公开(公告)号：US06344407B1

公开(公告)日：2002-02-05

申请号：US09691075

申请日：2000-10-19

申请人： Hirohisa Matsuki ,  Fumihiko Taniguchi ,  Kunio Kodama ,  Eiji Watanabe ,  Masataka Mizukoshi ,  Hiroyuki Matsui

发明人： Hirohisa Matsuki ,  Fumihiko Taniguchi ,  Kunio Kodama ,  Eiji Watanabe ,  Masataka Mizukoshi ,  Hiroyuki Matsui

IPC分类号： B23K3522

CPC分类号： B23K35/38 ,  B23K35/262 ,  B23K35/268 ,  B23K35/3618 ,  B23K2101/40 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05548 ,  H01L2224/05572 ,  H01L2224/11 ,  H01L2224/11334 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01054 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/15787 ,  H05K3/3489 ,  H01L2924/00 ,  H01L2224/05655 ,  H01L2924/00014 ,  H01L2224/05166

摘要： A semiconductor device manufacturing method comprises the steps of forming solder bumps on an underlying metal film of a semiconductor device, and placing the semiconductor device and the solder layer in a reduced pressure atmosphere containing formic acid to form the solder bumps. Accordingly, the solder bumps can be formed without flux generating voids in the solder layer. Furthermore, the cleaning required after the solder bumps are formed can be omitted.

摘要翻译： 半导体器件制造方法包括以下步骤：在半导体器件的下面的金属膜上形成焊料凸块，并将半导体器件和焊料层放置在含有甲酸的减压气氛中以形成焊料凸块。 因此，可以在焊料层中形成焊剂凸块而没有焊剂产生空隙。 此外，可以省略在形成焊料凸块之后所需的清洁。

公开(公告)号：US06232147B1

公开(公告)日：2001-05-15

申请号：US09365413

申请日：1999-08-02

申请人： Hirohisa Matsuki ,  Kenichi Kado ,  Eiji Watanabe ,  Kazuyuki Imamura ,  Takahiro Yurino

发明人： Hirohisa Matsuki ,  Kenichi Kado ,  Eiji Watanabe ,  Kazuyuki Imamura ,  Takahiro Yurino

IPC分类号： H01L2144

CPC分类号： H01L24/10 ,  H01L23/49816 ,  H01L24/13 ,  H01L24/48 ,  H01L2224/05124 ,  H01L2224/05139 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05657 ,  H01L2224/05664 ,  H01L2224/05669 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/16237 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01056 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2224/85399 ,  H01L2924/013

摘要： A semiconductor device equipped with secondary pads having adequate arrangement for an arbitrary packaging process. The secondary pads are connected with the primary pads of the semiconductor device with a novel lead wire structure, which is characterized by its low electric resistance, good mechanical strength to protect active components of the device, good adhesion to bumps, and anti-electromigration property. The semiconductor device has: semiconductor circuit elements 2 embedded in a semiconductor substrate 1; a plurality of conductive primary pads 4 each formed in a region above, and surrounding, the circuit element 2; a first protective insulation substrate 5 covering the substrate and having first openings 6 for the primary pads 4; lead wires 7 each consisting of a conductive bulk layer 15 made of copper and a metallic top layer 16, the bulk layer formed on the first protective insulation substrate 5 and having one end connected with a corresponding one of the primary pads 4 through an associated opening 6 and the other end located in a region surrounding the opening 6, while the top layer made of a metal having Vickers hardness of more than 100; and a second protective insulation substrate 8 having second openings 9 for exposing the top surfaces of the other ends of the lead wires 7 serving as the secondary pads 17.

摘要翻译： 一种装备有用于任意包装过程的适当布置的辅助垫的半导体器件。 辅助焊盘与半导体器件的主焊盘与新颖的引线结构连接，其特征在于其低电阻，良好的机械强度以保护器件的有源部件，对凸块的良好粘附性和抗电迁移性 。 半导体器件具有：嵌入半导体衬底1中的半导体电路元件2; 多个导电性主焊盘4，各自形成在电路元件2的上方并包围电路元件2的区域中; 覆盖基板并具有用于主焊盘4的第一开口6的第一保护绝缘基板5; 引线7由导电体层15和铜构成，金属顶层16形成在第一保护绝缘基片5上，并且其一端通过相关的开口连接到相应的一个主焊盘4中 6，另一端位于围绕开口6的区域中，而顶层由维氏硬度大于100的金属制成; 以及具有第二开口9的第二保护绝缘基板8，用于暴露作为二次焊盘17的引线7的另一端的顶表面。

