公开(公告)号：US20060111367A1

公开(公告)日：2006-05-25

申请号：US11263591

申请日：2005-10-31

申请人： Xuhong Qian ,  Yonggang Li ,  Yufang Xu ,  Jian Ding ,  Liping Lin ,  Zehong Miao ,  Hong Zhu ,  Baoyuan Qu

发明人： Xuhong Qian ,  Yonggang Li ,  Yufang Xu ,  Jian Ding ,  Liping Lin ,  Zehong Miao ,  Hong Zhu ,  Baoyuan Qu

IPC分类号： A61K31/496 ,  A61K31/4743 ,  A61K31/473 ,  C07D498/02 ,  C07D403/02

CPC分类号： C07D495/06 ,  C07D221/14 ,  C07D405/12 ,  C07D513/06 ,  C09B57/08 ,  C09B69/102 ,  C09B69/109

摘要： The invention discloses novel sulfur-containing naphthalimide derivatives, and the preparation and uses thereof. The conjugated plane of naphthalimide derivatives of the invention is enlarged by incorporating 5-or 6-membered heteroaromatic ring and/or introducing S heteroatom, thus increasing the anti-tumor activity of naphthalimide. The compounds of the invention displays significant inhibiting activities to the proliferation of various tumor cells such as human lung cancer, gastric cancer, liver cancer, leucocythemia and the like. The inhibition of cell proliferation is dose-dependent.

公开(公告)号：US07541463B2

公开(公告)日：2009-06-02

申请号：US11263591

申请日：2005-10-31

申请人： Xuhong Qian ,  Yonggang Li ,  Yufang Xu ,  Jian Ding ,  Liping Lin ,  Zehong Miao ,  Hong Zhu ,  Baoyuan Qu

发明人： Xuhong Qian ,  Yonggang Li ,  Yufang Xu ,  Jian Ding ,  Liping Lin ,  Zehong Miao ,  Hong Zhu ,  Baoyuan Qu

IPC分类号： A61K31/4365 ,  C07D221/18 ,  C07D471/06

CPC分类号： C07D495/06 ,  C07D221/14 ,  C07D405/12 ,  C07D513/06 ,  C09B57/08 ,  C09B69/102 ,  C09B69/109

摘要： The invention discloses novel sulfur-containing naphthalimide derivatives, and the preparation and uses thereof. The conjugated plane of naphthalimide derivatives of the invention is enlarged by incorporating 5-or 6-membered heteroaromatic ring and/or introducing S heteroatom, thus increasing the anti-tumor activity of naphthalimide. The compounds of the invention displays significant inhibiting activities to the proliferation of various tumor cells such as human lung cancer, gastric cancer, liver cancer, leucocythemia and the like. The inhibition of cell proliferation is dose-dependent.

摘要翻译： 本发明公开了新型含硫萘二甲酰亚胺衍生物及其制备及应用。 本发明的萘二甲酰亚胺衍生物的共轭平面通过掺入5-或6-元杂芳环和/或引入S杂原子而增大，从而增加了萘二甲酰亚胺的抗肿瘤活性。 本发明化合物对人肺癌，胃癌，肝癌，白细胞增多症等各种肿瘤细胞的增殖具有显着的抑制活性。 细胞增殖的抑制是剂量依赖性的。

公开(公告)号：US20080234287A1

公开(公告)日：2008-09-25

申请号：US12116452

申请日：2008-05-07

申请人： Xuhong Qian ,  Yonggang Li ,  Yufang Xu ,  Jian Ding ,  Liping Lin ,  Zehong Miao ,  Hong Zhu ,  Baoyuan Qu

发明人： Xuhong Qian ,  Yonggang Li ,  Yufang Xu ,  Jian Ding ,  Liping Lin ,  Zehong Miao ,  Hong Zhu ,  Baoyuan Qu

IPC分类号： A61K31/497 ,  C07D221/18 ,  A61K31/4365 ,  C07D401/14 ,  A61P35/00

CPC分类号： C07D495/06 ,  C07D221/14 ,  C07D405/12 ,  C07D513/06 ,  C09B57/08 ,  C09B69/102 ,  C09B69/109

摘要： The invention discloses novel sulfur-containing naphthalimide derivatives, and the preparation and uses thereof. The conjugated plane of naphthalimide derivatives of the invention is enlarged by incorporating 5- or 6-membered heteroaromatic ring and/or introducing S heteroatom, thus increasing the anti-tumor activity of naphthalimide. The compounds of the invention displays significant inhibiting activities to the proliferation of various tumor cells such as human lung cancer, gastric cancer, liver cancer, leucocythemia and the like. The inhibition of cell proliferation is dose-dependent.

