公开(公告)号：US20090232171A1

公开(公告)日：2009-09-17

申请号：US12382109

申请日：2009-03-09

申请人： Tamotsu Abe ,  Hideo Hoshino ,  Akira Endo ,  Osamu Wakabayashi ,  Kouji Kakizaki

发明人： Tamotsu Abe ,  Hideo Hoshino ,  Akira Endo ,  Osamu Wakabayashi ,  Kouji Kakizaki

IPC分类号： H01S3/10

CPC分类号： H01S3/2316 ,  H01S3/076 ,  H01S3/10007 ,  H01S3/2232

摘要： The higher efficiency and lower power consumption are realized in a laser system for generating a high-power short-pulse laser beam. The laser system includes a laser oscillator for generating a pulse laser beam by laser oscillation, plural amplifiers for sequentially inputting the pulse laser beam generated by the laser oscillator and amplifying the pulse laser beam, and a control unit for controlling the laser oscillator to perform burst oscillation and halting an amplification operation of at least one of the plural amplifiers in a burst halt period between burst oscillation periods.

摘要翻译： 在用于产生大功率短脉冲激光束的激光系统中实现更高的效率和更低的功率消耗。 激光系统包括用于通过激光振荡产生脉冲激光束的激光振荡器，用于顺序地输入由激光振荡器产生的脉冲激光束并放大脉冲激光束的多个放大器，以及用于控制激光振荡器进行突发的控制单元 在突发振荡周期之间的突发停止时段中振荡并停止多个放大器中的至少一个的放大操作。

公开(公告)号：US20060249698A1

公开(公告)日：2006-11-09

申请号：US10554430

申请日：2004-04-24

申请人： Akira Endo ,  Hideo Hoshino

发明人： Akira Endo ,  Hideo Hoshino

IPC分类号： G01J3/10

CPC分类号： H05G2/003 ,  G03F7/70916

摘要： A debris collector for EUV light generators is disclosed which enables to improve durabilities of optical units in a chamber including a collector mirror, to keep the vacuum degree in the chamber, and to suppress decrease in EUV light output by efficiently collecting debris bumping into the collector mirror at high speed from a target transformed into a plasma or debris adhering the collector mirror. A laser light irradiator (10) is so arranged that the irradiation direction of a laser light (L) is opposite to the traveling direction of a target (1). A debris collector (30) for collecting debris (3) is arranged in the travel path of the target (1).

摘要翻译： 公开了一种用于EUV发光器的碎屑收集器，其能够改善包括收集镜的腔室中的光学单元的耐久性，以保持腔室中的真空度，并且通过有效地收集碎屑撞击到收集器中来抑制EUV光输出的减少 从转换成等离子体的目标物体高速镜像，并附着收集镜。 激光照射器（10）的配置使得激光（L）的照射方向与靶（1）的行进方向相反。 用于收集碎片（3）的碎片收集器（30）布置在目标（1）的行进路径中。

公开(公告)号：US20060120125A1

公开(公告)日：2006-06-08

申请号：US11330220

申请日：2006-01-12

申请人： Kazuhiko Kajigaya ,  Kazuyuki Miyazawa ,  Manabu Tsunozaki ,  Kazuyoshi Oshima ,  Takashi Yamazaki ,  Yuji Sakai ,  Jiro Sawada ,  Yasunori Yamaguchi ,  Tetsurou Matsumoto ,  Shinji Udo ,  Hiroshi Yoshioka ,  Hirokazu Saito ,  Mitsuhiro Takano ,  Makoto Morino ,  Sinichi Miyatake ,  Eiji Miyamoto ,  Yasuhiro Kasama ,  Akira Endo ,  Ryoichi Hori ,  Jun Etoh ,  Masashi Horiguchi ,  Shinichi Ikenaga ,  Atsushi Kumata

发明人： Kazuhiko Kajigaya ,  Kazuyuki Miyazawa ,  Manabu Tsunozaki ,  Kazuyoshi Oshima ,  Takashi Yamazaki ,  Yuji Sakai ,  Jiro Sawada ,  Yasunori Yamaguchi ,  Tetsurou Matsumoto ,  Shinji Udo ,  Hiroshi Yoshioka ,  Hirokazu Saito ,  Mitsuhiro Takano ,  Makoto Morino ,  Sinichi Miyatake ,  Eiji Miyamoto ,  Yasuhiro Kasama ,  Akira Endo ,  Ryoichi Hori ,  Jun Etoh ,  Masashi Horiguchi ,  Shinichi Ikenaga ,  Atsushi Kumata

