electrode arranged on the other side of the multimode waveguide, over the first electrode and the second electrode being arranged so as to be positioned on luminescent spots in an optical mode field generated by the light propagating through the multimode waveguide, and an optical path being switched between the first single mode waveguide and the second single mode waveguide by applying voltage between the first electrode and the third electrode and between the second electrode and the third electrode, is provided.

摘要翻译： 一种光开关元件，包括：具有电光效应的多模波导; 一个或多个第一单模波导; 多个第二单模波导; 布置在所述多模波导一侧的一个边缘附近的第一电极; 布置在所述多模波导的同一侧上的另一边缘附近的第二电极; 以及布置在所述多模波导的另一侧上的第三电极，在所述第一电极和所述第二电极上方布置以便在由通过所述多模波导传播的光产生的光模场中定位在发光点上，以及光学 提供了通过在第一电极和第三电极之间以及第二电极和第三电极之间施加电压在第一单模波导和第二单模波导之间切换的路径。

公开(公告)号：US20070260036A1

公开(公告)日：2007-11-08

申请号：US11662809

申请日：2005-09-09

申请人： Hisayasu Kaneshiro ,  Takashi Kikuchi

发明人： Hisayasu Kaneshiro ,  Takashi Kikuchi

IPC分类号： C08G69/26

CPC分类号： C08J5/18 ,  C08G73/1042 ,  C08J2379/08 ,  C09D179/08 ,  H05K1/0346 ,  H05K1/0393 ,  H05K3/386

摘要： Disclosed is a polyimide film having good adherability to an adhesive, especially to a polyimide adhesive. Specifically, disclosed is a non-thermoplastic polyimide film whose raw material is composed of a diamine essentially containing 2,2-bisaminophenoxylphenylpropane and praphenylene diamine, and an acid dianhydride component essentially containing a pyromellitic dianhydride and 3,3′,4,4′-benzophenone tetracarboxylic dianhydride. Thus non-thermoplastic polyimide film is characterized by having an average birefringence of less than 0.14.

摘要翻译： 公开了一种对粘合剂，特别是聚酰亚胺粘合剂具有良好粘附性的聚酰亚胺膜。 具体地说，公开了一种非热塑性聚酰亚胺膜，其原料由基本上含有2,2-二氨基苯氧基苯基丙烷和对苯撑二胺的二胺和基本上含有均苯四酸二酐的酸二酐组分和3,3'，4,4'- 二苯甲酮四羧酸二酐。 因此，非热塑性聚酰亚胺膜的平均双折射率小于0.14。

公开(公告)号：US20070034326A1

公开(公告)日：2007-02-15

申请号：US10579942

申请日：2004-12-20

申请人： Takashi Kikuchi ,  Hiroyuki Tsuji

发明人： Takashi Kikuchi ,  Hiroyuki Tsuji

IPC分类号： B32B37/00

CPC分类号： B32B15/043 ,  B29C65/18 ,  B29C65/26 ,  B29C65/30 ,  B29C65/5057 ,  B29C66/00441 ,  B29C66/1122 ,  B29C66/45 ,  B29C66/71 ,  B29C66/72321 ,  B32B7/06 ,  B32B7/12 ,  B32B15/08 ,  B32B37/12 ,  B32B37/20 ,  B32B37/26 ,  B32B2038/0088 ,  B32B2307/306 ,  B32B2307/734 ,  B32B2311/00 ,  H05K2201/0154 ,  B29K2079/08

摘要： It is an object of the present invention to provide a method for producing a flexible laminate in which the appearance and dimensional stability after removal of metal foils are improved. The present invention provides a method for producing a flexible laminate 5 including a heat-resistant adhesive film 3 and a metal foil 2 bonded to at least one surface of the heat-resistant adhesive film 3. The method includes a step of performing thermal lamination by passing the heat-resistant adhesive film 3 and the metal foil 2 between a pair of metal rolls 4 through a protective film 1, and a step of separating the protective film 1. The molecular orientation ratio of the protective film 1 is in a range of 1.0 to 1.7.

