公开(公告)号：US20080009130A1

公开(公告)日：2008-01-10

申请号：US11856265

申请日：2007-09-17

申请人： Saikumar Jayaraman

发明人： Saikumar Jayaraman

IPC分类号： H01L21/48

CPC分类号： C08G69/42 ,  C08G59/504 ,  H01L21/563 ,  H01L23/293 ,  H01L23/296 ,  H01L23/3128 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/0401

摘要： A method including introducing a composition including a siloxane-based aromatic diamine in a flowable state between a first substrate including a first set of contact points and a second substrate including a second set of contact points coupled to the first substrate through interconnections between a portion of the first set of contact points a portion of the second set of contact points; and curing the composition.

摘要翻译： 一种方法，包括在包括第一组接触点的第一基板和包括第二组接触点的第二基板之间以可流动状态引入包含基于硅氧烷的芳族二胺的组合物，所述第二组接触点通过第一组接触点的一部分 所述第一组接触点是所述第二组接触点的一部分; 并固化组合物。

公开(公告)号：US07314778B2

公开(公告)日：2008-01-01

申请号：US11323300

申请日：2005-12-30

申请人： Saikumar Jayaraman ,  Stephen E. Lehman, Jr.

发明人： Saikumar Jayaraman ,  Stephen E. Lehman, Jr.

IPC分类号： H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC分类号： H01L21/561 ,  C08G73/12 ,  H01L21/563 ,  H01L23/293 ,  H01L24/29 ,  H01L2224/05556 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/274 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/81193 ,  H01L2224/83191 ,  H01L2224/83193 ,  H01L2224/83856 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/04953 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/351 ,  H01L2924/01083 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2224/05599

摘要： A process of packaging a microelectronic chip includes wafer-level application of a chip-packaging composition that includes a polymer of a bis-maleimide. A process includes wafer-level addition of the chip-packaging compositions that include adding particulate fillers to achieve a coefficient of thermal expansion of about 20 ppm/K. A computing system is also included that uses a microelectronic die that was processed with the bis-maleimide at the wafer level, before singulation.

摘要翻译： 包装微电子芯片的方法包括晶片级应用包含双马来酰亚胺聚合物的芯片封装组合物。 一种方法包括晶片级添加芯片封装组合物，其包括添加颗粒填料以获得约20ppm / K的热膨胀系数。 还包括一种计算系统，其在分割之前使用在晶片级用双马来酰亚胺处理的微电子管芯。

公开(公告)号：US20070262421A1

公开(公告)日：2007-11-15

申请号：US11432986

申请日：2006-05-12

申请人： Stephen Lehman ,  James Matayabas ,  Saikumar Jayaraman

发明人： Stephen Lehman ,  James Matayabas ,  Saikumar Jayaraman

IPC分类号： H01L23/29 ,  H01L21/56

CPC分类号： H01L23/24 ,  C08G73/10 ,  C08L79/08 ,  C08L2203/20 ,  C08L2205/02 ,  H01L21/563 ,  H01L21/566 ,  H01L24/29 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/01029 ,  H01L2924/01078 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/3512 ,  H01L2924/00

摘要： Dendrimer/hyperbranched materials are combined with polyimide to form a low CTE material for use as a dielectric substrate layer or an underfill. In the alternative, ruthenium carbene complexes are used to catalyze ROMP cross-linking reactions in polyimides to produce a class of cross-linkable, thermal and mechanical stable material for use as a dielectric substrate or underfill. In another alternative, dendrimers/hyperbranched materials are synthesized by different methods to produce low viscosity, high Tg, fast curing, mechanically and chemically stable materials for imprinting applications.

