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公开(公告)号：US20080073768A1
公开(公告)日：2008-03-27
申请号：US11892069
申请日：2007-08-20
IPC分类号： H01L23/06
CPC分类号： B81B7/007 , B81B2207/012 , H01L2224/48091 , H01L2224/48145 , H01L2224/73265 , H01L2924/1461 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： An electronic component device of the present invention includes: a silicon package unit having a structure in which a through electrode provided to a silicon substrate while an electrode post connected to the through electrode is provided upright on an upper side of the silicon substrate; an electronic component mounted on the electrode post and having a connection terminal connected to the top end of the electrode post; and a cap package unit joined onto a periphery of the silicon package unit, and constructing a housing portion in which the electronic component is housed to be hermetically sealed.
摘要翻译： 本发明的电子部件装置包括：具有如下结构的硅封装单元，其中设置在硅基板上的通孔与连接到贯通电极的电极柱直立设置在硅衬底的上侧; 安装在所述电极柱上并具有连接到所述电极柱的顶端的连接端子的电子部件; 以及连接到所述硅封装单元的周边上的盖封装单元，以及构成容纳所述电子部件的壳体部分以进行气密密封。
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公开(公告)号：US20080030139A1
公开(公告)日：2008-02-07
申请号：US11882812
申请日：2007-08-06
CPC分类号： H01L33/62 , H01L33/483 , H01L2224/0554 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/16225 , H01L2224/48091 , H01L2224/73265 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A light-emitting device includes a light-emitting element 12 and a wiring substrate 11 having a substrate body 17 having a protruding portion 25 at a position where the light-emitting device 12 is disposed and wiring patterns 21 and 22 disposed on the substrate body 17 and electrically connected to the light-emitting element 12.
摘要翻译： 发光装置包括：发光元件12和配线基板11，具有在配置有发光元件12的位置处具有突出部25的基板主体17，配置在基板主体上的配线图案21,22 并且电连接到发光元件12。
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公开(公告)号：US07894201B2
公开(公告)日：2011-02-22
申请号：US11943194
申请日：2007-11-20
IPC分类号： H05K1/18
CPC分类号： H01L23/147 , H01L21/4846 , H01L23/02 , H01L23/13 , H01L23/49822 , H01L23/49827 , H01L23/5384 , H01L23/5385 , H01L25/162 , H01L25/167 , H01L25/50 , H01L33/486 , H01L2224/16 , H01L2224/16235 , H01L2924/00011 , H01L2924/00014 , H01L2924/01019 , H01L2924/01078 , H01L2924/01079 , H01L2924/1461 , H05K3/4015 , H05K3/4614 , H05K2201/0367 , H05K2201/096 , H05K2203/049 , H05K2203/0733 , Y10T29/49155 , H01L2924/00 , H01L2224/0401
摘要： A method of manufacturing an electronic component includes the steps of a) forming a plurality of wiring boards that include first through holes penetrating through a semiconductor substrate and conductive material buried in the first through holes; b) providing conductive projections on the conductive material of any of the plurality of wiring boards; and c) bonding the plurality of wiring boards to each other and electrically connecting the conductive material of the respective wiring boards by the projections.
摘要翻译： 一种制造电子部件的方法包括以下步骤：a）形成多个布线板，所述多个布线板包括穿过半导体基板的第一通孔和埋在第一通孔中的导电材料; b）在所述多个布线板中的任一个的导电材料上设置导电突起; 以及c）将所述多个布线板彼此接合并通过所述突起电连接各个布线板的导电材料。
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64.发明授权公开(公告)号：US07850344B2
公开(公告)日：2010-12-14
申请号：US11773155
申请日：2007-07-03
IPC分类号： F21V7/00
CPC分类号： H01L33/60 , H01L25/0753 , H01L33/486 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48235 , H01L2224/73265 , H01L2924/3025 , Y10S362/80 , H01L2924/00014 , H01L2924/00
摘要： A light emitting device housing having a concave part is provided therein for housing a light emitting device. Side surfaces of the concave part are each configured to be a perpendicular surface that is substantially perpendicular to a bottom surface of the concave part, and other side surfaces are each configured to be an inclined surface for reflecting light from the light emitting device toward above the light emitting device.
