公开(公告)号：US08679433B2

公开(公告)日：2014-03-25

申请号：US13589024

申请日：2012-08-17

申请人： Qinghua Yin ,  Xiwang Qi ,  Maximilian A. Biberger ,  Jayashir Sarkar

发明人： Qinghua Yin ,  Xiwang Qi ,  Maximilian A. Biberger ,  Jayashir Sarkar

IPC分类号： B01D53/94 ,  B01J23/40 ,  F01N3/10 ,  F01N3/28

CPC分类号： B01D53/944 ,  B01D53/945 ,  B01D2255/1021 ,  B01D2255/1023 ,  B01D2255/2092 ,  B01D2255/30 ,  B01D2255/50 ,  B01D2255/9022 ,  B01D2255/912 ,  B01D2255/9155 ,  B01D2255/9202 ,  B01D2258/012 ,  B01J21/04 ,  B01J23/44 ,  B01J23/63 ,  B01J29/04 ,  B01J29/06 ,  B01J29/068 ,  B01J35/0006 ,  B01J35/0013 ,  B01J35/0066 ,  B01J35/023 ,  B01J35/04 ,  B01J37/0018 ,  B01J37/0213 ,  B01J37/0244 ,  B01J37/0246 ,  B01J37/16 ,  B01J37/349 ,  B01J2229/42

摘要： Disclosed are, inter alia, methods of forming coated substrates for use in catalytic converters, as well as washcoat compositions and methods suitable for using in preparation of the coated substrates, and the coated substrates formed thereby. The catalytic material is prepared by a plasma-based method, yielding catalytic material with a lower tendency to migrate on support at high temperatures, and thus less prone to catalyst aging after prolonged use. Also disclosed are catalytic converters using the coated substrates, which have favorable properties as compared to catalytic converters using catalysts deposited on substrates using solution chemistry. Also disclosed are exhaust treatment systems, and vehicles, such as diesel vehicles, particularly light-duty diesel vehicles, using catalytic converters and exhaust treatment systems using the coated substrates.

摘要翻译： 公开了形成用于催化转化器的涂覆基材的方法以及适用于制备涂覆的基材的修补基面涂料组合物和方法以及由此形成的涂布的基材。 催化材料通过等离子体法制备，产生在高温下在载体上迁移倾向较低的催化材料，因此在长时间使用后较不容易催化剂老化。 还公开了使用涂覆的基材的催化转化器，与使用溶液化学沉积在基板上的催化剂相比，催化转化器具有优良的性能。 还公开了排气处理系统和车辆，例如使用催化转化器的柴油车辆，特别是轻型柴油车辆，以及使用涂覆的基底的排气处理系统。

公开(公告)号：US20110144382A1

公开(公告)日：2011-06-16

申请号：US12969264

申请日：2010-12-15

申请人： Qinghua Yin ,  Xiwang Qi

发明人： Qinghua Yin ,  Xiwang Qi

IPC分类号： B01J23/42 ,  B01J23/00 ,  B01J23/46 ,  B01J21/02 ,  B01J37/00 ,  C07C201/12 ,  C07C209/36 ,  C07C67/00 ,  B82Y30/00 ,  B82Y40/00

CPC分类号： B01J23/8926 ,  B01J23/42 ,  B01J35/0013 ,  B01J37/00 ,  B01J37/009 ,  B01J37/0211 ,  B01J37/32 ,  B01J37/349 ,  B28B23/0087 ,  B32B7/12 ,  B32B37/14 ,  B82Y30/00 ,  B82Y40/00

摘要： A catalyst comprising a plurality of support nanoparticles and a plurality of catalytic nanoparticles. At least one catalytic nanoparticle is bonded to each support nanoparticle. The catalytic particles have a size and a concentration, wherein a first configuration of the size and the concentration of the catalytic nanoparticles enables a first catalysis result and a second configuration of the size and the concentration of the catalytic nanoparticles enables a second catalysis result, with the first and second configurations having a different size or concentration, and the first and second catalysis results being different. In some embodiments, the first catalysis result is a selective reduction of a first selected functional group without reducing one or more other functional groups, and the second catalysis result is a selective reduction of a second selected functional group without reducing one or more other functional groups.