IPC分类号： G11C19/08

CPC分类号： H01L24/06 ,  G11C5/025 ,  G11C5/04 ,  G11C5/063 ,  G11C11/406 ,  G11C29/06 ,  G11C29/12005 ,  G11C29/12015 ,  G11C29/24 ,  G11C29/34 ,  G11C29/50 ,  G11C29/50012 ,  G11C29/70 ,  G11C29/80 ,  G11C29/804 ,  G11C29/832 ,  G11C29/844 ,  G11C2029/2602 ,  H01L24/05 ,  H01L24/45 ,  H01L24/48 ,  H01L27/0207 ,  H01L27/105 ,  H01L27/10897 ,  H01L27/11898 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/05556 ,  H01L2224/05624 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/48465 ,  H01L2224/48624 ,  H01L2224/73215 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01021 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01037 ,  H01L2924/01038 ,  H01L2924/01039 ,  H01L2924/01041 ,  H01L2924/01043 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01052 ,  H01L2924/01054 ,  H01L2924/01055 ,  H01L2924/01058 ,  H01L2924/01059 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01083 ,  H01L2924/01084 ,  H01L2924/12042 ,  H01L2924/1305 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor memory device formed on a semiconductor chip comprises a plurality of first memory arrays, a plurality of second memory arrays, a first voltage generator, and a plurality of first bonding pads. The semiconductor chip is divided into a first rectangle region, a second rectangle region, and a third rectangle region and the third rectangle region is arranged between the first rectangle region and the second rectangle region. The plurality of first memory arrays are formed in the first rectangle region. The plurality of second memory arrays are formed in the second rectangle region. The voltage generator and the plurality of first bonding pads are arranged in the third rectangle region. The plurality of first bonding pads are arranged between the first rectangle region and the voltage generator and no bonding pads are arranged between the voltage generator and the plurality of second memory arrays.

公开(公告)号：US06657901B2

公开(公告)日：2003-12-02

申请号：US10254980

申请日：2002-09-26

申请人： Kazuhiko Kajigaya ,  Kazuyuki Miyazawa ,  Manabu Tsunozaki ,  Kazuyoshi Oshima ,  Takashi Yamazaki ,  Yuji Sakai ,  Jiro Sawada ,  Yasunori Yamaguchi ,  Tetsurou Matsumoto ,  Shinji Udo ,  Hiroshi Yoshioka ,  Hirokazu Saito ,  Mitsuhiro Takano ,  Makoto Morino ,  Sinichi Miyatake ,  Eiji Miyamoto ,  Yasuhiro Kasama ,  Akira Endo ,  Ryoichi Hori ,  Jun Etoh ,  Masashi Horiguchi ,  Shinichi Ikenaga ,  Atsushi Kumata

发明人： Kazuhiko Kajigaya ,  Kazuyuki Miyazawa ,  Manabu Tsunozaki ,  Kazuyoshi Oshima ,  Takashi Yamazaki ,  Yuji Sakai ,  Jiro Sawada ,  Yasunori Yamaguchi ,  Tetsurou Matsumoto ,  Shinji Udo ,  Hiroshi Yoshioka ,  Hirokazu Saito ,  Mitsuhiro Takano ,  Makoto Morino ,  Sinichi Miyatake ,  Eiji Miyamoto ,  Yasuhiro Kasama ,  Akira Endo ,  Ryoichi Hori ,  Jun Etoh ,  Masashi Horiguchi ,  Shinichi Ikenaga ,  Atsushi Kumata

IPC分类号： G11C1604

CPC分类号： H01L24/06 ,  G11C5/025 ,  G11C5/04 ,  G11C5/063 ,  G11C11/406 ,  G11C29/06 ,  G11C29/12005 ,  G11C29/12015 ,  G11C29/24 ,  G11C29/34 ,  G11C29/50 ,  G11C29/50012 ,  G11C29/70 ,  G11C29/80 ,  G11C29/804 ,  G11C29/832 ,  G11C29/844 ,  G11C2029/2602 ,  H01L24/05 ,  H01L24/45 ,  H01L24/48 ,  H01L27/0207 ,  H01L27/105 ,  H01L27/10897 ,  H01L27/11898 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/05556 ,  H01L2224/05624 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/48465 ,  H01L2224/48624 ,  H01L2224/73215 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01021 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01037 ,  H01L2924/01038 ,  H01L2924/01039 ,  H01L2924/01041 ,  H01L2924/01043 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01052 ,  H01L2924/01054 ,  H01L2924/01055 ,  H01L2924/01058 ,  H01L2924/01059 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01083 ,  H01L2924/01084 ,  H01L2924/12042 ,  H01L2924/1305 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor memory device, in which peripheral circuits are arranged in a cross area of a semiconductor chip composed of the longitudinal center portions and the transverse center portions, and in which memory arrays are arranged in the four regions which are divided by the cross area. A benefit of this structure in which the peripheral circuits are arranged at the center portion of the chip, is that the longest signal transmission paths can be shortened to about one half of the chip size to speed up the DRAM which is intended to have a large storage capacity.

