公开(公告)号：US07771819B2

公开(公告)日：2010-08-10

申请号：US11416169

申请日：2006-05-03

申请人： Hideo Fukuda ,  Yong Hoon Kim ,  Noriyoshi Fushimi ,  Isamu Kobayashi ,  Minoru Saito ,  Makoto Onodera

发明人： Hideo Fukuda ,  Yong Hoon Kim ,  Noriyoshi Fushimi ,  Isamu Kobayashi ,  Minoru Saito ,  Makoto Onodera

IPC分类号： B32B15/02 ,  H01B7/17

CPC分类号： H01B3/301 ,  H01F27/323 ,  H01F27/324 ,  Y10T428/2933 ,  Y10T428/294 ,  Y10T428/2947

摘要： A multilayer insulated wire has a conductor and two or more extrusion-insulating layers to cover the conductor, wherein at least one layer of the insulating layers other than an innermost layer is formed by a resin mixture containing a polyphenylene sulfide resin (A) as a continuous phase and an olefin-based copolymer ingredient (B) as a dispersed phase, or wherein at least one layer of the insulating layers other than an innermost layer is formed by a resin mixture containing a polyphenylene sulfide resin (A) as a continuous phase, and an olefin-based copolymer ingredient (B) and a polyamide (E) as a dispersed phase; a transformer is made by the multilayer insulated wire.

摘要翻译： 多层绝缘线具有导体和两层以上的挤压绝缘层以覆盖导体，其中除了最内层之外的至少一层绝缘层由含有聚苯硫醚树脂（A）的树脂混合物形成， 连续相和作为分散相的烯烃系共聚物成分（B），或者，通过含有作为连续相的聚苯硫醚树脂（A）的树脂混合物形成至少一层绝缘层以外的最内层 ，和作为分散相的烯烃类共聚物成分（B）和聚酰胺（E） 变压器由多层绝缘电线制成。

公开(公告)号：US07224907B2

公开(公告)日：2007-05-29

申请号：US10459788

申请日：2003-06-12

申请人： Han-Lim Lee ,  Ji-Chai Jeong ,  Yong-Hoon Kim ,  Yun-Je Oh ,  Seong-Taek Hwang

发明人： Han-Lim Lee ,  Ji-Chai Jeong ,  Yong-Hoon Kim ,  Yun-Je Oh ,  Seong-Taek Hwang

IPC分类号： H04B10/04 ,  H04B10/12

CPC分类号： H04B10/505 ,  H04B10/5055 ,  H04B10/508

摘要： A duobinary optical transmission apparatus is provided to generate duobinary optical signals, without using an electric low-pass-filter (LPF), by restricting a bandwidth of a Mach-Zehnder-interferometer-type optical intensity modulator (MZ MOD). Alternatively, a LPF having a single pole with a single capacitor is implemented instead of an expensive LPF, thereby providing a simple transmitter with a lower production cost in comparison with a transmitter using a conventional electric LPF.

摘要翻译： 提供双二进制光传输装置，通过限制马赫 - 曾德干涉仪型光强度调制器（MZ MOD）的带宽，而不使用电气低通滤波器（LPF）来产生双二进制光信号。 或者，实现具有单个电容器的单极点的LPF而不是昂贵的LPF，从而与使用常规电气LPF的发射器相比，提供具有较低生产成本的简单发射器。

公开(公告)号：US06674913B1

公开(公告)日：2004-01-06

申请号：US09693217

申请日：2000-10-20

申请人： Yong-Hoon Kim ,  Kang Gum-Sil

发明人： Yong-Hoon Kim ,  Kang Gum-Sil

IPC分类号： G06K940

CPC分类号： G06T15/20

摘要： A method and apparatus for obtaining high-resolution images of rotating targets by using an image reconstruction algorithm without interpolation, are provided. The method comprises the steps of: a) acquiring initial information; b) calculating parameters; c) computing a start frequency ƒsk and a step frequency &dgr;ƒk; d) measuring data for the target to store them; e) determining whether or not the step d) is completed; f) if the determination result is negative, repeating the steps a) to e); and, if otherwise, obtaining the image; and g) displaying the image. The apparatus comprises means for rotating the controllable target by a predetermined angle; means for generating a first signal; means for transferring the first signal to the controllable target; means for receiving a second signal reflected from the controllable target; means for converting the first and the second signal into a third and forth signal, respectively; and means for processing the third and forth signal to reconstruct an image representing the controllable target, and for controlling the rotating means.

