公开(公告)号：US20140204454A1

公开(公告)日：2014-07-24

申请号：US13997646

申请日：2011-12-22

申请人： Yonggang Li ,  Islam A. Salama ,  Chong Zhang

发明人： Yonggang Li ,  Islam A. Salama ,  Chong Zhang

IPC分类号： G02B26/10

CPC分类号： G02B26/10 ,  B23K2101/42 ,  G02F1/33 ,  G02F2001/291 ,  G02F2201/16

摘要： A first acousto-optic deflector receives a laser beam. The first acousto-optic deflector diffracts the received laser beam along a first axis. A second acousto-optic deflector receives the diffracted laser beam. The second acousto-optic deflector diffracts the received diffracted laser beam along a second axis.

摘要翻译： 第一声​​光偏转器接收激光束。 第一声​​光偏转器沿着第一轴衍射接收的激光束。 第二声光偏转器接收衍射激光束。 第二声光偏转器沿着第二轴衍射所接收的衍射激光束。

公开(公告)号：US08456016B2

公开(公告)日：2013-06-04

申请号：US12729821

申请日：2010-03-23

申请人： Yonggang Li ,  Amruthavalli P. Alur ,  Devarajan Balaraman ,  Xiwang Qi ,  Charan K. Gurumurthy

发明人： Yonggang Li ,  Amruthavalli P. Alur ,  Devarajan Balaraman ,  Xiwang Qi ,  Charan K. Gurumurthy

IPC分类号： H01L23/48

CPC分类号： H01L23/15 ,  H01L21/486 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49894 ,  H01L24/12 ,  H01L2224/16235 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/09701 ,  H01L2924/14 ,  H05K3/0029 ,  H05K3/0032 ,  H05K3/429 ,  H05K3/4605 ,  H05K2201/10674 ,  H01L2224/0401

摘要： A semiconductor package comprises a semiconductor substrate that may comprise a core. The core may comprise one or more materials selected from a group comprising ceramics and glass dielectrics. The package further comprises a set of one or more inner conductive elements that is provided on the core, a set of one or more outer conductive elements that is provided on an outer side of the substrate, and a semiconductor die to couple to the substrate via one or more of the outer conductive elements. Example materials for the core may comprise one or more from alumina, zirconia, carbides, nitrides, fused silica, quartz, sapphire, and Pyrex. A laser may be used to drill one or more plated through holes to couple an inner conductive element to an outer conductive element. A dielectric layer may be formed in the substrate to insulate an outer conductive element from the core or an inner conductive element.

摘要翻译： 半导体封装包括可包括芯的半导体衬底。 芯可以包括选自包括陶瓷和玻璃电介质的组中的一种或多种材料。 所述封装还包括设置在所述芯上的一组或多个内部导电元件，设置在所述基板的外侧上的一组或多个外部导电元件的集合，以及半导体管芯，以通过 一个或多个外部导电元件。 芯的示例性材料可以包括氧化铝，氧化锆，碳化物，氮化物，熔融二氧化硅，石英，蓝宝石和派雷克斯中的一种或多种。 可以使用激光器来钻一个或多个电镀通孔，以将内部导电元件耦合到外部导电元件。 介电层可以形成在衬底中以使外部导电元件与芯或内部导电元件绝缘。

公开(公告)号：US20110123725A1

公开(公告)日：2011-05-26

申请号：US13019442

申请日：2011-02-02

申请人： Omar J. Bchir ,  Houssam Jomaa ,  Islam A. Salama ,  Yonggang Li

发明人： Omar J. Bchir ,  Houssam Jomaa ,  Islam A. Salama ,  Yonggang Li

IPC分类号： C08J7/18 ,  H05K3/00

CPC分类号： C23C18/1605 ,  C23C18/1651 ,  C23C18/1653 ,  C25D5/022 ,  C25D5/10 ,  H05K3/0035 ,  H05K3/107 ,  H05K3/108 ,  H05K3/423 ,  H05K2201/09509 ,  H05K2201/09563

摘要： A method of enabling selective area plating on a substrate includes forming a first electrically conductive layer (310) over substantially all of the substrate, covering sections of the first electrically conductive layer with a mask (410) such that the first electrically conductive layer has a masked portion and an unmasked portion, forming a second electrically conductive layer (710, 1210), the second electrically conductive layer forming only over the unmasked portion of the first electrically conductive layer, and removing the mask and the masked portion of the first electrically conductive layer. In an embodiment, the mask covering sections of the first electrically conductive layer is a non-electrically conductive substance (1010) applied with a stamp (1020). In an embodiment, the mask is a black oxide layer.