摘要翻译： 本发明公开了新型含硫萘二甲酰亚胺衍生物及其制备及应用。 本发明的萘二甲酰亚胺衍生物的共轭平面通过引入5或6元杂芳环和/或引入S杂原子而增大，从而增加了萘二甲酰亚胺的抗肿瘤活性。 本发明化合物对人肺癌，胃癌，肝癌，白细胞增多症等各种肿瘤细胞的增殖具有显着的抑制活性。 细胞增殖的抑制是剂量依赖性的。

公开(公告)号：US08552564B2

公开(公告)日：2013-10-08

申请号：US12964457

申请日：2010-12-09

申请人： Mihir K. Roy ,  Islam Salama ,  Yonggang Li

发明人： Mihir K. Roy ,  Islam Salama ,  Yonggang Li

IPC分类号： H01L23/48

CPC分类号： H05K3/422 ,  G06F1/183 ,  H01L23/492 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L2924/0002 ,  Y10T29/49165 ,  H01L2924/00

摘要： A semiconductor device substrate includes a front section and back section that are laminated cores disposed on a front- and back surfaces of a first core. The first core has a cylindrical plated through hole that has been metal plated and filled with air-core material. The front- and back sections have laser-drilled tapered vias that are filled with conductive material and that are coupled to the plated through hole. The back section includes an integral inductor coil that communicates to the front section. The first core and the laminated-cores form a hybrid-core semiconductor device substrate with an integral inductor coil.

摘要翻译： 半导体器件基板包括前部和后部，其是设置在第一芯的前表面和后表面上的层叠芯。 第一芯具有圆柱形电镀通孔，其已被金属电镀并填充有空芯材料。 前部和后部具有激光钻孔的锥形通孔，其填充有导电材料并且连接到电镀通孔。 后部包括与前部连通的整体电感线圈。 第一芯和层叠芯形成具有集成电感线圈的混合芯半导体器件衬底。

公开(公告)号：US08227706B2

公开(公告)日：2012-07-24

申请号：US12347600

申请日：2008-12-31

申请人： Mihir Roy ,  Mahadevan Suryakumar ,  Yonggang Li

发明人： Mihir Roy ,  Mahadevan Suryakumar ,  Yonggang Li

IPC分类号： H05K1/11

CPC分类号： H01L21/76877 ,  H01L21/50 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/15311 ,  H05K1/0222 ,  H05K3/4046 ,  H05K3/42 ,  H05K3/4602 ,  H05K2201/09809 ,  H05K2201/09827 ,  H05K2201/10265 ,  H05K2201/10287 ,  H01L2224/0401

摘要： In some embodiments, coaxial plated through holes (PTH) for robust electrical performance are presented. In this regard, an apparatus is introduced comprising an integrated circuit device and a substrate coupled with the integrated circuit device, wherein the substrate includes: a plated through hole, the plated through hole filled with dielectric material and a coaxial copper wire, and conductive traces to separately route the plated through hole and the coaxial copper wire. Other embodiments are also disclosed and claimed.

摘要翻译： 在一些实施例中，呈现用于鲁棒电性能的同轴电镀通孔（PTH）。 在这方面，引入了包括集成电路器件和与集成电路器件耦合的衬底的器件，其中衬底包括：电镀通孔，填充有介电材料的电镀通孔和同轴铜线，以及导电迹线 以分开布线电镀通孔和同轴铜线。 还公开并要求保护其他实施例。

公开(公告)号：US08183496B2

公开(公告)日：2012-05-22

申请号：US12319016

申请日：2008-12-30

申请人： Yonggang Li ,  Islam Salama

发明人： Yonggang Li ,  Islam Salama

IPC分类号： B23K26/36

CPC分类号： B23K26/082 ,  B23K26/066 ,  B23K26/361 ,  B23K26/40 ,  B23K2101/40 ,  B23K2103/50 ,  Y10T29/49155 ,  Y10T428/24306

摘要： A method of forming a pattern (700) on a work piece (1260) includes placing a pattern mask (1210) over the work piece, placing an aperture (100, 500, 600, 1220) over the pattern mask, and placing the work piece in a beam of electromagnetic radiation (1240). The aperture includes three adjacent sections. A first section (310) has a first side (311), a second side (312), and a first length (313). A second section (320) has a third side (321) adjacent to the second side, a fourth side (322), a second length (323), and a first width (324). A third section (330) has a fifth side (331) adjacent to the fourth side, a sixth side (332), and a third length (333). The first and third lengths are substantially equal. The first and third sections are complementary shapes, as defined herein.

摘要翻译： 在工件（1260）上形成图案（700）的方法包括将图案掩模（1210）放置在工件上方，在图案掩模上放置孔（100,500,600,1220），并将工件 在电磁辐射束（1240）中。 光圈包括三个相邻的部分。 第一部分（310）具有第一侧（311），第二侧（312）和第一长度（313）。 第二部分（320）具有与第二侧相邻的第三侧（321），第四侧（322），第二长度（323）和第一宽度（324）。 第三部分（330）具有与第四侧相邻的第五侧（331），第六侧（332）和第三长度（333）。 第一和第三长度基本相等。 第一和第三部分是如本文所定义的互补形状。