摘要翻译： 一种半导体存储器件，其中外围电路布置在由纵向中心部分和横向中心部分组成的半导体芯片的交叉区域中，并且其中存储器阵列布置在由横截面划分的四个区域中。 外围电路布置在芯片的中心部分的这种结构的好处是，最长的信号传输路径可以缩短到芯片尺寸的大约一半，以加快DRAM的意图。 存储容量。

公开(公告)号：US06515913B2

公开(公告)日：2003-02-04

申请号：US10000032

申请日：2001-12-04

申请人： Kazuhiko Kajigaya ,  Kazuyuki Miyazawa ,  Manabu Tsunozaki ,  Kazuyoshi Oshima ,  Takashi Yamazaki ,  Yuji Sakai ,  Jiro Sawada ,  Yasunori Yamaguchi ,  Tetsurou Matsumoto ,  Shinji Udo ,  Hiroshi Yoshioka ,  Hirokazu Saito ,  Mitsuhiro Takano ,  Makoto Morino ,  Sinichi Miyatake ,  Eiji Miyamoto ,  Yasuhiro Kasama ,  Akira Endo ,  Ryoichi Hori ,  Jun Etoh ,  Masashi Horiguchi ,  Shinichi Ikenaga ,  Atsushi Kumata

发明人： Kazuhiko Kajigaya ,  Kazuyuki Miyazawa ,  Manabu Tsunozaki ,  Kazuyoshi Oshima ,  Takashi Yamazaki ,  Yuji Sakai ,  Jiro Sawada ,  Yasunori Yamaguchi ,  Tetsurou Matsumoto ,  Shinji Udo ,  Hiroshi Yoshioka ,  Hirokazu Saito ,  Mitsuhiro Takano ,  Makoto Morino ,  Sinichi Miyatake ,  Eiji Miyamoto ,  Yasuhiro Kasama ,  Akira Endo ,  Ryoichi Hori ,  Jun Etoh ,  Masashi Horiguchi ,  Shinichi Ikenaga ,  Atsushi Kumata

IPC分类号： G11C1604

CPC分类号： H01L24/06 ,  G11C5/025 ,  G11C5/04 ,  G11C5/063 ,  G11C11/406 ,  G11C29/06 ,  G11C29/12005 ,  G11C29/12015 ,  G11C29/24 ,  G11C29/34 ,  G11C29/50 ,  G11C29/50012 ,  G11C29/70 ,  G11C29/80 ,  G11C29/804 ,  G11C29/832 ,  G11C29/844 ,  G11C2029/2602 ,  H01L24/05 ,  H01L24/45 ,  H01L24/48 ,  H01L27/0207 ,  H01L27/105 ,  H01L27/10897 ,  H01L27/11898 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/05556 ,  H01L2224/05624 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/48465 ,  H01L2224/48624 ,  H01L2224/73215 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01021 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01037 ,  H01L2924/01038 ,  H01L2924/01039 ,  H01L2924/01041 ,  H01L2924/01043 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01052 ,  H01L2924/01054 ,  H01L2924/01055 ,  H01L2924/01058 ,  H01L2924/01059 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01083 ,  H01L2924/01084 ,  H01L2924/12042 ,  H01L2924/1305 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00012

摘要： Herein disclosed is a semiconductor memory device, in which peripheral circuits are arranged in a cross area of a semiconductor chip composed of the longitudinal center portions and the transverse center portions, and in which memory arrays are arranged in the four regions which are divided by the cross area. Thanks to this structure in which the peripheral circuits are arranged at the center portion of the chip, the longest signal transmission paths can be shortened to about one half of the chip size to speed up the DRAM which is intended to have a large storage capacity.