摘要翻译： 一种使得在衬底上进行选择性区域电镀的方法包括在基本上所有衬底上形成第一导电层（310），用掩模（410）覆盖第一导电层的部分，使得第一导电层具有 掩模部分和未屏蔽部分，形成第二导电层（710,1012），所述第二导电层仅形成在所述第一导电层的未掩模部分上，并且去除所述掩模和所述第一导电层的所述掩蔽部分 层。 在一个实施例中，第一导电层的掩模覆盖部分是施加有印模（1020）的非导电物质（1010）。 在一个实施例中，掩模是黑色氧化物层。

公开(公告)号：US07923059B2

公开(公告)日：2011-04-12

申请号：US11861302

申请日：2007-09-26

申请人： Omar J. Bchir ,  Houssam Jomaa ,  Islam A. Salama ,  Yonggang Li

发明人： Omar J. Bchir ,  Houssam Jomaa ,  Islam A. Salama ,  Yonggang Li

IPC分类号： B05D5/12 ,  B05D1/32

CPC分类号： C23C18/1605 ,  C23C18/1651 ,  C23C18/1653 ,  C25D5/022 ,  C25D5/10 ,  H05K3/0035 ,  H05K3/107 ,  H05K3/108 ,  H05K3/423 ,  H05K2201/09509 ,  H05K2201/09563

摘要： A method of enabling selective area plating on a substrate includes forming a first electrically conductive layer (310) over substantially all of the substrate, covering sections of the first electrically conductive layer with a mask (410) such that the first electrically conductive layer has a masked portion and an unmasked portion, forming a second electrically conductive layer (710, 1210), the second electrically conductive layer forming only over the unmasked portion of the first electrically conductive layer, and removing the mask and the masked portion of the first electrically conductive layer. In an embodiment, the mask covering sections of the first electrically conductive layer is a non-electrically conductive substance (1010) applied with a stamp (1020). In an embodiment, the mask is a black oxide layer.

摘要翻译： 一种使得在衬底上进行选择性区域电镀的方法包括在基本上所有衬底上形成第一导电层（310），用掩模（410）覆盖第一导电层的部分，使得第一导电层具有 掩模部分和未屏蔽部分，形成第二导电层（710,1012），所述第二导电层仅形成在所述第一导电层的未掩模部分上，并且去除所述掩模和所述第一导电层的所述掩蔽部分 层。 在一个实施例中，第一导电层的掩模覆盖部分是施加有印模（1020）的非导电物质（1010）。 在一个实施例中，掩模是黑色氧化物层。

公开(公告)号：US20100289154A1

公开(公告)日：2010-11-18

申请号：US12729821

申请日：2010-03-23

申请人： Yonggang Li ,  Amruthavalll P. Alur ,  Devarajan Balaraman ,  Xiwang Qi ,  Charan K. Gurumurthy

发明人： Yonggang Li ,  Amruthavalll P. Alur ,  Devarajan Balaraman ,  Xiwang Qi ,  Charan K. Gurumurthy

IPC分类号： H01L23/48

CPC分类号： H01L23/15 ,  H01L21/486 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49894 ,  H01L24/12 ,  H01L2224/16235 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/09701 ,  H01L2924/14 ,  H05K3/0029 ,  H05K3/0032 ,  H05K3/429 ,  H05K3/4605 ,  H05K2201/10674 ,  H01L2224/0401