公开(公告)号：US06213095B1

公开(公告)日：2001-04-10

申请号：US09033816

申请日：1998-03-03

申请人： Kikuo Asada ,  Masayoshi Usui ,  Eiji Watanabe ,  Kazunori Takikawa

发明人： Kikuo Asada ,  Masayoshi Usui ,  Eiji Watanabe ,  Kazunori Takikawa

IPC分类号： F02M4100

CPC分类号： B21C37/29 ,  F02M55/025

摘要： A common rail is provided for promoting inner pressure fatigue strength at location in proximity to a branch pipe. The common rail includes a main pipe rail with a main flow path. At least one boss in provided on the peripheral wall and includes a branch hole communicating the main flow path. The branch pipe is provided with a connecting head that has a pressing face at and end of the branch pipe. The pressing face of the branch pipe is urged into a pressure receiving seat of the boss. A compressive residual stress is provided at location in the peripheral wall where the main flow path of the main pipe rail communicates with the branch hole. The compressive residual stress increases the pressure fatigue strength by substantially canceling tensile stress.

摘要翻译： 提供了一种用于在分支管附近的位置处提高内部压力疲劳强度的共轨。 共轨包括具有主流路的主管道。 至少一个凸台设置在周壁上并且包括连通主流路的分支孔。 分支管设置有连接头，该连接头在分支管的端部和末端具有按压面。 分支管的按压面被推入凸台的受压座。 在主管道的主流路与分支孔连通的周壁的位置设有压缩残余应力。 通过基本上消除拉伸应力，压缩残余应力增加了压力疲劳强度。

公开(公告)号：US6025650A

公开(公告)日：2000-02-15

申请号：US961243

申请日：1997-10-30

申请人： Kazuto Tsuji ,  Yoshiyuki Yoneda ,  Hideharu Sakoda ,  Ryuuji Nomoto ,  Eiji Watanabe ,  Seiichi Orimo ,  Masanori Onodera ,  Junichi Kasai

发明人： Kazuto Tsuji ,  Yoshiyuki Yoneda ,  Hideharu Sakoda ,  Ryuuji Nomoto ,  Eiji Watanabe ,  Seiichi Orimo ,  Masanori Onodera ,  Junichi Kasai

IPC分类号： H01L23/12 ,  H01L21/56 ,  H01L21/68 ,  H01L23/31 ,  H01L23/495 ,  H01L23/48 ,  H01L29/41

CPC分类号： H01L21/6835 ,  H01L21/565 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/49548 ,  H01L24/49 ,  H01L2221/68377 ,  H01L2224/05554 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/451 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45164 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/4943 ,  H01L2224/73265 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01043 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18165

摘要： This invention relates to a semiconductor device in which a plurality of outer terminals are arranged in a lattice formation on a flat surface. The semiconductor device comprises a semiconductor chip having a plurality of pads, a resin portion sealing said semiconductor chip and a terminal portion in which a prescribed number of pole terminals electrically connected to said pads provided in said semiconductor chip are provided, said pole terminals being exposed from said resin portion. According to the invention, a cost for production is reduced and a reliability and electrical characteristics can be improved.

摘要翻译： 本发明涉及一种半导体器件，其中多个外部端子以平坦表面的格子状排列。 半导体器件包括具有多个焊盘的半导体芯片，密封所述半导体芯片的树脂部分和设置有电连接到设置在所述半导体芯片中的所述焊盘的规定数量的极端子的端子部分，所述极端子露出 从所述树脂部分。 根据本发明，生产成本降低，并且可以提高可靠性和电气特性。

公开(公告)号：US5969424A

公开(公告)日：1999-10-19

申请号：US999115

申请日：1997-12-29

申请人： Hirohisa Matsuki ,  Kenichi Kado ,  Eiji Watanabe ,  Kazuyuki Imamura ,  Takahiro Yurino

发明人： Hirohisa Matsuki ,  Kenichi Kado ,  Eiji Watanabe ,  Kazuyuki Imamura ,  Takahiro Yurino

IPC分类号： H01L23/485 ,  H01L23/498 ,  H01L23/48

CPC分类号： H01L24/10 ,  H01L23/49816 ,  H01L24/13 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/16237 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01056 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/15311 ,  H01L2924/181

摘要： A semiconductor device equipped with secondary pads having adequate arrangement for an arbitrary packaging process. The secondary pads are connected with the primary pads of the semiconductor device with a novel lead wire structure, which is characterized by its low electric resistance, good mechanical strength to protect active components of the device, good adhesion to bumps, and anti-electromigration property. The semiconductor device has: semiconductor circuit elements 2 embedded in a semiconductor substrate 1; a plurality of conductive primary pads 4 each formed in a region above, and surrounding, the circuit element 2; a first protective insulation substrate 5 covering the substrate and having first openings 6 for the primary pads 4; lead wires 7 each consisting of a conductive bulk layer 15 made of copper and a metallic top layer 16, the bulk layer formed on the first protective insulation substrate 5 and having one end connected with a corresponding one of the primary pads 4 through an associated opening 6 and the other end located in a region surrounding the opening 6, while the top layer made of a metal having Vickers hardness of more than 100; and a second protective insulation substrate 8 having second openings 9 for exposing the top surfaces of the other ends of the lead wires 7 serving as the secondary pads 17.