摘要翻译： 树枝状聚合物/超支化材料与聚酰亚胺组合以形成用作电介质基底层或底部填充剂的低CTE材料。 另一方面，钌卡宾络合物用于催化聚酰亚胺中的ROMP交联反应，以产生用作电介质基底或底部填充剂的一类可交联，热和机械稳定的材料。 在另一种替代方案中，树枝状大分子/超支化材料通过不同的方法合成，以产生用于印记应用的低粘度，高Tg，快速固化，机械和化学稳定的材料。

公开(公告)号：US07294394B2

公开(公告)日：2007-11-13

申请号：US11129516

申请日：2005-05-13

申请人： Saikumar Jayaraman ,  Paul A. Koning ,  Ashay Dani

发明人： Saikumar Jayaraman ,  Paul A. Koning ,  Ashay Dani

IPC分类号： B23B5/16

CPC分类号： H01L23/3737 ,  C08K3/08 ,  C08K3/22 ,  H01L23/4275 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/16152 ,  Y10T29/49002 ,  Y10T29/49083 ,  Y10T29/49099 ,  Y10T29/4913 ,  Y10T428/12701 ,  Y10T428/12896 ,  Y10T428/23 ,  Y10T428/25 ,  Y10T428/252 ,  Y10T428/2982 ,  H01L2924/00

摘要： According to one aspect of the invention, a structure and method for providing improved thermal conductivity of a thermal interface material (TIM) made of phase changed polymer matrix and a fusible filler material is disclosed. The TIM may also have a non-fusible filler material and a percentage of a non-phase change polymer added to the phase change polymer matrix. The TIM, used to mate and conduct heat between two or more components, can be highly filled systems in a polymeric matrix where the fillers are thermally more conductive than the polymer matrix.

摘要翻译： 根据本发明的一个方面，公开了一种用于提供由相变聚合物基体和易熔填料制成的热界面材料（TIM）的改进导热性的结构和方法。 TIM还可以具有不可熔填料和添加到相变聚合物基质中的百分比的非相变聚合物。 用于在两个或多个组分之间配合和传导热量的TIM可以是聚合物基质中的高度填充体系，其中填料的热导率高于聚合物基质。

公开(公告)号：US07041736B2

公开(公告)日：2006-05-09

申请号：US10616085

申请日：2003-07-08

申请人： Saikumar Jayaraman ,  Rahul Manepalli

发明人： Saikumar Jayaraman ,  Rahul Manepalli

IPC分类号： C08L63/00 ,  C08L63/02 ,  H01L21/56

CPC分类号： C08L35/06 ,  C08G59/4261 ,  C08L63/00 ,  C09D135/06 ,  H01L21/563 ,  H01L23/293 ,  H01L24/29 ,  H01L2224/73203 ,  H01L2924/01029 ,  H01L2924/10253 ,  H01L2924/14 ,  Y10T428/31511 ,  Y10T428/31515 ,  C08L2666/02 ,  C08L2666/14 ,  C08L2666/04 ,  H01L2924/00

摘要： An underfill material is presented that may be used between an electrical component and a substrate. The underfill material may be a cured epoxy resin composition comprising a liquid or semisolid epoxy resin and a polyfunctional anhydride polymer and/or oligomer curing agent. The use of anhydride polymers and/or oligomers decrease the volatilization of the composition, thereby reducing the porosity of the underfill material. By changing substituents of the anhydride polymer and/or oligomer, the underfill material may be designed to modify viscosity, decrease moisture adsorption, volatilization and modulus, improve mechanical properties, and enhance adhesion.

公开(公告)号：US06981380B2

公开(公告)日：2006-01-03

申请号：US10326864

申请日：2002-12-20

申请人： Gregory M. Chrysler ,  Paul A. Koning ,  Saikumar Jayaraman ,  Makarem A. Hussein

发明人： Gregory M. Chrysler ,  Paul A. Koning ,  Saikumar Jayaraman ,  Makarem A. Hussein

IPC分类号： F35B21/02

CPC分类号： F25B21/02 ,  H01L23/38 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2224/0401

摘要： Apparatus and methods in accordance with the present invention utilize thermoelectric cooling (TEC) technology to provide enhanced power distribution and/or dissipation from a microelectronic die and/or microelectronic packages. Individual TEC devices are thermally interconnected with the microelectronic die in a number of placement configurations, including between the microelectronic die and the heat sink, on the integrated heat spreader (IHS) inner surface, and on the IHS outer surface. TEC devices comprise p- and n-type semiconducting material created using similar process as the microcircuits. The TEC devices are located in various regions within or on the microelectronic die, including directly below the microcircuits, on the backside of the microelectronic die, and on a separate substrate of microelectronic die material fabricated apart from the microelectronic die and subsequently thermally coupled to the backside of the microelectronic die.