摘要翻译： 本发明的目的是提供一种柔性层压体的制造方法，其中改善了除去金属箔之后的外观和尺寸稳定性。 本发明提供了一种制造柔性层压体5的方法，该柔性层压材料5包括结合到耐热粘合膜3的至少一个表面上的耐热粘合剂膜3和金属箔2。 该方法包括通过将耐热粘合剂膜3和金属箔2通过保护膜1通过一对金属辊4之间进行热层压的步骤和分离保护膜1的步骤。 保护膜1的分子取向比在1.0〜1.7的范围内。

公开(公告)号：US07083225B2

公开(公告)日：2006-08-01

申请号：US10803537

申请日：2004-03-18

申请人： Takashi Yakata ,  Hideki Honjo ,  Shinsuke Miyoshi ,  Takashi Kikuchi ,  Keishi Goto

发明人： Takashi Yakata ,  Hideki Honjo ,  Shinsuke Miyoshi ,  Takashi Kikuchi ,  Keishi Goto

IPC分类号： B62D25/08

CPC分类号： B62D25/088

摘要： Coupling members include a first coupling portion (X) that couples rear quarter inner members to upper surfaces of rear suspension base members, a second coupling portion (Y) that couples upper surfaces of the rear suspension base members together, which are located on the right and the left in pairs, and a third coupling portion (Z) that joins the second coupling portion to couple the rear quarter inner members together, which are located on the right and the left in pairs, the coupling member being integrally formed, and there is formed a bulkhead structure in a portion surrounded by the first, second and third coupling portions.

摘要翻译： 耦合构件包括将后四分之一内部构件耦合到后悬架基座构件的上表面的第一联接部分（X），将后悬架基座构件的上表面联接在一起的第二联接部分（Y），其位于右侧 和成对的左侧，以及连接第二联接部分以将后部四分之一内部构件联接在一起的第三联接部分（Z），所述第二联接部分成对地位于左右两对，联接构件一体形成，并且在那里 在由第一，第二和第三联接部分围绕的部分中形成隔板结构。

公开(公告)号：US20050046238A1

公开(公告)日：2005-03-03

申请号：US10926313

申请日：2004-08-26

申请人： Shinsuke Miyoshi ,  Satoshi Arakawa ,  Takashi Yakata ,  Keishi Goto ,  Takashi Kikuchi

发明人： Shinsuke Miyoshi ,  Satoshi Arakawa ,  Takashi Yakata ,  Keishi Goto ,  Takashi Kikuchi

IPC分类号： B62D25/02 ,  B62D25/04 ,  B62D25/06 ,  B62D25/20 ,  B62D25/00

CPC分类号： B62D25/2036 ,  B62D25/02

摘要： In a side body structure, a front reinforce is provided between a side body outer panel and a side body inner panel and also, a rear roof side reinforce is provided so as to couple the front reinforce to a rear pillar reinforce along the upper edge of an opening of a rear door, and vehicle body rigidity of the periphery of the opening of the rear door as well as the periphery of an opening of a front door is enhanced.

摘要翻译： 在侧体结构中，在侧体外板和侧体内板之间设置有前加强件，并且还设置有后车顶侧加强件，以将前加强件沿着上侧边缘的上边缘连接到后支柱加强件 后门的开口，后门的开口的周边的车身刚性以及前门的开口的周边被增强。

公开(公告)号：US20050040509A1

公开(公告)日：2005-02-24

申请号：US10860073

申请日：2004-06-04

申请人： Takashi Kikuchi ,  Ryosuke Kimoto ,  Hiroshi Kawakubo ,  Takashi Miwa ,  Chikako Imura ,  Takafumi Nishita ,  Hiroshi Koyama ,  Masanori Shibamoto ,  Masaru Kawakami

发明人： Takashi Kikuchi ,  Ryosuke Kimoto ,  Hiroshi Kawakubo ,  Takashi Miwa ,  Chikako Imura ,  Takafumi Nishita ,  Hiroshi Koyama ,  Masanori Shibamoto ,  Masaru Kawakami

IPC分类号： H01L23/12 ,  H01L21/56 ,  H01L23/31 ,  H01L25/10 ,  H05K1/00 ,  H01L21/48 ,  H01L23/02

CPC分类号： H01L23/3128 ,  H01L21/563 ,  H01L24/28 ,  H01L25/105 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15151 ,  H01L2924/15174 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/3511 ,  H01L2924/00012 ,  H01L2924/00

摘要： For high density packaging of a semiconductor device, the semiconductor device has a multi-layer substrate, a first-stage chip connected electrically to the multi-layer substrate, other package substrates stacked in three stages on the multi-layer substrate and each connected to an underlying wiring substrate through solder balls, second-, third- and fourth-stage chips electrically connected respectively to the other package substrates, and solder balls provided on the bottom multi-layer substrate. The number of wiring layers in the bottom multi-layer substrate which has a logic chip is larger than that in the package substrates which have memory chips, whereby the semiconductor device can have a wiring layer not used for distribution of wires to the solder balls and wiring lines in the wiring layer can be used for the mounting of another semiconductor element or a passive component to attain high density packaging of the semiconductor device as a stacked type package.