摘要： A semiconductor package comprises a semiconductor substrate that may comprise a core. The core may comprise one or more materials selected from a group comprising ceramics and glass dielectrics. The package further comprises a set of one or more inner conductive elements that is provided on the core, a set of one or more outer conductive elements that is provided on an outer side of the substrate, and a semiconductor die to couple to the substrate via one or more of the outer conductive elements. Example materials for the core may comprise one or more from alumina, zirconia, carbides, nitrides, fused silica, quartz, sapphire, and Pyrex. A laser may be used to drill one or more plated through holes to couple an inner conductive element to an outer conductive element. A dielectric layer may be formed in the substrate to insulate an outer conductive element from the core or an inner conductive element.

公开(公告)号：US20100078805A1

公开(公告)日：2010-04-01

申请号：US12242414

申请日：2008-09-30

申请人： Yonggang Li ,  Amruthavalli P. Alur ,  Devarajan Balaraman ,  Xiwang Qi ,  Charan K. Gurumurthy

发明人： Yonggang Li ,  Amruthavalli P. Alur ,  Devarajan Balaraman ,  Xiwang Qi ,  Charan K. Gurumurthy

IPC分类号： H01L23/48 ,  H01L23/535 ,  H01L21/02

CPC分类号： H01L23/15 ,  H01L21/486 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49894 ,  H01L24/12 ,  H01L2224/16235 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/09701 ,  H01L2924/14 ,  H05K3/0029 ,  H05K3/0032 ,  H05K3/429 ,  H05K3/4605 ,  H05K2201/10674 ,  H01L2224/0401

摘要： A semiconductor package comprises a semiconductor substrate that may comprise a core. The core may comprise one or more materials selected from a group comprising ceramics and glass dielectrics. The package further comprises a set of one or more inner conductive elements that is provided on the core, a set of one or more outer conductive elements that is provided on an outer side of the substrate, and a semiconductor die to couple to the substrate via one or more of the outer conductive elements. Example materials for the core may comprise one or more from alumina, zirconia, carbides, nitrides, fused silica, quartz, sapphire, and Pyrex. A laser may be used to drill one or more plated through holes to couple an inner conductive element to an outer conductive element. A dielectric layer may be formed in the substrate to insulate an outer conductive element from the core or an inner conductive element.

摘要翻译： 半导体封装包括可包括芯的半导体衬底。 芯可以包括选自包括陶瓷和玻璃电介质的组中的一种或多种材料。 所述封装还包括设置在所述芯上的一组或多个内部导电元件，设置在所述基板的外侧上的一组或多个外部导电元件的集合，以及半导体管芯，以通过 一个或多个外部导电元件。 芯的示例性材料可以包括氧化铝，氧化锆，碳化物，氮化物，熔融二氧化硅，石英，蓝宝石和派雷克斯中的一种或多种。 可以使用激光器来钻一个或多个电镀通孔，以将内部导电元件耦合到外部导电元件。 介电层可以形成在衬底中以使外部导电元件与芯或内部导电元件绝缘。

公开(公告)号：US07541463B2

公开(公告)日：2009-06-02

申请号：US11263591

申请日：2005-10-31

申请人： Xuhong Qian ,  Yonggang Li ,  Yufang Xu ,  Jian Ding ,  Liping Lin ,  Zehong Miao ,  Hong Zhu ,  Baoyuan Qu

发明人： Xuhong Qian ,  Yonggang Li ,  Yufang Xu ,  Jian Ding ,  Liping Lin ,  Zehong Miao ,  Hong Zhu ,  Baoyuan Qu

IPC分类号： A61K31/4365 ,  C07D221/18 ,  C07D471/06

CPC分类号： C07D495/06 ,  C07D221/14 ,  C07D405/12 ,  C07D513/06 ,  C09B57/08 ,  C09B69/102 ,  C09B69/109

摘要： The invention discloses novel sulfur-containing naphthalimide derivatives, and the preparation and uses thereof. The conjugated plane of naphthalimide derivatives of the invention is enlarged by incorporating 5-or 6-membered heteroaromatic ring and/or introducing S heteroatom, thus increasing the anti-tumor activity of naphthalimide. The compounds of the invention displays significant inhibiting activities to the proliferation of various tumor cells such as human lung cancer, gastric cancer, liver cancer, leucocythemia and the like. The inhibition of cell proliferation is dose-dependent.