摘要翻译： 一种装备有用于任意包装过程的适当布置的辅助垫的半导体器件。 辅助焊盘与半导体器件的主焊盘与新颖的引线结构连接，其特征在于其低电阻，良好的机械强度以保护器件的有源部件，对凸块的良好粘附性和抗电迁移性 。 半导体器件具有：嵌入半导体衬底1中的半导体电路元件2; 多个导电性主焊盘4，各自形成在电路元件2的上方并包围电路元件2的区域中; 覆盖基板并具有用于主焊盘4的第一开口6的第一保护绝缘基板5; 引线7由导电体层15和铜构成，金属顶层16形成在第一保护绝缘基片5上，并且其一端通过相关的开口连接到相应的一个主焊盘4中 6，另一端位于围绕开口6的区域中，而顶层由维氏硬度大于100的金属制成; 以及具有第二开口9的第二保护绝缘基板8，用于暴露作为二次焊盘17的引线7的另一端的顶表面。

公开(公告)号：US5670206A

公开(公告)日：1997-09-23

申请号：US516023

申请日：1995-08-17

申请人： Hiroshi Taoda ,  Eiji Watanabe

发明人： Hiroshi Taoda ,  Eiji Watanabe

IPC分类号： A61L9/18 ,  A61K9/18 ,  A61L9/03 ,  H01J9/20 ,  H01J61/35 ,  H01K1/32 ,  H01K7/00 ,  B05D5/12

CPC分类号： H01J61/35 ,  A61L9/03 ,  H01J9/20 ,  A61L2209/12

摘要： A deodorizing lamp comprises a lamp unit and a titanium oxide film coating the glass surface of the lamp unit and optionally at least one metal selected from among iron, platinum, rhodium, ruthenium, palladium, silver, copper, zinc, and manganese deposited on the surface of the titanium oxide film. A method for the production of a deodorizing lamp comprises the steps of applying a titania sol or an aqueous hydrogen peroxide solution of titania gel to the glass surface of a lamp unit, drying the applied layer of titania sol or titania gel, firing the dried layer thereby forming a titanium oxide film on the glass surface, and optionally depositing at least one metal from among iron, platinum, rhodium, ruthenium, palladium, silver, copper, zinc, and manganese on the titanium oxide film.

公开(公告)号：US5657217A

公开(公告)日：1997-08-12

申请号：US537755

申请日：1995-10-23

申请人： Eiji Watanabe ,  Hiroaki Matsunaga

发明人： Eiji Watanabe ,  Hiroaki Matsunaga

IPC分类号： H02M7/497 ,  H02M7/519

CPC分类号： H02M7/49 ,  H02M7/493 ,  H02M2007/53876

摘要： This invention is a multi-coupled power conversion system including power converters 114 and 124 connected in parallel through reactors 105, with each power converter converting a d.c. voltage into an a.c. voltage by means of automatic turn-off switching devices which turn on and off in response to on/off commands. The system includes a spatial voltage vector calculator 101 which, in order to provide the on/off commands for the parallel-connected power converters 114 and 124, selects multiple spatial voltage vectors in accordance with the amplitude Vc and phase .theta. of the command of the a.c. voltage to be produced by the power converters 114 and 124 and calculates vector output times, a vector permutation device 102 which determines two sets of the order of generation of the selected spatial voltage vectors, and PWM generators 113 and 123 which generate the on/off commands in response to the output of said vector permutation device 102. The system further includes a means of controlling the output voltages of the power converters 114 and 124 by providing the PWM generators 113 and 123 with two sets of spatial voltage vector series of different orders determined by the vector permutation device 102.