摘要翻译： 提供了一种通过使用无内插的图像重建算法来获得旋转目标的高分辨率图像的方法和装置。 该方法包括以下步骤：a）获取初始信息; b）计算参数; c）计算起始频率fsk和步进频率deltafk; d）测量目标的数据进行存储; e）确定步骤d）是否完成; f）如果确定结果为否定，则重复步骤a）至e）; 如果否则，获取图像; 和g）显示图像。 该装置包括用于使可控对象旋转预定角度的装置; 用于产生第一信号的装置; 用于将第一信号传送到可控目标的装置; 用于接收从可控目标反射的第二信号的装置; 用于分别将第一和第二信号转换成第三和第四信号的装置; 以及用于处理第三和第四信号以重建表示可控目标的图像并且用于控制旋转装置的装置。

公开(公告)号：US6072633A

公开(公告)日：2000-06-06

申请号：US90244

申请日：1998-06-04

申请人： Jung Ho Park ,  Young Jun Park ,  Young Mo Hwang ,  Yong Hoon Kim

发明人： Jung Ho Park ,  Young Jun Park ,  Young Mo Hwang ,  Yong Hoon Kim

IPC分类号： G02F1/29 ,  G02B5/20 ,  G02B5/26 ,  G02B27/14 ,  G02F1/00 ,  B02B27/14

CPC分类号： G02B27/145 ,  G02B27/1006 ,  G02B5/20 ,  G02B5/26

摘要： An apparatus for separating an incident light beam from a light source into three light beams having different colors by a mirror mechanism constructed in a particular way. The apparatus separates white-light into three colors of red, green, and blue and includes a first dichroic mirror, a wide band high-reflection mirror, a second dichroic mirror, and a material of air or gas. The first dichroic mirror allows only a light beam with a first wavelength to penetrate and reflects light beams with other wavelengths, from the incident light beam. The wide band high-reflection mirror reflects the light beam reflected from the first dichroic mirror within the material, and is positioned such that it is parallel to the first dichroic mirror and is spaced therefrom by a predetermined interval. The second dichroic mirror allows only a light beam with a second wavelength different from the first wavelength to penetrate in a direction that is parallel to the light beam with the first wavelength penetrated through the first dichroic mirror and reflects a light beam with a third wavelength different from the first and second wavelengths within the material. The wide band high-reflection mirror reflects the light beam which is reflected from the second dichroic mirror within material and then the reflected light beam with the third wavelength passes outside the material past the second dichroic mirror in a direction that is parallel to the light beam with the second wavelength penetrated through the second dichroic mirror. The material of air or gas is positioned between the first, second dichroic mirrors and the wide band high-reflection mirror, through which the incident light beam and the reflected light beams proceed.

摘要翻译： 一种用于通过以特定方式构造的镜面机构将入射光束从光源分离成具有不同颜色的三个光束的装置。 该装置将白光分为红色，绿色和蓝色三种颜色，包括第一分色镜，宽带高反射镜，第二分色镜以及空气或气体的材料。 第一分色镜仅允许具有第一波长的光束从入射光束穿透并反射具有其它波长的光束。 宽带高反射镜反射从材料内的第一分色镜反射的光束，并且被定位成使其平行于第一分色镜并与之隔开预定的间隔。 第二分色镜仅允许具有不同于第一波长的第二波长的光束在与第一波长穿过第一分色镜的光束平行的方向上穿透，并且反射具有不同的第三波长的光束 从材料内的第一和第二波长。 宽带高反射镜反射在材料内从第二分色镜反射的光束，然后具有第三波长的反射光束在与光束平行的方向上通过材料通过第二分色镜 其中第二波长穿过第二分色镜。 空气或气体的材料位于第一，第二分色镜和宽带高反射镜之间，入射光束和反射光束通过该反射镜进入。