摘要翻译： 在其中设置有具有凹部的发光器件壳体，用于容纳发光器件。 凹部的侧面分别构成为大致垂直于凹部的底面的垂直面，其他侧面各自构成为将来自发光元件的光向上方倾斜的倾斜面 发光装置。
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公开(公告)号：US07816690B2
公开(公告)日：2010-10-19
申请号：US11882812
申请日：2007-08-06
CPC分类号： H01L33/62 , H01L33/483 , H01L2224/0554 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/16225 , H01L2224/48091 , H01L2224/73265 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A light-emitting device includes a light-emitting element 12 and a wiring substrate 11 having a substrate body 17 having a protruding portion 25 at a position where the light-emitting device 12 is disposed and wiring patterns 21 and 22 disposed on the substrate body 17 and electrically connected to the light-emitting element 12.
摘要翻译： 发光装置包括：发光元件12和配线基板11，具有在配置有发光元件12的位置处具有突出部25的基板主体17，配置在基板主体上的配线图案21,22 并且电连接到发光元件12。
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公开(公告)号：US20090115049A1
公开(公告)日：2009-05-07
申请号：US12265203
申请日：2008-11-05
IPC分类号： H01L23/049
CPC分类号： H01L33/04 , B81B2207/012 , B81C1/0023 , B81C2203/031 , H01L24/16 , H01L24/48 , H01L24/49 , H01L24/73 , H01L25/0657 , H01L25/167 , H01L2224/16225 , H01L2224/16235 , H01L2224/32145 , H01L2224/32225 , H01L2224/45015 , H01L2224/48091 , H01L2224/48145 , H01L2224/48227 , H01L2224/48235 , H01L2224/48465 , H01L2224/4911 , H01L2224/73253 , H01L2224/73265 , H01L2225/0651 , H01L2924/00014 , H01L2924/01004 , H01L2924/01006 , H01L2924/01007 , H01L2924/01014 , H01L2924/01018 , H01L2924/01033 , H01L2924/01046 , H01L2924/0107 , H01L2924/01074 , H01L2924/014 , H01L2924/10253 , H01L2924/12041 , H01L2924/12042 , H01L2924/12043 , H01L2924/1461 , H01L2924/15153 , H01L2924/15165 , H01L2924/15311 , H01L2924/1532 , H01L2924/16195 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2924/20752 , H01L2224/05599
摘要： A semiconductor package in which an electronic device chip is provided in a cavity of a silicon substrate stacked product constituted by stacking a plurality of silicon substrates.
摘要翻译： 一种半导体封装，其中电子器件芯片设置在通过堆叠多个硅衬底而构成的硅衬底堆叠产品的空腔中。
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公开(公告)号：US20080123337A1
公开(公告)日：2008-05-29
申请号：US11984930
申请日：2007-11-26
CPC分类号： F21V11/16 , F21K9/00 , F21Y2115/10 , H01L33/58 , H01L33/60 , H01L2224/16225 , H01L2924/16195
摘要： It is a lighting apparatus 10 that has a light emitting element 16, a light emitting element housing 15 having a concave portion 28 that accommodates the light emitting element 16, and an optically transparent member 18 that airproofs a space B formed by the concave portion 28 and transmits light emitted from the light emitting element 16. The concave portion 28 is shaped to become wider toward the optically transparent member 18 from the bottom surface 28A of the concave portion 28. The lighting apparatus 10 is provided with a light shielding member 12 for shielding a part of light emitted from the light emitting element 16 is provided on the optically transparent member 18.