摘要翻译： 包含多个载体纳米颗粒和多个催化纳米颗粒的催化剂。 至少一种催化纳米颗粒结合到每个载体纳米颗粒上。 催化颗粒具有尺寸和浓度，其中催化纳米颗粒的尺寸和浓度的第一配置使得能够实现第一催化结果，并且催化纳米颗粒的尺寸和浓度的第二配置使得能够产生第二催化结果， 第一和第二构型具有不同的尺寸或浓度，第一和第二催化结果不同。 在一些实施方案中，第一催化结果是选择性还原第一选择的官能团而不减少一个或多个其它官能团，并且第二催化结果是选择性还原第二选择的官能团而不减少一个或多个其它官能团 。

公开(公告)号：US20110143933A1

公开(公告)日：2011-06-16

申请号：US12962490

申请日：2010-12-07

申请人： Qinghua Yin ,  Xiwang Qi ,  Maximilian A. Biberger

发明人： Qinghua Yin ,  Xiwang Qi ,  Maximilian A. Biberger

IPC分类号： B01J23/42 ,  B01J35/02 ,  B01J23/46 ,  B01J21/04 ,  B01J21/06 ,  B01J23/44 ,  B82Y30/00

CPC分类号： B01J23/8926 ,  B01J21/04 ,  B01J23/42 ,  B01J23/44 ,  B01J23/464 ,  B01J35/0013 ,  B01J35/04 ,  B01J37/00 ,  B01J37/009 ,  B01J37/0211 ,  B01J37/32 ,  B01J37/349 ,  B28B23/0087 ,  B32B7/12 ,  B32B37/14 ,  B82Y30/00 ,  B82Y40/00 ,  C23C4/134 ,  Y02T10/22

摘要： Embodiments of present inventions are directed to an advanced catalyst. The advanced catalyst includes a honeycomb structure with an at least one nano-particle on the honeycomb structure. The advanced catalyst used in diesel engines is a two-way catalyst. The advanced catalyst used in gas engines is a three-way catalyst. In both the two-way catalyst and the three-way catalyst, the at least one nano-particle includes nano-active material and nano-support. The nano-support is typically alumina. In the two-way catalyst, the nano-active material is platinum. In the three-way catalyst, the nano-active material is platinum, palladium, rhodium, or an alloy. The alloy is of platinum, palladium, and rhodium.

摘要翻译： 本发明的实施方案涉及先进的催化剂。 先进的催化剂包括在蜂窝结构上具有至少一个纳米颗粒的蜂窝结构。 用于柴油发动机的先进催化剂是双向催化剂。 燃气发动机中使用的先进催化剂是三元催化剂。 在双向催化剂和三元催化剂中，至少一种纳米颗粒包括纳米活性材料和纳米支撑体。 纳米载体通常是氧化铝。 在双向催化剂中，纳米活性材料是铂。 在三元催化剂中，纳米活性材料是铂，钯，铑或合金。 该合金是铂，钯和铑。

公开(公告)号：US20110143930A1

公开(公告)日：2011-06-16

申请号：US12962518

申请日：2010-12-07

申请人： Qinghua Yin ,  Xiwang Qi ,  Maximilian A. Biberger ,  David Leamon

发明人： Qinghua Yin ,  Xiwang Qi ,  Maximilian A. Biberger ,  David Leamon

IPC分类号： B01J23/42 ,  B01J35/02 ,  B01J21/04 ,  B01J21/08 ,  B01J21/06 ,  B01J21/18 ,  B01J21/12 ,  C23C16/52 ,  B82Y30/00

CPC分类号： B01J23/8926 ,  B01J23/42 ,  B01J35/0013 ,  B01J35/006 ,  B01J37/00 ,  B01J37/009 ,  B01J37/0203 ,  B01J37/0211 ,  B01J37/0238 ,  B01J37/32 ,  B01J37/349 ,  B28B23/0087 ,  B32B7/12 ,  B32B37/14 ,  B82Y30/00 ,  B82Y40/00 ,  C23C4/134

摘要： A method of tuning the size of an nano-active material on a nano-carrier material comprising: providing a starting portion of a carrier material and a starting portion of an active material in a first ratio; adjusting the first ratio, forming a second ratio, thereby tuning the ratio of active material and carrier material; combining the portion of the active material in a vapor phase and the portion of the carrier material in a vapor phase, forming a conglomerate in a vapor phase; and changing the phase of the conglomerate, thereby forming nano-spheres comprising a nano-carrier material decorated with a nano-active material, wherein the size of the nano-active material is dependent upon the second ratio.