公开(公告)号：US20170212588A1

公开(公告)日：2017-07-27

申请号：US15204108

申请日：2016-07-07

申请人： Yong Hoon KIM

发明人： Yong Hoon KIM

IPC分类号： G06F3/01 ,  G06F3/038 ,  G06F3/0485 ,  G06F3/041 ,  G06F3/02

CPC分类号： G06F3/014 ,  G06F3/0227 ,  G06F3/03547 ,  G06F3/038 ,  G06F3/0414 ,  G06F3/0416 ,  G06F3/0485 ,  G06F2203/0331 ,  G06F2203/0337 ,  G06F2203/0384

摘要： There is provided a wearable pointing device comprising: a body; and a finger-mounted portion coupled to the body, wherein the body comprises: a coordinate input interface configured to sense a touch and movement of a second finger thereon to generate a cursor movement signal; a first button interface disposed on the first face of the body and adjacent to the coordinate input interface, wherein the first button interface is configured to generate a pop-up signal in a response to a pressure input thereto by the second finger; and a scroll input interface disposed on the first face of the body and adjacent to the coordinate input interface, wherein the scroll input interface is configured to generate a screen scrolling signal in a response to a pressure input thereto by the second finger.

公开(公告)号：US20140319701A1

公开(公告)日：2014-10-30

申请号：US14132516

申请日：2013-12-18

申请人： Yong-hoon Kim ,  Hyo-soon Kang ,  Hee-seok Lee ,  Jang-ho Cho

发明人： Yong-hoon Kim ,  Hyo-soon Kang ,  Hee-seok Lee ,  Jang-ho Cho

IPC分类号： H01L25/18 ,  H01L23/50

CPC分类号： H01L25/18 ,  G11C5/025 ,  H01L21/563 ,  H01L23/3107 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/50 ,  H01L24/05 ,  H01L24/06 ,  H01L24/17 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06562 ,  H01L2225/06568 ,  H01L2225/06572 ,  H01L2924/00014 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor chip including a substrate, a first data pad arranged on the substrate, and a first control/address pad arranged on the substrate, wherein the first data pad is arranged in an edge region of the substrate, and the first control/address pad is arranged in a center region of the substrate.

摘要翻译： 一种半导体芯片，包括衬底，布置在衬底上的第一数据焊盘和布置在衬底上的第一控制/寻址焊盘，其中第一数据焊盘布置在衬底的边缘区域中，并且第一控制/地址焊盘 布置在基板的中心区域中。

公开(公告)号：US08873245B2

公开(公告)日：2014-10-28

申请号：US13113239

申请日：2011-05-23

申请人： Yong-hoon Kim ,  Hee-seok Lee

发明人： Yong-hoon Kim ,  Hee-seok Lee

IPC分类号： H05K1/18 ,  H01L25/10 ,  H01L25/065 ,  H05K3/34 ,  H05K3/28

CPC分类号： H05K1/183 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/13025 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/17181 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/06541 ,  H01L2225/06565 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15311 ,  H01L2924/15331 ,  H05K3/284 ,  H05K3/3436 ,  H05K2201/10515 ,  H05K2201/1053 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/0401

摘要： An embedded chip-on-chip package includes a printed circuit board having a recessed semiconductor chip mounting unit constituted by a recess in the printed circuit board and a circuit pattern at the bottom of the recess, a first semiconductor chip embedded in the recessed semiconductor chip mounting unit and electrically connected to the circuit pattern at the bottom of the recess, and a second semiconductor chip mounted to the recessed semiconductor chip mounting unit and electrically connected to the first semiconductor chip and the printed circuit board independently of each other.