摘要翻译： 根据本发明的装置和方法利用热电冷却（TEC）技术来提供来自微电子管芯和/或微电子封装的增强的功率分配和/或耗散。 单个TEC装置与集成散热器（IHS）内表面和IHS外表面上的多个放置配置（包括微电子管芯和散热器之间）与微电子管芯热互连。 TEC器件包括使用与微电路类似的工艺制造的p型和n型半导体材料。 TEC器件位于微电子管芯内或微电子管芯上的多个区域中，包括微电路正下方，微电子管芯的背面，以及与微电子管芯分开制造的微电子管芯材料的分离衬底，随后热耦合到 微电子模具的背面。

公开(公告)号：US20050214977A1

公开(公告)日：2005-09-29

申请号：US11135776

申请日：2005-05-23

申请人： Christopher Rumer ,  Saikumar Jayaraman

发明人： Christopher Rumer ,  Saikumar Jayaraman

IPC分类号： H01L23/498 ,  H05K3/28 ,  H05K3/34 ,  H01L21/58 ,  H01L21/60

CPC分类号： H01L23/49811 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/00013 ,  H01L2924/15312 ,  H05K3/284 ,  H05K3/3426 ,  H01L2924/00 ,  H01L2224/29099

摘要： Apparatus and methods are provided wherein the reflowable electrically conductive interconnect material coupling the interconnects and/or land-side components of a microelectronic package is protected from elevated temperatures, such as those associated with reflow processes and environments which exceed the melting temperature of the interconnect material. One embodiment of the method provides covering the interconnect material about the interconnects and/or land-side components with heat-resistant curable material which protects the interconnect material from the elevated temperature and provides structural support to the interconnects and/or land-side components at the elevated temperature. One embodiment of the apparatus provides a substrate comprising interconnects and/or land-side components coupled to a carrier substrate with reflowable electrically conductive interconnect material, and a layer of heat-resistant curable material covering the interconnect material and forming fillets about the interconnects and/or land-side components.

摘要翻译： 提供了装置和方法，其中耦合微电子封装的互连和/或陆侧组件的可回流导电互连材料被保护免受诸如与回流工艺和超过互连材料的熔化温度的环境相关的高温 。 该方法的一个实施例提供了用耐热可固化材料围绕互连和/或陆侧部件覆盖互连材料，其保护互连材料免受升高的温度，并且在互连和/或陆侧部件处提供结构支撑 升高的温度。 该装置的一个实施例提供了一种基板，其包括连接到具有可回流导电互连材料的载体基板的互连和/或平台侧部件，以及覆盖互连材料的层的耐热可固化材料并且围绕互连和/ 或陆上部件。

公开(公告)号：US20050214523A1

公开(公告)日：2005-09-29

申请号：US11129516

申请日：2005-05-13

申请人： Saikumar Jayaraman ,  Paul Koning ,  Ashay Dani

发明人： Saikumar Jayaraman ,  Paul Koning ,  Ashay Dani

IPC分类号： C08K3/08 ,  C08K3/22 ,  C08K3/10

CPC分类号： H01L23/3737 ,  C08K3/08 ,  C08K3/22 ,  H01L23/4275 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/16152 ,  Y10T29/49002 ,  Y10T29/49083 ,  Y10T29/49099 ,  Y10T29/4913 ,  Y10T428/12701 ,  Y10T428/12896 ,  Y10T428/23 ,  Y10T428/25 ,  Y10T428/252 ,  Y10T428/2982 ,  H01L2924/00

摘要： A thermal interface material made with a phase change polymer and a fusible filler material.