摘要翻译： 调整纳米载体材料上的纳米活性材料的尺寸的方法，包括：以第一比例提供载体材料的起始部分和活性材料的起始部分; 调整第一比例，形成第二比例，从而调节活性材料和载体材料的比例; 将气相中活性物质的一部分与载气材料部分气相结合，形成气相中的砾岩; 并改变聚集体的相，由此形成纳米载体，其纳米载体材料用纳米活性材料装饰，其中纳米活性材料的尺寸取决于第二比例。

公开(公告)号：US20220088572A1

公开(公告)日：2022-03-24

申请号：US16948463

申请日：2020-09-18

申请人： Xiwang Qi ,  Mei Jiang

发明人： Xiwang Qi ,  Mei Jiang

IPC分类号： B01J21/18 ,  B01D53/86 ,  A61L9/014 ,  B01J29/70 ,  B01J29/40 ,  B01J29/08 ,  B01J29/18 ,  B01J23/10

摘要： Described is related to nano-structured composite materials for removing harmful chemical air pollutants and odors from the air to prevent people from breathing in disease-causing chemicals and provide them with clean indoor air. The nano-structured composite materials comprise nano-catalysts embedded in the pores of nano-structured substrate materials selected from the group consisting of nano-porous carbon, nano-porous rare earth oxide, nano-porous zeolite, nano-porous alumina and nano-porous silica. The nano-scale synergy of nano-catalysts and nano-structured substrate materials provides effective air filtration materials for the complete trapping and elimination of the full spectrum of chemical air pollutants including both organic and inorganic compounds and odors for indoor spaces, which HEPA or activated carbon filters cannot achieve.

公开(公告)号：US08456016B2

公开(公告)日：2013-06-04

申请号：US12729821

申请日：2010-03-23

申请人： Yonggang Li ,  Amruthavalli P. Alur ,  Devarajan Balaraman ,  Xiwang Qi ,  Charan K. Gurumurthy

发明人： Yonggang Li ,  Amruthavalli P. Alur ,  Devarajan Balaraman ,  Xiwang Qi ,  Charan K. Gurumurthy

IPC分类号： H01L23/48

CPC分类号： H01L23/15 ,  H01L21/486 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49894 ,  H01L24/12 ,  H01L2224/16235 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/09701 ,  H01L2924/14 ,  H05K3/0029 ,  H05K3/0032 ,  H05K3/429 ,  H05K3/4605 ,  H05K2201/10674 ,  H01L2224/0401

摘要： A semiconductor package comprises a semiconductor substrate that may comprise a core. The core may comprise one or more materials selected from a group comprising ceramics and glass dielectrics. The package further comprises a set of one or more inner conductive elements that is provided on the core, a set of one or more outer conductive elements that is provided on an outer side of the substrate, and a semiconductor die to couple to the substrate via one or more of the outer conductive elements. Example materials for the core may comprise one or more from alumina, zirconia, carbides, nitrides, fused silica, quartz, sapphire, and Pyrex. A laser may be used to drill one or more plated through holes to couple an inner conductive element to an outer conductive element. A dielectric layer may be formed in the substrate to insulate an outer conductive element from the core or an inner conductive element.