摘要翻译： 嵌入式芯片芯片封装包括印刷电路板，其具有由印刷电路板中的凹部构成的凹陷半导体芯片安装单元和凹部底部的电路图案，嵌入在凹陷半导体芯片中的第一半导体芯片 安装单元，并且电连接到凹部的底部处的电路图案，以及安装到凹陷半导体芯片安装单元并且彼此独立地电连接到第一半导体芯片和印刷电路板的第二半导体芯片。

公开(公告)号：US20130230104A1

公开(公告)日：2013-09-05

申请号：US13821455

申请日：2011-09-07

申请人： Jinhan Song ,  Jeongyeon Lim ,  Tae Young Jung ,  Yong Hoon Kim ,  Jechang Jeong

发明人： Jinhan Song ,  Jeongyeon Lim ,  Tae Young Jung ,  Yong Hoon Kim ,  Jechang Jeong

IPC分类号： H04N7/26

CPC分类号： H04N19/176 ,  H04N19/11 ,  H04N19/14 ,  H04N19/157 ,  H04N19/593

摘要： A video encoding/decoding method and apparatus select a prediction mode set based on neighboring pixels and, in some embodiments, obviate the need to encode additional information for selecting a prediction mode set and thereby improve the performance of compression.

摘要翻译： 视频编码/解码方法和装置选择基于相邻像素的预测模式集合，并且在一些实施例中，消除了对用于选择预测模式集合的附加信息进行编码从而提高压缩性能的需要。

公开(公告)号：US08445996B2

公开(公告)日：2013-05-21

申请号：US12568224

申请日：2009-09-28

申请人： Yong-hoon Kim ,  Hee-seok Lee ,  Yun-seok Choi

发明人： Yong-hoon Kim ,  Hee-seok Lee ,  Yun-seok Choi

IPC分类号： H01L23/60

CPC分类号： H01L23/552 ,  H01L23/60 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2223/6677 ,  H01L2224/04042 ,  H01L2224/05001 ,  H01L2224/05009 ,  H01L2224/05554 ,  H01L2224/05568 ,  H01L2224/0557 ,  H01L2224/16 ,  H01L2224/451 ,  H01L2224/48227 ,  H01L2224/73257 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/10161 ,  H01L2924/1461 ,  H01L2924/15311 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/05099

摘要： A semiconductor package includes a main substrate, a semiconductor chip having a first side and a second side, the first side of the semiconductor chip disposed on the main substrate and electrically connected to the main substrate, and a conductive network formed on the second side of the semiconductor chip.

摘要翻译： 半导体封装包括主衬底，具有第一侧和第二侧的半导体芯片，设置在主衬底上并与主衬底电连接的半导体芯片的第一侧和形成在主衬底的第二侧上的导电网络 半导体芯片。

公开(公告)号：US08253228B2

公开(公告)日：2012-08-28

申请号：US13045103

申请日：2011-03-10

申请人： Yong-Hoon Kim ,  Byeong-Yeon Cho ,  Hee-Seok Lee

发明人： Yong-Hoon Kim ,  Byeong-Yeon Cho ,  Hee-Seok Lee

IPC分类号： H01L23/02

CPC分类号： H01L25/0657 ,  H01L24/73 ,  H01L25/105 ,  H01L25/16 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2225/0652 ,  H01L2225/06568 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/00012 ,  H01L2924/00

摘要： A package on package structure includes a lower package and an upper package. The lower package includes a first semiconductor chip disposed in a chip region of an upper surface of a first substrate. The upper package includes a second semiconductor chip disposed on an upper surface of a second substrate, and a decoupling capacitor disposed in an outer region of a lower surface of the second substrate. The lower surface of the second substrate opposes the upper surface of the second substrate and faces the upper surface of the first substrate. The plane area of the second substrate is larger than the plane area of the first substrate. The outer region of the lower surface of the second substrate extends beyond a periphery of the first substrate.

摘要翻译： 包装结构上的包装包括下包装和上包装。 下封装包括设置在第一基板的上表面的芯片区域中的第一半导体芯片。 上部封装包括设置在第二基板的上表面上的第二半导体芯片和设置在第二基板的下表面的外部区域中的去耦电容器。 第二基板的下表面与第二基板的上表面相对并且面向第一基板的上表面。 第二基板的平面面积大于第一基板的平面面积。 第二基板的下表面的外部区域延伸超出第一基板的周边。