摘要翻译： 对于半导体器件的高密度封装，半导体器件具有多层衬底，与多层衬底电连接的第一级芯片，在多层衬底上分层堆叠的其它封装衬底，并且每个衬底连接到 通过焊球，第二级，第三级和第四级芯片分别与其他封装衬底电连接的底层布线衬底以及设置在底部多层衬底上的焊球。 具有逻辑芯片的底部多层基板中的布线层数大于具有存储芯片的封装基板中的布线层的数量，由此半导体器件可以具有不用于将焊丝分布到焊球的布线层， 布线层中的布线可用于安装另一半导体元件或无源元件，以实现作为堆叠型封装的半导体器件的高密度封装。

公开(公告)号：US06572217B2

公开(公告)日：2003-06-03

申请号：US09888514

申请日：2001-06-26

申请人： Takashi Kikuchi ,  Isao Suzuki

发明人： Takashi Kikuchi ,  Isao Suzuki

IPC分类号： B41J2135

CPC分类号： B41J2/1433 ,  B41J2002/14362

摘要： The present invention provides a plate-like protect member at a front surface of an ink jet printer head having an orifice which is capable of jetting ink. The protect member provides a step around the orifice having an outer portion higher than an inner portion. The protect member also provides an ink repellency layer on an outer portion of the step. Thus, the ink jet printer head of the present invention can prevent the jetted ink from the orifice to creep up toward back of the ink jet printer head which is reverse direction to the ink jetting direction.

公开(公告)号：US06421279B1

公开(公告)日：2002-07-16

申请号：US09927493

申请日：2001-08-13

申请人： Tsunehiro Tobita ,  Jun Kitahara ,  Takashi Tsunehiro ,  Kunihiro Katayama ,  Ryuichi Hattori ,  Yukihiro Seki ,  Hajime Yamagami ,  Takashi Totsuka ,  Takeshi Wada ,  Yosio Takaya ,  Manabu Saito ,  Kenichi Kaki ,  Takao Okubo ,  Takashi Kikuchi ,  Masamichi Kishi ,  Takeshi Suzuki ,  Shigeru Kadowaki

发明人： Tsunehiro Tobita ,  Jun Kitahara ,  Takashi Tsunehiro ,  Kunihiro Katayama ,  Ryuichi Hattori ,  Yukihiro Seki ,  Hajime Yamagami ,  Takashi Totsuka ,  Takeshi Wada ,  Yosio Takaya ,  Manabu Saito ,  Kenichi Kaki ,  Takao Okubo ,  Takashi Kikuchi ,  Masamichi Kishi ,  Takeshi Suzuki ,  Shigeru Kadowaki

IPC分类号： G11C800

CPC分类号： G11C29/765 ,  G06F3/0601 ,  G06F3/0613 ,  G06F3/0616 ,  G06F3/064 ,  G06F3/0644 ,  G06F3/0656 ,  G06F3/0679 ,  G06F3/068 ,  G06F11/1433 ,  G06F11/1441 ,  G06F12/08 ,  G06F12/0802 ,  G06F12/0866 ,  G06F2003/0694 ,  G06F2212/2022 ,  G06F2212/312 ,  G11C29/789 ,  G11C29/82

摘要： A semiconductor file system features a first nonvolatile memory electrically erasable, a second nonvolatile memory not electrically erasable, a volatile memory, a controller, and a control section which controls the controller wherein a physical address corresponding to a logical address specified from an external system is accessed. The first nonvolatile memory stores data for the external system to perform operations, first management information indicating correspondence between physical and logical addresses, and second management information indicating a state of the first nonvolatile memory. The second nonvolatile memory previously stores interface information. The controller determines a physical sector address. The control section is for controlling input/output of data from/to the external system and for temporarily storing write data into the first nonvolatile memory from the external system in the volatile memory and then transferring the write data from the volatile memory to the first nonvolatile memory.