摘要翻译： 本发明公开了新型含硫萘二甲酰亚胺衍生物及其制备及应用。 本发明的萘二甲酰亚胺衍生物的共轭平面通过掺入5-或6-元杂芳环和/或引入S杂原子而增大，从而增加了萘二甲酰亚胺的抗肿瘤活性。 本发明化合物对人肺癌，胃癌，肝癌，白细胞增多症等各种肿瘤细胞的增殖具有显着的抑制活性。 细胞增殖的抑制是剂量依赖性的。

公开(公告)号：US20090081381A1

公开(公告)日：2009-03-26

申请号：US11861302

申请日：2007-09-26

申请人： Omar Bchir ,  Houssam Jomaa ,  Islam A. Salama ,  Yonggang Li

发明人： Omar Bchir ,  Houssam Jomaa ,  Islam A. Salama ,  Yonggang Li

IPC分类号： B05D3/06 ,  C25D5/02

CPC分类号： C23C18/1605 ,  C23C18/1651 ,  C23C18/1653 ,  C25D5/022 ,  C25D5/10 ,  H05K3/0035 ,  H05K3/107 ,  H05K3/108 ,  H05K3/423 ,  H05K2201/09509 ,  H05K2201/09563

摘要： A method of enabling selective area plating on a substrate includes forming a first electrically conductive layer (310) over substantially all of the substrate, covering sections of the first electrically conductive layer with a mask (410) such that the first electrically conductive layer has a masked portion and an unmasked portion, forming a second electrically conductive layer (710, 1210), the second electrically conductive layer forming only over the unmasked portion of the first electrically conductive layer, and removing the mask and the masked portion of the first electrically conductive layer. In an embodiment, the mask covering sections of the first electrically conductive layer is a non-electrically conductive substance (1010) applied with a stamp (1020). In an embodiment, the mask is a black oxide layer.

摘要翻译： 一种使得在衬底上进行选择性区域电镀的方法包括在基本上所有衬底上形成第一导电层（310），用掩模（410）覆盖第一导电层的部分，使得第一导电层具有 掩模部分和未屏蔽部分，形成第二导电层（710,1012），所述第二导电层仅形成在所述第一导电层的未掩模部分上，并且去除所述掩模和所述第一导电层的所述掩蔽部分 层。 在一个实施例中，第一导电层的掩模覆盖部分是施加有印模（1020）的非导电物质（1010）。 在一个实施例中，掩模是黑色氧化物层。

公开(公告)号：US06732562B2

公开(公告)日：2004-05-11

申请号：US09851517

申请日：2001-05-08

申请人： Nathaniel R. Quick ,  Aravinda Kar ,  Yonggang Li ,  Raymond R. McNeice

发明人： Nathaniel R. Quick ,  Aravinda Kar ,  Yonggang Li ,  Raymond R. McNeice

IPC分类号： B21D3716

CPC分类号： B21C37/042 ,  B21C1/003 ,  B21C1/02 ,  B21C1/12 ,  B21C37/047 ,  Y10S72/70

摘要： An apparatus and method is disclosed for drawing continuous metallic wire having a first diameter to a metallic fiber having a reduced second diameter. A feed mechanism moves the wire at a first linear velocity. A laser beam heats a region of the wire to an elevated temperature. A draw mechanism draws the heated wire at a second and greater linear velocity for providing a drawn metallic fiber having the reduced second diameter.

摘要翻译： 公开了一种用于将具有第一直径的连续金属丝拉制成具有减小的第二直径的金属纤维的装置和方法。 进给机构以第一线速度移动线。 激光束将导线的区域加热到升高的温度。 牵引机构以第二和更大的线速度牵引加热的线，以提供具有减小的第二直径的拉伸金属纤维。