Abstract:
An electrical device which comprises first and second laminar electrodes and a laminar PTC resistive element sandwiched between them, the device comprising (a) a main portion which comprises a main part of the first electrode, a main part of the second electrode, and a main part of the resistive element; and (b) a first connection leg which extends away from the main portion and which comprises a first leg part of the first electrode which is integral with the main part of the first electrode, and a first leg part of the resistive element which is integral with the main part of the resistive element. Such devices can be secured to circuit boards in a variety of ways, and to elastically deformed terminals. Preferably preferred devices contain two laminar electrodes, with a PTC element between them, and a cross-conductor which passes through the thickness of the device and contacts one only of the two electrodes. The cross-conductor permits connection to both electrodes from the same side of the device, and also makes it possible to carry out the steps for preparing such devices on an assembly which corresponds to a number of individual devices, with division of the assembly as the final step.
Abstract:
The invention provides an embedded multilayer chip capacitor, and a printed circuit board having the same. The embedded multilayer chip capacitor comprises a capacitor body having a plurality of dielectric layers stacked one on another; a plurality of first and second internal electrodes formed inside the capacitor body, separated by the dielectric layers; and first and second vias extended vertically inside the capacitor body. The first via is connected to the first internal electrodes and the second via is connected to the second internal electrodes. The first via is led to a bottom of the capacitor body and the second via is led to a top of the capacitor body.
Abstract:
A battery holder (210) for mounting a button-type battery (200) on a printed circuit board (220) is provided. The battery holder comprises a resilient electrode plate (212), a ring (214) and a battery cap (216). The resilient electrode plate is soldered to positive contacts (222) of the printed circuit board. An anode of the battery is put on and electrically connects with the resilient electrode plate to thereby connect electrically with the positive contacts on the printed circuit board. The ring is soldered to negative contacts (224) of the printed circuit board and surrounds the resilient electrode plate. The battery is accommodated within the ring. The battery cap is fixed and electrically connected to the ring and covers the battery. The battery cap also electrically contacts with a cathode (202) on a top of the battery. The cathode and anode of the battery are separated by an insulation (206).
Abstract:
A circuit protection device (31) suitable for surface mounting on a substrate (19). The device has a laminar PTC resistive element (3) which is composed of a conductive polymer composition and is positioned between first and second electrodes (5,7). Attached to the first electrode is a first electrical terminal (33) containing an electrically conductive material which has a first attachment portion (35) connected to a first flexible portion (39) by means of a first connection portion (47). At least part of the first flexible portion is free of attachment to the first electrode. The first attachment portion is coplanar with at least one of the first connection portion and the first flexible portion. The first attachment portion may contain a slot (49) and a solid hinge portion (51). When the device is mounted on a substrate by means of a mounting component (41) extending from the first terminal, the first flexible portion allows contraction and expansion of the conductive polymer despite the rigid attachment of the mounting component onto the substrate.
Abstract:
The invention relates to a device for interconnecting, in three dimensions, electronic components. In order to decrease the parasitic capacitances between the connections and shielding of the device, metallized grooves are cut in the block of stacked circuits, just clipping the connection to conductors of which are set back from the corresponding face of the block. The assembly is then encapsulated with resin and shielded by metallization. The invention is especially applicable to producing electronic systems in three dimensions with a small size.
Abstract:
A method for achieving a desired value of electrical impedance between conductors of an electrical power distribution structure by electrically coupling multiple bypass capacitors and corresponding electrical resistance elements in series between the conductors. The resistance elements may be annular resistors, and may provide the designer a greater degree of control of the system ESR. The annular resistors may comprise a first terminal, an annular resistor, and a second terminal. The second terminal may be located within the confines of the annular resistor. The annular resistors may be printed onto a conductive plane (e.g. a power plane or a ground plane), or may be a discrete component.
Abstract:
A PTC device formed integrally on a PCB substrate, such a PCB substrate, a secondary battery protection circuit device comprising such PCB substrate provided with a circuit to control the voltage and current of secondary batteries, and a secondary battery assembly provided with said device. A PCB substrate 1 is provided with an electronic component 2 and a PTC device 3. The PTC device 3 has a construction having a PTC material 6 in the center, which is provided with foils 7, 7′ made of nickel foil on its top and bottom; an outlet electrode 4 is provided on the foil 7, and an outlet electrode 5, provided on the PCB substrate, is soldered below.
Abstract:
A thermistor with positive resistance-to-temperature characteristic used in a overcurrent protection circuit has electrodes on mutually opposite main surfaces and is mounted to a substrate having electrically conductive members such that deterioration of its voltage resistance due to heat emission can be controlled. A spacer with smaller thermal conductivity than the substrate and penetrated by a conductor piece with a small cross-sectional area is inserted between solder materials connecting to one of the thermistor electrodes. The other electrode is contacted by an elongated connecting member through its sectional surface transverse to its longitudinal direction such that the cross-sectional area of electrical conduction is reduced.
Abstract:
A method for achieving a desired value of electrical impedance between conductors of an electrical power distribution structure by electrically coupling multiple bypass capacitors and corresponding electrical resistance elements in series between the conductors. The resistance elements may be annular resistors, and may provide the designer a greater degree of control of the system ESR. The annular resistors may comprise a first terminal, an annular resistor, and a second terminal. The second terminal may be located within the confines of the annular resistor. The annular resistors may be printed onto a conductive plane (e.g. a power plane or a ground plane), or may be a discrete component.
Abstract:
The invention relates to a method and device for interconnecting, in three dimensions, electronic components. In order to decrease the parasitic capacitances between the connections and shielding (304) of the device, metallized (42) grooves (40, 41) are cut in the block (3null) of stacked circuits, the conductors (21) of which are set back from the corresponding face (302) of the block, these grooves just clipping the connection conductors (21). The assembly is then encapsulated with resin (303) and shielded by metallization (304). The invention is especially applicable to producing electronic systems in three dimensions with a small size.