摘要翻译： 半导体文件系统具有电可擦除的第一非易失性存储器，不电可擦除的第二非易失性存储器，易失性存储器，控制器和控制部分，其控制控制器，其中对应于从外部系统指定的逻辑地址的物理地址是 访问。 第一非易失性存储器存储用于执行操作的外部系统的数据，指示物理和逻辑地址之间的对应关系的第一管理信息以及指示第一非易失性存储器的状态的第二管理信息。 第二非易失性存储器先前存储接口信息。 控制器确定物理扇区地址。 控制部分用于控制来自/外部系统的数据的输入/输出，并用于从易失性存储器中的外部系统暂时将写数据存储到第一非易失性存储器中，然后将写入数据从易失性存储器传送到第一非易失性存储器 记忆。

公开(公告)号：US6078520A

公开(公告)日：2000-06-20

申请号：US357931

申请日：1999-07-21

申请人： Tsunehiro Tobita ,  Jun Kitahara ,  Takashi Tsunehiro ,  Kunihiro Katayama ,  Ryuichi Hattori ,  Yukihiro Seki ,  Hajime Yamagami ,  Takashi Totsuka ,  Takeshi Wada ,  Yosio Takaya ,  Manabu Saito ,  Kenichi Kaki ,  Takao Okubo ,  Takashi Kikuchi ,  Masamichi Kishi ,  Takeshi Suzuki ,  Shigeru Kadowaki

发明人： Tsunehiro Tobita ,  Jun Kitahara ,  Takashi Tsunehiro ,  Kunihiro Katayama ,  Ryuichi Hattori ,  Yukihiro Seki ,  Hajime Yamagami ,  Takashi Totsuka ,  Takeshi Wada ,  Yosio Takaya ,  Manabu Saito ,  Kenichi Kaki ,  Takao Okubo ,  Takashi Kikuchi ,  Masamichi Kishi ,  Takeshi Suzuki ,  Shigeru Kadowaki

IPC分类号： G06F11/14 ,  G06F12/08 ,  G11C29/00 ,  G11C17/00

CPC分类号： G11C29/765 ,  G06F11/1433 ,  G06F12/08 ,  G06F12/0802 ,  G06F12/0866 ,  G11C29/789 ,  G11C29/82 ,  G06F2212/2022 ,  G06F2212/312

摘要： A control method and system when a flash memory is used as a semiconductor disk or a main memory in an information processing system. A semiconductor file system comprises a first nonvolatile memory electrically erasable, a second nonvolatile memory not electrically erasable, a volatile memory, a controller which controls the memories, and a control section which controls the controller wherein a physical address corresponding to a logical address specified from an external system is accessed. The first nonvolatile memory stores data for the external system to perform operations, first management information indicating the correspondence between physical addresses at which the data is stored and logical addresses, and second management information indicating a state of the first nonvolatile memory. The second nonvolatile memory previously stores interface information required for inputting and outputting the data from and to the external system and read-only data of the data. The controller has a control means for determining a physical sector address forming predetermined high-order bits of the physical address when data is output from the first nonvolatile memory or when data is input to the volatile memory, means for storing the determined physical sector address, and means for consecutively generating addresses in a sector determined by the physical sector address.

摘要翻译： 当闪存用作信息处理系统中的半导体盘或主存储器时的控制方法和系统。 半导体文件系统包括电可擦除的第一非易失性存储器，不电可擦除的第二非易失性存储器，易失性存储器，控制存储器的控制器和控制控制器的控制部分，其中对应于由 访问一个外部系统。 第一非易失性存储器存储用于执行操作的外部系统的数据，指示存储数据的物理地址与逻辑地址之间的对应关系的第一管理信息，以及指示第一非易失性存储器的状态的第二管理信息。 第二非易失性存储器预先存储从外部系统输入和输出数据所需的接口信息以及数据的只读数据。 控制器具有控制装置，用于当数据从第一非易失性存储器输出时或当数据被输入到易失性存储器时，确定形成物理地址的预定高位的物理扇区地址，用于存储确定的物理扇区地址的装置， 以及用于在由所述物理扇区地址确定的扇区中连续生成地址的装置。