摘要翻译： 半导体封装包括可包括芯的半导体衬底。 芯可以包括选自包括陶瓷和玻璃电介质的组中的一种或多种材料。 所述封装还包括设置在所述芯上的一组或多个内部导电元件，设置在所述基板的外侧上的一组或多个外部导电元件的集合，以及半导体管芯，以通过 一个或多个外部导电元件。 芯的示例性材料可以包括氧化铝，氧化锆，碳化物，氮化物，熔融二氧化硅，石英，蓝宝石和派雷克斯中的一种或多种。 可以使用激光器来钻一个或多个电镀通孔，以将内部导电元件耦合到外部导电元件。 介电层可以形成在衬底中以使外部导电元件与芯或内部导电元件绝缘。

公开(公告)号：US07989118B2

公开(公告)日：2011-08-02

申请号：US12791266

申请日：2010-06-01

申请人： Richard Scott Bourgeois ,  Richard Louis Hart ,  Sauri Gudlavalleti ,  Shu Ching Quek ,  Andrew Philip Shapiro ,  Rong Fan ,  Dacong Weng ,  Xiwang Qi

发明人： Richard Scott Bourgeois ,  Richard Louis Hart ,  Sauri Gudlavalleti ,  Shu Ching Quek ,  Andrew Philip Shapiro ,  Rong Fan ,  Dacong Weng ,  Xiwang Qi

IPC分类号： H01M2/20 ,  H01M8/24 ,  H01M2/08 ,  H01M2/14

CPC分类号： H01M8/0271 ,  H01M8/0282 ,  H01M8/0297 ,  H01M8/2404 ,  H01M8/2425 ,  H01M8/2483 ,  H01M2008/1293 ,  Y02P70/56

摘要： A method of manufacturing a fuel cell stack is provided. The method provides forming an inspectable preassembly of multiple fuel cell assemblies that may be termed a pseudostack. Each fuel cell in the pseudostack has permanent electrical interconnections and sealing connections on only one of the two electrodes, namely an anode layer or a cathode layer. For example, an anode interconnect may be firmly attached to the anode layer by means of a bonding agent and a sealing agent used to seal passages on the anode layer of the fuel cell. Alternatively, seals and permanent electrical connections may be made on the cathode layer of the fuel cell, and not on the anode layer.

摘要翻译： 提供一种制造燃料电池堆的方法。 该方法提供了形成可被称为假舱的多个燃料电池组件的可检查的预组装。 假垛架中的每个燃料电池在仅两个电极中的一个即阳极层或阴极层上具有永久的电互连和密封连接。 例如，阳极互连可以通过粘合剂和用于密封燃料电池的阳极层上的通道的密封剂牢固地附接到阳极层。 或者，可以在燃料电池的阴极层上而不是在阳极层上形成密封件和永久电连接。

公开(公告)号：US20100289154A1

公开(公告)日：2010-11-18

申请号：US12729821

申请日：2010-03-23

申请人： Yonggang Li ,  Amruthavalll P. Alur ,  Devarajan Balaraman ,  Xiwang Qi ,  Charan K. Gurumurthy

发明人： Yonggang Li ,  Amruthavalll P. Alur ,  Devarajan Balaraman ,  Xiwang Qi ,  Charan K. Gurumurthy

IPC分类号： H01L23/48

CPC分类号： H01L23/15 ,  H01L21/486 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49894 ,  H01L24/12 ,  H01L2224/16235 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/09701 ,  H01L2924/14 ,  H05K3/0029 ,  H05K3/0032 ,  H05K3/429 ,  H05K3/4605 ,  H05K2201/10674 ,  H01L2224/0401

摘要： A semiconductor package comprises a semiconductor substrate that may comprise a core. The core may comprise one or more materials selected from a group comprising ceramics and glass dielectrics. The package further comprises a set of one or more inner conductive elements that is provided on the core, a set of one or more outer conductive elements that is provided on an outer side of the substrate, and a semiconductor die to couple to the substrate via one or more of the outer conductive elements. Example materials for the core may comprise one or more from alumina, zirconia, carbides, nitrides, fused silica, quartz, sapphire, and Pyrex. A laser may be used to drill one or more plated through holes to couple an inner conductive element to an outer conductive element. A dielectric layer may be formed in the substrate to insulate an outer conductive element from the core or an inner conductive element.