摘要翻译： 它是具有发光元件16，具有容纳发光元件16的凹部28的发光元件壳体15的照明装置10以及对由凹部28形成的空间B进行空气隔绝的光学透明构件18 并透射从发光元件16发射的光。 凹部28从凹部28的底面28A朝向光学透明构件18变宽。 照明装置10设置有用于屏蔽从光发射元件16发射的光的一部分的光屏蔽构件12设置在光学透明构件18上。
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公开(公告)号：US20080117607A1
公开(公告)日：2008-05-22
申请号：US11943194
申请日：2007-11-20
CPC分类号： H01L23/147 , H01L21/4846 , H01L23/02 , H01L23/13 , H01L23/49822 , H01L23/49827 , H01L23/5384 , H01L23/5385 , H01L25/162 , H01L25/167 , H01L25/50 , H01L33/486 , H01L2224/16 , H01L2224/16235 , H01L2924/00011 , H01L2924/00014 , H01L2924/01019 , H01L2924/01078 , H01L2924/01079 , H01L2924/1461 , H05K3/4015 , H05K3/4614 , H05K2201/0367 , H05K2201/096 , H05K2203/049 , H05K2203/0733 , Y10T29/49155 , H01L2924/00 , H01L2224/0401
摘要： A method of manufacturing an electronic component includes the steps of a) forming a plurality of wiring boards that include first through holes penetrating through a semiconductor substrate and conductive material buried in the first through holes; b) providing conductive projections on the conductive material of any of the plurality of wiring boards; and c) bonding the plurality of wiring boards to each other and electrically connecting the conductive material of the respective wiring boards by the projections.
摘要翻译： 一种制造电子部件的方法包括以下步骤：a）形成多个布线板，所述多个布线板包括穿过半导体基板的第一通孔和埋在第一通孔中的导电材料; b）在所述多个布线板中的任一个的导电材料上设置导电突起; 以及c）将所述多个布线板彼此接合并通过所述突起电连接各个布线板的导电材料。
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公开(公告)号：US07888953B2
公开(公告)日：2011-02-15
申请号：US12464916
申请日：2009-05-13
IPC分类号： G01R31/02
CPC分类号： G01R1/06716 , G01R1/06755 , G01R1/07314 , G01R3/00
摘要： A probe card is disclosed that includes a board having a first surface and a second surface facing away from each other and a through hole formed between the first and second surfaces; and a probe needle having a penetration part and a support part. The penetration part is placed in the through hole without contacting the board and projects from the first and second surfaces of the board. The support part is integrated with a first one of the end portions of the penetration part and connected to one of the first and second surfaces of the board. The support part has a spring characteristic. The penetration part is configured to have a second one of its end portions come into contact with an electrode pad of a semiconductor chip at the time of conducting an electrical test on the semiconductor chip.
摘要翻译： 公开了一种探针卡，其包括具有第一表面和彼此背离的第二表面的板和形成在第一表面和第二表面之间的通孔; 以及具有穿透部和支撑部的探针。 穿透部分放置在通孔中而不与板接触并从板的第一和第二表面突出。 所述支撑部与所述贯通部的所述端部的第一端部一体化，且与所述基板的所述第一面和所述第二表面中的一个连接。 支撑部分具有弹簧特性。 穿透部被配置为在半导体芯片上进行电气测试时使其第二端部与半导体芯片的电极焊盘接触。
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公开(公告)号：US20090284276A1
公开(公告)日：2009-11-19
申请号：US12464916
申请日：2009-05-13
IPC分类号： G01R31/02
CPC分类号： G01R1/06716 , G01R1/06755 , G01R1/07314 , G01R3/00
摘要： A probe card is disclosed that includes a board having a first surface and a second surface facing away from each other and a through hole formed between the first and second surfaces; and a probe needle having a penetration part and a support part. The penetration part is placed in the through hole without contacting the board and projects from the first and second surfaces of the board. The support part is integrated with a first one of the end portions of the penetration part and connected to one of the first and second surfaces of the board. The support part has a spring characteristic. The penetration part is configured to have a second one of its end portions come into contact with an electrode pad of a semiconductor chip at the time of conducting an electrical test on the semiconductor chip.
摘要翻译： 公开了一种探针卡，其包括具有第一表面和彼此背离的第二表面的板和形成在第一表面和第二表面之间的通孔; 以及具有穿透部和支撑部的探针。 穿透部分放置在通孔中而不与板接触并从板的第一和第二表面突出。 所述支撑部与所述贯通部的所述端部的第一端部一体化，且与所述基板的所述第一面和所述第二表面中的一个连接。 支撑部分具有弹簧特性。 穿透部被配置为在半导体芯片上进行电气测试时使其第二端部与半导体芯片的电极焊盘接触。
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