摘要翻译： PCT No.PCT / JP95 / 00327 Sec。 371日期1995年10月23日第 102（e）1995年10月23日PCT PCT 1995年3月1日PCT公布。 出版物WO95 / 24069 日期1995年9月8日本发明是包括通过电抗器105并联连接的电力转换器114和124的多耦合功率转换系统，每个功率转换器转换直流 电压变成a.c. 通过自动关闭开关装置的电压，其响应于开/关命令而导通和关断。 该系统包括空间电压矢量计算器101，为了提供并联功率转换器114和124的接通/断开命令，根据该指令的幅度Vc和相位θ来选择多个空间电压矢量 ac 由功率转换器114和124产生的电压并且计算矢量输出时间;矢量置换装置102，其确定所选择的空间电压矢量的产生次数的两组;以及产生开/关的PWM发生器113和123 命令响应于所述向量置换装置102的输出。该系统还包括通过向PWM发生器113和123提供具有不同阶数的两组空间电压矢量序列来控制功率转换器114和124的输出电压的装置 由矢量置换装置102确定。

公开(公告)号：US5449588A

公开(公告)日：1995-09-12

申请号：US250573

申请日：1994-05-27

申请人： Hirotoshi Maeda ,  Eiji Watanabe ,  Kouichi Katou ,  Kouichi Kunimune

发明人： Hirotoshi Maeda ,  Eiji Watanabe ,  Kouichi Katou ,  Kouichi Kunimune

IPC分类号： C08G73/10 ,  G03F7/004 ,  G03F7/038 ,  G03F7/075

CPC分类号： C08G73/101 ,  G03F7/0387 ,  G03F7/0045 ,  G03F7/075

摘要： A photosensitive resin composition containing 0.5 to 15 parts by weight of a compound generating an acid by light irradiation in 100 parts by weight of a polyamic acid amide having an alkoxysilane having a specified structure at its terminals are provided,which composition has superior resolution properties, a small shrinkage of volume, a superior adhesion onto a substrate, and can prepare a polyimide by baking.

摘要翻译： 提供一种感光性树脂组合物，其含有0.5〜15重量份在100重量份具有末端具有特定结构的烷氧基硅烷的聚酰胺酸酰胺中通过光照射产生酸的化合物，该组合物具有优异的分辨性， 体积小的收缩，对基材的优异粘附性，并且可以通过烘烤制备聚酰亚胺。

公开(公告)号：US5150029A

公开(公告)日：1992-09-22

申请号：US445675

申请日：1989-11-17

申请人： Eiji Watanabe ,  Tsugutoshi Ohtani

发明人： Eiji Watanabe ,  Tsugutoshi Ohtani

IPC分类号： G01R31/34 ,  G01R33/02 ,  H02P21/00 ,  H02P21/06 ,  H02P27/04

CPC分类号： H02P21/06

摘要： This invention relates to an induction motor magnetic flux operation method in a vector control device in which a primary current is supplied to the induction motor in response to an excitation current command value and a torque current command value and the frequency is controlled on the basis of the magnetic flux operated from the voltage and current applied on the motor, characterized in that, when the magnetic flux is operated on the basis of the voltage, current on the motor and a magnetic flux command signal by using a primary delay circuit, the time constant of the primary delay circuit is set equal to that of the secondary circuit of the motor. According to this invention, it is possible to minimize the phase error with respect to the true secondary magnetic flux included in the secondary magnetic flux value, which leads to an accurate torque control.

公开(公告)号：US08968260B2

公开(公告)日：2015-03-03

申请号：US12824773

申请日：2010-06-28

申请人： Aiko Horiuchi ,  Eiji Watanabe ,  Shigeru Suzuki ,  Masami Shimoda

发明人： Aiko Horiuchi ,  Eiji Watanabe ,  Shigeru Suzuki ,  Masami Shimoda

IPC分类号： A61M5/315 ,  A61M5/00 ,  A61M5/31

CPC分类号： A61M5/31513 ,  A61M2005/3104 ,  A61M2005/3118 ,  A61M2005/3131 ,  A61M2205/0222 ,  A61M2205/0238

摘要： A gasket for use in a syringe so formed as to liquid-tightly and slidably contact an inner surface of an outer cylinder of the syringe, the gasket including a gasket body made of an elastic body and a coating layer formed on a portion thereof which contacts at least the syringe, wherein the coating layer includes a composition containing a silicone resin which comprises a condensate of a reactive silicone resin having a terminal silanol group and which has a siloxane bond derived from the silanol group, and does not contain solid fine particles.

摘要翻译： 一种用于注射器的垫圈，其形成为液体地且可滑动地接触注射器的外筒的内表面，垫圈包括由弹性体制成的垫圈主体和形成在其上的涂层， 至少所述注射器，其中所述涂层包括含有硅树脂的组合物，所述组合物包含具有末端硅烷醇基的反应性硅氧烷树脂的缩合物，并且所述硅氧烷树脂具有来自所述硅烷醇基团的硅氧烷键，并且不含有固体细颗粒。