公开(公告)号：US20100078805A1

公开(公告)日：2010-04-01

申请号：US12242414

申请日：2008-09-30

申请人： Yonggang Li ,  Amruthavalli P. Alur ,  Devarajan Balaraman ,  Xiwang Qi ,  Charan K. Gurumurthy

发明人： Yonggang Li ,  Amruthavalli P. Alur ,  Devarajan Balaraman ,  Xiwang Qi ,  Charan K. Gurumurthy

IPC分类号： H01L23/48 ,  H01L23/535 ,  H01L21/02

CPC分类号： H01L23/15 ,  H01L21/486 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49894 ,  H01L24/12 ,  H01L2224/16235 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/09701 ,  H01L2924/14 ,  H05K3/0029 ,  H05K3/0032 ,  H05K3/429 ,  H05K3/4605 ,  H05K2201/10674 ,  H01L2224/0401

摘要： A semiconductor package comprises a semiconductor substrate that may comprise a core. The core may comprise one or more materials selected from a group comprising ceramics and glass dielectrics. The package further comprises a set of one or more inner conductive elements that is provided on the core, a set of one or more outer conductive elements that is provided on an outer side of the substrate, and a semiconductor die to couple to the substrate via one or more of the outer conductive elements. Example materials for the core may comprise one or more from alumina, zirconia, carbides, nitrides, fused silica, quartz, sapphire, and Pyrex. A laser may be used to drill one or more plated through holes to couple an inner conductive element to an outer conductive element. A dielectric layer may be formed in the substrate to insulate an outer conductive element from the core or an inner conductive element.

摘要翻译： 半导体封装包括可包括芯的半导体衬底。 芯可以包括选自包括陶瓷和玻璃电介质的组中的一种或多种材料。 所述封装还包括设置在所述芯上的一组或多个内部导电元件，设置在所述基板的外侧上的一组或多个外部导电元件的集合，以及半导体管芯，以通过 一个或多个外部导电元件。 芯的示例性材料可以包括氧化铝，氧化锆，碳化物，氮化物，熔融二氧化硅，石英，蓝宝石和派雷克斯中的一种或多种。 可以使用激光器来钻一个或多个电镀通孔，以将内部导电元件耦合到外部导电元件。 介电层可以形成在衬底中以使外部导电元件与芯或内部导电元件绝缘。

公开(公告)号：US20090250824A1

公开(公告)日：2009-10-08

申请号：US12098311

申请日：2008-04-04

申请人： Xiwang Qi ,  Charan K. Gurumurthy ,  Tamil Selvy Selvamuniandy ,  Isao Yamada

发明人： Xiwang Qi ,  Charan K. Gurumurthy ,  Tamil Selvy Selvamuniandy ,  Isao Yamada

IPC分类号： H01L23/48 ,  H01L21/00

CPC分类号： H05K3/3426 ,  H01L23/49811 ,  H01L23/49827 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2924/01046 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/01327 ,  H01L2924/15312 ,  H05K2201/10318 ,  H05K2201/10772 ,  Y02P70/613 ,  H01L2924/00

摘要： A semiconductor package comprises a substrate that utilizes one or more pins to form external interconnects. The pins are bonded to bonding pads on the substrate by solder. The pins may each has a pin head that may have a bonding surface, wherein the bonding surface may comprises a center portion and a side portion that is tapered away relative to the center portion. In some embodiments, the bonding surface may comprise a round shape. In some embodiments, a gas escape path may be provided by the shape of the bonding surface to increase pin pull strength and/or solder strength. The package may further comprise a surface finish that may comprise a palladium layer with a reduced thickness to reduce the amount of palladium based IMC precipitation into the solder.

摘要翻译： 半导体封装包括利用一个或多个引脚形成外部互连的基板。 引脚通过焊料与基板上的焊盘接合。 销可以各自具有可以具有接合表面的销头，其中接合表面可以包括中心部分和相对于中心部分逐渐变细的侧部部分。 在一些实施例中，接合表面可以包括圆形。 在一些实施例中，可以通过接合表面的形状提供气体逸出路径，以增加引脚拉伸强度和/或焊接强度。 该封装还可以包括表面光洁度，其可以包括具有减小厚度的钯层，以减少基于钯的IMC沉淀到焊料中的量。