公开(公告)号：US20100126009A1

公开(公告)日：2010-05-27

申请号：US12315066

申请日：2008-11-25

申请人： Yonggang Li ,  Islam Salama

发明人： Yonggang Li ,  Islam Salama

IPC分类号： H05K3/42

CPC分类号： H05K3/107 ,  H05K3/0038 ,  H05K3/027 ,  H05K3/108 ,  H05K3/184 ,  H05K2201/0376 ,  H05K2201/0394 ,  H05K2201/09563 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165

摘要： A method of enabling selective area plating on a substrate (201) includes forming a first electrically conductive layer (310) on the substrate, covering the electrically conductive layer with an anti-electroless plating layer (410), patterning the substrate in order to form therein a feature (510, 520) extending through the anti-electroless plating layer and the first electrically conductive layer, forming a second electrically conductive layer (610) adjoining and electrically connected to the first electrically conductive layer, forming a third electrically conductive layer (710) over the second electrically conductive layer, and removing the anti-electroless plating layer and the first electrically conductive layer.

摘要翻译： 在衬底（201）上进行选择性区域电镀的方法包括在衬底上形成第一导电层（310），用抗化学镀层（410）覆盖导电层，图案化衬底以形成 其中延伸穿过抗化学镀层和第一导电层的特征（510,520），形成邻接并电连接到第一导电层的第二导电层（610），形成第三导电层（ 710），并且去除所述防电镀层和所述第一导电层。

公开(公告)号：US07603883B2

公开(公告)日：2009-10-20

申请号：US11821640

申请日：2007-06-25

申请人： Nathaniel R. Quick ,  Aravinda Kar ,  Yonggang Li ,  Raymond R. McNeice

发明人： Nathaniel R. Quick ,  Aravinda Kar ,  Yonggang Li ,  Raymond R. McNeice

IPC分类号： B21B45/00

CPC分类号： B21C37/042 ,  B21C1/003 ,  B21C1/02 ,  B21C1/12 ,  B21C37/047 ,  Y10S72/70

摘要： An apparatus and method is disclosed for drawing continuous metallic wire having a first diameter to a metallic fiber having a reduced second diameter. A feed mechanism moves the wire at a first linear velocity. A laser beam heats a region of the wire to an elevated temperature. A draw mechanism draws the heated wire at a second and greater linear velocity for providing a drawn metallic fiber having the reduced second diameter.

摘要翻译： 公开了一种用于将具有第一直径的连续金属丝拉制成具有减小的第二直径的金属纤维的装置和方法。 进给机构以第一线速度移动线。 激光束将导线的区域加热到升高的温度。 牵引机构以第二和更大的线速度牵引加热的线，以提供具有减小的第二直径的拉伸金属纤维。

公开(公告)号：US07407878B2

公开(公告)日：2008-08-05

申请号：US11540074

申请日：2006-09-28

申请人： Yonggang Li

发明人： Yonggang Li

IPC分类号： H01L21/44

CPC分类号： H05K3/3478 ,  H01L24/11 ,  H01L2224/05144 ,  H01L2224/05155 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/0558 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2224/1131 ,  H01L2224/1132 ,  H01L2224/11334 ,  H01L2224/1147 ,  H01L2224/11472 ,  H01L2224/11552 ,  H01L2224/13099 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01052 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15787 ,  H05K3/1216 ,  H05K3/3484 ,  H05K3/3494 ,  H05K2203/041 ,  H05K2203/043 ,  H05K2203/0557 ,  H05K2203/107 ,  H01L2924/00 ,  H01L2924/00014

摘要： A method of providing electrically conductive bumps on electrode pads of a microelectronic substrate. The method includes: providing a microelectronic substrate including electrode pads exhibiting an electrode pad pattern; providing solder portions onto respective ones of the electrode pads according to the electrode pad pattern; reflowing the solder portions to form solder bumps therefrom, reflowing comprising applying localized heating to each of the solder portions to reflow the same.

公开(公告)号：US07237422B2

公开(公告)日：2007-07-03

申请号：US11264877

申请日：2005-11-01

申请人： Nathaniel R. Quick ,  Aravinda Kar ,  Yonggang Li ,  Raymond R. McNeice

发明人： Nathaniel R. Quick ,  Aravinda Kar ,  Yonggang Li ,  Raymond R. McNeice

IPC分类号： B21D37/16

CPC分类号： B21C37/042 ,  B21C1/003 ,  B21C1/02 ,  B21C1/12 ,  B21C37/047 ,  Y10S72/70

摘要： An apparatus and method is disclosed for drawing continuous metallic wire having a first diameter to a metallic fiber having a reduced second diameter. A feed mechanism moves the wire at a first linear velocity. A laser beam heats a region of the wire to an elevated temperature. A draw mechanism draws the heated wire at a second and greater linear velocity for providing a drawn metallic fiber having the reduced second diameter.

摘要翻译： 公开了一种用于将具有第一直径的连续金属丝拉制成具有减小的第二直径的金属纤维的装置和方法。 进给机构以第一线速度移动线。 激光束将导线的区域加热到升高的温度。 牵引机构以第二和更大的线速度牵引加热的线，以提供具有减小的第二直径的拉伸金属纤维。