公开(公告)号：US06268669B1

公开(公告)日：2001-07-31

申请号：US09509497

申请日：2000-05-18

申请人： Hirokazu Wakao ,  Akira Endo ,  Takenobu Nakamura ,  Wataru Kawaguchi

发明人： Hirokazu Wakao ,  Akira Endo ,  Takenobu Nakamura ,  Wataru Kawaguchi

IPC分类号： B62D504

CPC分类号： B62D5/0406 ,  B62D5/043 ,  H02K5/148 ,  H02K5/1732 ,  H02K5/225 ,  H02K7/108 ,  H02K7/1166 ,  H02K11/215 ,  H02K11/24 ,  H02K11/25 ,  H02K11/33 ,  Y10S310/06

摘要： An electric motor 10 for an electric power steering system, in which a board mounting portion 23 of aluminum for partitioning an electric motor body 10A and a circuit board 40 is formed all over the inner side of a motor case 20 and in which a bearing 25 of an output shaft 11 of the electric motor body 10A is supported on the board mounting portion 23 to release the heat effectively from FETs 43 mounted on the circuit board 40 and the output shaft 11. On the other hand, pigtail wires 36 from brushes 33 are welded to brush leads 27 having a wide surface area so that the circuit board 40 may be prevented from rising to a high temperature at the welding time. A torque limiter 80 is interposed between the output shaft 11 and a worm shaft 92 in a worm case 90 to reduce the size of the entire system, and the cogging of the motor torque is suppressed by correcting the feed current to the electric motor body 10A on the basis of the position changes in a plurality of slits 101 which are formed in the outer circumference of a case 81 of the torque limiter 80 and in phase with the electrodes of a commutator 35.

摘要翻译： 一种用于电动助力转向系统的电动机10，其中在电机壳体20的整个内侧形成有用于分隔电动机体10A的铝的板安装部23和电路板40，并且其中轴承25 电动机主体10A的输出轴11被支撑在板安装部23上，以有效地从安装在电路板40和输出轴11上的FET 43释放热量。另一方面，来自电刷33的辫状线36 被焊接到具有宽表面积的刷引线27，使得可以防止电路板40在焊接时升高到高温。 转矩限制器80插入在蜗杆壳体90中的输出轴11和蜗杆轴92之间，以减小整个系统的尺寸，并且通过校正到电动机主体10A的进给电流来抑制电动机转矩的齿槽 基于形成在转矩限制器80的壳体81的外周的多个狭缝101的位置变化，并且与换向器35的电极相位。

公开(公告)号：US5933440A

公开(公告)日：1999-08-03

申请号：US109739

申请日：1998-07-02

申请人： Akira Endo ,  Masakazu Washio

发明人： Akira Endo ,  Masakazu Washio

IPC分类号： H01J35/06 ,  H01J3/02 ,  H01J37/075 ,  H01S3/098 ,  H01S3/115 ,  H01S3/117 ,  H01S3/139 ,  H05G2/00 ,  H01S3/10

CPC分类号： H01S3/139 ,  H01J3/021 ,  H01S3/1109

摘要： A master radio-frequency signal output from a master oscillator is input to a frequency converter. The frequency converter generates and outputs a multiplied signal having a frequency higher than that of the master radio-frequency signal by using the master radio-frequency signal. A loss of light reciprocating in an optic resonator of a laser oscillator is controlled by both the master radio-frequency signal output from the master oscillator and the multiplied signal output from the frequency converter. It is possible to highly precisely synchronize a pulse laser beam and a radio-frequency signal.

摘要翻译： 从主振荡器输出的主射频信号被输入到变频器。 频率转换器通过使用主射频信号产生并输出具有高于主射频信号的频率的相乘信号。 在激光振荡器的光学谐振器中往复运动的光的损失由主振荡器输出的主射频信号和从变频器输出的相乘信号两者来控制。 可以高精度地同步脉冲激光束和射频信号。

公开(公告)号：US5785145A

公开(公告)日：1998-07-28

申请号：US583226

申请日：1996-01-04

申请人： Hirokazu Wakao ,  Akira Endo ,  Yoshinori Kogiso

发明人： Hirokazu Wakao ,  Akira Endo ,  Yoshinori Kogiso

IPC分类号： B62D5/04

CPC分类号： B62D5/0406

摘要： An arrangement of circuit casings and circuit boards in a motorized power steering device including a drive circuit casing, a control circuit casing and a gear casing connected to the drive circuit casing. The drive circuit casing includes a drive circuit board provided thereon with a drive circuit whereas the control circuit casing includes a control circuit board provided thereon with a control circuit for outputting a control signal to the drive circuit. An electric motor is attached to the drive circuit casing such that the drive circuit casing is interposed between the gear casing and the electric motor.

