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    METHOD AND APPARATUS FOR FORMING ELECTRODE BY USING INKJET PRINTING
    53.
    发明公开
    METHOD AND APPARATUS FOR FORMING ELECTRODE BY USING INKJET PRINTING 审中-公开

    公开(公告)号：US20230215605A1

    公开(公告)日：2023-07-06

    申请号：US17989240

    申请日：2022-11-17

    Applicant: GOSANTECH CO., LTD.

    Inventor： Dongkyun SHIN

    IPC: H01B13/00

    CPC classification number: H01B13/0036

    Abstract: Proposed is a method of forming an electrode on a surface of an object by using inkjet printing, the method including forming a buffer on an outer edge of an electrode formation position, and forming the electrode by filling electrode ink inside the buffer, wherein the buffer formation is performed by stacking buffer layers formed by inkjet printing of buffer ink, and hydrophilicity of a surface of each of the buffer layers is lower than hydrophilicity of the object surface. According to an electrode forming apparatus, the buffer constituting the outer edge of the electrode is formed high and the electrode ink is filled inside the buffer to form the electrode, thereby enabling the formation of the electrode having an increased sectional area.

    Wire Drawing Method and Superconducting Wire
    58.
    发明公开
    Wire Drawing Method and Superconducting Wire 审中-公开

    公开(公告)号：US20230154654A1

    公开(公告)日：2023-05-18

    申请号：US17841886

    申请日：2022-06-16

    Applicant: Hitachi, Ltd.

    Inventor： Cheng Ting HSIEH ,  Younjeong HONG

    IPC: H01B12/06 ,  H01B13/00

    CPC classification number: H01B12/06 ,  H01B13/0006

    Abstract: In a wire drawing method, processing stability is ensured by preventing a shape from deforming non-uniformly. The wire drawing method includes: using a first wire that includes a center member, a plurality of first peripheral wires surrounding the center member, and an outer shell disposed outside the first peripheral wires; and reducing a cross-sectional diameter of the first wire by wire drawing. A shape of a cross section perpendicular to a longitudinal direction of the first peripheral wire is a substantially isosceles trapezoidal shape including a long side in contact with the outer shell, a short side in contact with the center member, and a first oblique side and a second oblique side that are in contact with the adjacent peripheral wires.

    PATTERNED NANOPARTICLE STRUCTURES
    59.
    发明公开
    PATTERNED NANOPARTICLE STRUCTURES 审中-公开

    公开(公告)号：US20230154641A1

    公开(公告)日：2023-05-18

    申请号：US18098804

    申请日：2023-01-19

    Applicant: University of Massachusetts

    Inventor： James Watkins ,  Michael R. Beaulieu ,  Nicholas R. Hendricks

    IPC: H01B1/08 ,  H01B3/10 ,  H01B13/00 ,  H01M8/124 ,  H01M4/04 ,  H01M6/40 ,  G02B1/118 ,  H10K71/20

    CPC classification number: H01B1/08 ,  G02B1/118 ,  H01B3/10 ,  H01B13/003 ,  H01M4/04 ,  H01M6/40 ,  H01M8/124 ,  H10K71/211 ,  B82Y30/00

    Abstract: Aspects relate to patterned nanostructures having a feature size not including film thickness of below 5 microns. The patterned nanostructures are made up of nanoparticles having an average particle size of less than 100 nm. A nanoparticle composition, which, in some cases, includes a binder, is applied to a substrate. A patterned mold used in concert with electromagnetic radiation function to manipulate the nanoparticle composition in forming the patterned nanostructure. In some embodiments, the patterned mold nanoimprints a pattern onto the nanoparticle composition and the composition is cured through UV or thermal energy. Three-dimensional patterned nanostructures may be formed. A number of patterned nanostructure layers may be prepared and joined together. In some cases, a patterned nanostructure may be formed as a layer that is releasable from the substrate upon which it is initially formed. Such releasable layers may be arranged to form a three-dimensional patterned nanostructure for suitable applications.

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