摘要翻译： 由相变聚合物和易熔填料制成的热界面材料。

公开(公告)号：US06911726B2

公开(公告)日：2005-06-28

申请号：US10165401

申请日：2002-06-07

申请人： Christopher L. Rumer ,  Saikumar Jayaraman

发明人： Christopher L. Rumer ,  Saikumar Jayaraman

IPC分类号： H01L23/498 ,  H05K3/28 ,  H05K3/34 ,  H01L23/48

CPC分类号： H01L23/49811 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/00013 ,  H01L2924/15312 ,  H05K3/284 ,  H05K3/3426 ,  H01L2924/00 ,  H01L2224/29099

摘要： Apparatus and methods are provided wherein the reflowable electrically conductive interconnect material coupling the interconnects and/or land-side components of a microelectronic package is protected from elevated temperatures, such as those associated with reflow processes and environments which exceed the melting temperature of the interconnect material. One embodiment of the method provides covering the interconnect material about the interconnects and/or land-side components with heat-resistant curable material which protects the interconnect material from the elevated temperature and provides structural support to the interconnects and/or land-side components at the elevated temperature. One embodiment of the apparatus provides a substrate comprising interconnects and/or land-side components coupled to a carrier substrate with reflowable electrically conductive interconnect material, and a layer of heat-resistant curable material covering the interconnect material and forming fillets about the interconnects and/or land-side components.

公开(公告)号：US06903171B2

公开(公告)日：2005-06-07

申请号：US10271393

申请日：2002-10-15

申请人： Larry Funderburk Rhodes ,  Andrew Bell ,  Ramakrishna Ravikiran ,  John C. Fondran ,  Saikumar Jayaraman ,  Brian Leslie Goodall ,  Richard A. Mimna ,  John-Henry Lipian

发明人： Larry Funderburk Rhodes ,  Andrew Bell ,  Ramakrishna Ravikiran ,  John C. Fondran ,  Saikumar Jayaraman ,  Brian Leslie Goodall ,  Richard A. Mimna ,  John-Henry Lipian

IPC分类号： C08F4/70 ,  C08F32/00 ,  C08F32/08 ,  C08G61/06 ,  G02B1/04 ,  C08F4/80

CPC分类号： C08G61/06 ,  C08F32/00 ,  C08F32/08 ,  G02B1/04 ,  C08L65/00

摘要： Methods for the addition polymerization of cycloolefins using a cationic Group 10 metal complex and a weakly coordinating anion of the formula: [(R′)zM(L′)x(L″)y]b[WCA]d wherein [(R′)zM(L′)x(L″)y] is a cation complex where M represents a Group 10 transition metal; R′ represents an anionic hydrocarbyl containing ligand; L′ represents a Group 15 neutral electron donor ligand; L″ represents a labile neutral electron donor ligand; x is 1 or 2; and y is 0, 1, 2, or 3; and z is 0 or 1, wherein the sum of x, y, and z is 4; and [WCA] represents a weakly coordinating counteranion complex; and b and d are numbers representing the number of times the cation complex and weakly coordinating counteranion complex are taken to balance the electronic charge on the overall catalyst complex.

摘要翻译： 使用阳离子第10族金属络合物和下式的弱配位阴离子加成聚合环烯的方法：<？in-line-formula description =“In-line formula”end =“lead”？> [（R' M（L'）x（L“）Y'B <？in-line-formula description =“In-line Formulas”end =“tail”？>其中[（R'）Z M（L'）x < （L“）Y是阳离子络合物，其中M表示第10族过渡金属; R'表示含阴离子烃基的配体; L'表示15族中性电子给体配体; L“表示不稳定的中性电子给体配体; x为1或2; y为0,1,2或3; 且z为0或1，其中x，y和z之和为4; 和[WCA]代表弱协调的对抗综合体; b和d是表示阳离子络合物和弱配位抗衡阴离子络合物在总体催化剂络合物上平衡电荷的次数的数字。