摘要翻译： 在电动动力转向装置中的电路壳体和电路板的布置，包括驱动电路壳体，控制电路壳体和连接到驱动电路壳体的齿轮壳体。 驱动电路壳体包括设置有驱动电路的驱动电路板，而控制电路壳体包括控制电路板，控制电路板上设置有用于向驱动电路输出控制信号的控制电路。 电动马达安装在驱动电路壳体上，使得驱动电路壳体插入在齿轮箱和电动马达之间。

公开(公告)号：US5580810A

公开(公告)日：1996-12-03

申请号：US416099

申请日：1995-04-04

申请人： Hisao Katto ,  June Sugiura ,  Nozomi Horino ,  Akira Endo ,  Yoshiharu Takeuchi ,  Yuji Arakawa

发明人： Hisao Katto ,  June Sugiura ,  Nozomi Horino ,  Akira Endo ,  Yoshiharu Takeuchi ,  Yuji Arakawa

IPC分类号： G11C11/401 ,  G11C5/02 ,  H01L21/312 ,  H01L21/3205 ,  H01L21/768 ,  H01L21/8242 ,  H01L23/52 ,  H01L23/522 ,  H01L27/10 ,  H01L27/108 ,  H01L29/78 ,  H01L21/8247

CPC分类号： H01L23/522 ,  G11C5/025 ,  H01L27/10805 ,  H01L2924/0002 ,  Y10S257/922 ,  Y10S257/925 ,  Y10S438/926

摘要： A semiconductor memory device having wiring formed next to word lines at the extreme ends of the memory cell arrays or next to word lines of the dummy cell arrays, in order to prevent such word lines from breaking or from becoming deformed. The wiring is irrelevant to the circuit operation, but is provided with a fixed potential, and is formed through the steps of forming the word lines. The wiring makes the processing conditions applied to the neighboring word lines the same as the processing conditions applied to other word lines.

摘要翻译： 一种半导体存储器件，其具有在存储单元阵列的末端或与虚设单元阵列的字线相邻的字线旁边的布线，以防止这种字线断裂或变形。 布线与电路操作无关，但是具有固定电位，并且通过形成字线的步骤形成。 布线使得对相邻字线施加的处理条件与应用于其它字线的处理条件相同。

公开(公告)号：US5400039A

公开(公告)日：1995-03-21

申请号：US992108

申请日：1992-12-17

申请人： Hiroshi Araki ,  Akira Endo

发明人： Hiroshi Araki ,  Akira Endo

IPC分类号： H01P3/08 ,  H01P11/00 ,  H01Q1/32 ,  H01Q1/38 ,  H01Q13/08 ,  H01Q21/06 ,  H01Q23/00 ,  H04B1/38 ,  H04B1/3822 ,  H05K1/16

CPC分类号： H04B1/3822 ,  H01Q1/32 ,  H01Q1/38 ,  H01Q23/00 ,  H05K1/16

摘要： An integrated multi-layered microwave circuit includes a substrate which is constituted by dielectric layers and conductive layers laminated alternately. The conductive layer disposed at one major surface of the substrate forms a micro strip line which constitutes an antenna portion. The conductive layer disposed at the other major surface of the substrate forms a circuit pattern including a grounding line and a power source line, and then the circuit pattern forms a communication portion together with discrete parts incorporated in the circuit pattern. One of the intermediate conductive layers of the substrate constitutes a grounding layer and the other thereof constitutes a power source layer. In the substrate, a feeding via hole, a via hole for a power source, and a grounding via hole are formed so as to penetrate the substrate. Conductors are formed on the inner walls of the substrate forming the feeding via hole, the via hole for the power source, and the grounding via hole by the plating technique, respectively, whereby the antenna portion, the power source layer and the grounding layer are electrically connected to the communication portion, the power source line and the grounding line, respectively. The antenna portion is provided with a feeding land connected to the conductors of the feeding via hole, three radiators each having a circular configuration formed by the micro strip line, and a phase shifter formed by the micro strip line for connecting the respective radiators to the feeding land.

摘要翻译： 集成的多层微波电路包括由电介质层和交替层叠的导电层构成的基板。 设置在基板的一个主表面处的导电层形成构成天线部分的微带线。 设置在基板的另一个主表面的导电层形成包括接地线和电源线的电路图案，然后电路图形与结合在电路图案中的分立部分一起形成通信部分。 基板的中间导电层中的一个构成接地层，另一个构成电源层。 在基板中，形成供给通孔，电源用通孔和接地通孔，以穿透基板。 在基板的内壁形成导体，分别形成馈电通孔，电源用通孔，电镀技术的接地通孔，由此天线部分，电源层和接地层为 电连接到通信部分，电源线和接地线。 天线部分具有连接到馈电通孔的导体的馈电平台，每个具有由微带线形成的圆形构造的三个辐射器和由微带线形成的移相器，用于将各个散热器连接到 喂土地