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1.发明授权Integrated heat spreader, heat sink or heat pipe with pre-attached phase change thermal interface material and method of making an electronic assembly 有权集成散热器，散热器或具有预附加相变热界面材料的热管和制造电子组件的方法公开(公告)号：US07846778B2
公开(公告)日：2010-12-07
申请号：US10261676
申请日：2002-10-02
CPC分类号： H01L23/4275 , H01L2924/0002 , H01L2924/00
摘要： An integrated heat spreader, heat sink or heat pipe with pre-attached phase change thermal interface material and a method of making an electronic assembly.
摘要翻译： 具有预先附着的相变热界面材料的集成散热器，散热器或热管以及制造电子组件的方法。
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2.发明授权Thermal interface material and electronic assembly having such a thermal interface material 有权热界面材料和具有这种热界面材料的电子组件公开(公告)号：US07311967B2
公开(公告)日：2007-12-25
申请号：US10038334
申请日：2001-10-18
CPC分类号： H01L24/29 , H01L23/3737 , H01L23/42 , H01L2224/16225 , H01L2224/16227 , H01L2224/29 , H01L2224/29101 , H01L2224/29109 , H01L2224/29111 , H01L2224/2919 , H01L2224/2929 , H01L2224/29309 , H01L2224/29311 , H01L2224/29324 , H01L2224/29339 , H01L2224/29347 , H01L2224/29355 , H01L2224/29386 , H01L2224/29393 , H01L2224/32245 , H01L2224/73253 , H01L2924/0001 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/0104 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01058 , H01L2924/0132 , H01L2924/01322 , H01L2924/0133 , H01L2924/0134 , H01L2924/0135 , H01L2924/014 , H01L2924/0665 , H01L2924/14 , H01L2924/16152 , Y10S428/913 , Y10T428/1225 , Y10T428/12701 , Y10T428/12896 , Y10T428/25 , Y10T428/252 , Y10T428/256 , Y10T428/257 , Y10T428/258 , Y10T428/2982 , Y10T428/31511 , Y10T428/31529 , Y10T428/31663 , Y10T428/31692 , H01L2924/00 , H01L2924/01022 , H01L2924/01034 , H01L2924/01083 , H01L2224/29099 , H01L2924/00014 , H01L2924/0503 , H01L2924/05032 , H01L2924/04642 , H01L2924/05432 , H01L2224/29199 , H01L2224/29299
摘要： A thermal interface material is described for thermal coupling of an electronic component to a thermally conductive member. The thermal interface material includes a viscoelastic polymer matrix material, fusible solder particles in the matrix material, and filler particles in the matrix material. The solder particles have a melting temperature below a selected temperature (e.g. 157° C. for indium) and the filler particles have a melting temperature substantially above the selected temperature (e.g. 961° C. for silver). The filler particles keep the thermal interface material intact under adverse thermal and stress conditions.
摘要翻译： 描述了热界面材料用于将电子部件热耦合到导热部件。 热界面材料包括粘弹性聚合物基质材料，基质材料中的易熔焊料颗粒和基质材料中的填料颗粒。 焊料颗粒具有低于所选温度（例如铟的157℃）的熔融温度，并且填料颗粒具有基本上高于所选温度（例如银的961℃）的熔融温度。 填料颗粒在不利的热和应力条件下保持热界面材料完好无损。
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3.发明授权Integrated heat spreader, heat sink or heat pipe with pre-attached phase change thermal interface material and method of making an electronic assembly 有权集成散热器，散热器或具有预附加相变热界面材料的热管和制造电子组件的方法公开(公告)号：US07473995B2
公开(公告)日：2009-01-06
申请号：US10103801
申请日：2002-03-25
IPC分类号： H01L23/28 , H01L23/495 , H01L23/12 , H01L23/10 , H01L21/00
CPC分类号： H01L23/4275 , H01L2924/0002 , H01L2924/00
摘要： An integrated heat spreader, heat sink or heat pipe with pre-attached phase change thermal interface material and a method of making an electronic assembly.
摘要翻译： 具有预先附着的相变热界面材料的集成散热器，散热器或热管以及制造电子组件的方法。
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4.发明授权公开(公告)号：US06911726B2
公开(公告)日：2005-06-28
申请号：US10165401
申请日：2002-06-07
IPC分类号： H01L23/498 , H05K3/28 , H05K3/34 , H01L23/48
CPC分类号： H01L23/49811 , H01L2224/05571 , H01L2224/05573 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/00013 , H01L2924/15312 , H05K3/284 , H05K3/3426 , H01L2924/00 , H01L2224/29099
摘要： Apparatus and methods are provided wherein the reflowable electrically conductive interconnect material coupling the interconnects and/or land-side components of a microelectronic package is protected from elevated temperatures, such as those associated with reflow processes and environments which exceed the melting temperature of the interconnect material. One embodiment of the method provides covering the interconnect material about the interconnects and/or land-side components with heat-resistant curable material which protects the interconnect material from the elevated temperature and provides structural support to the interconnects and/or land-side components at the elevated temperature. One embodiment of the apparatus provides a substrate comprising interconnects and/or land-side components coupled to a carrier substrate with reflowable electrically conductive interconnect material, and a layer of heat-resistant curable material covering the interconnect material and forming fillets about the interconnects and/or land-side components.
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公开(公告)号：US07303977B2
公开(公告)日：2007-12-04
申请号：US10985572
申请日：2004-11-10
IPC分类号： H01L21/00
CPC分类号： B23K26/0624 , B23K26/40 , B23K2101/40 , B23K2103/50
摘要： A laser micromachining method is disclosed wherein a workpiece is milled using an incident beam from a laser beam focused above the surface of the workpiece. The incident beam is guided by a plasma channel generated by the incident beam. The plasma channel, which has a relatively constant diameter over an extended distance, is generated by continual Kerr effect self-focusing balanced by ionization of air beam defocusing.
摘要翻译： 公开了一种激光微加工方法，其中使用来自聚焦在工件表面上的激光束的入射光束研磨工件。 入射光束由入射光束产生的等离子体通道引导。 等离子体通道在延长的距离上具有相对恒定的直径，是由通过气流散焦电离平衡的连续克尔效应自聚焦产生的。
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公开(公告)号：US07059045B2
公开(公告)日：2006-06-13
申请号：US10728329
申请日：2003-12-04
申请人： Daoqiang Lu , Christopher L. Rumer
发明人： Daoqiang Lu , Christopher L. Rumer
IPC分类号： H05K3/34
CPC分类号： H01L21/68707 , Y10S29/044 , Y10T29/49128 , Y10T29/4913 , Y10T29/49144 , Y10T29/53174 , Y10T29/53178 , Y10T29/53191 , Y10T29/53261 , Y10T29/53265
摘要： In some embodiments, a method includes picking up a clip with a chuck, and, while holding the clip with the chuck, picking up an integrated circuit (IC) die with the IC die in contact with the clip.
摘要翻译： 在一些实施例中，一种方法包括用卡盘拾取夹子，并且在用卡盘夹住夹子的同时，用IC芯片拾取与夹子接触的集成电路（IC）模具。
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公开(公告)号：US06992891B2
公开(公告)日：2006-01-31
申请号：US10406721
申请日：2003-04-02
IPC分类号： H05K7/20
CPC分类号： H01L23/427 , H01L21/563 , H01L23/36 , H01L23/38 , H01L23/473 , H01L25/0655 , H01L2224/0401 , H01L2224/04026 , H01L2224/16225 , H01L2224/32225 , H01L2224/32245 , H01L2224/73204 , H01L2224/73253 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/15311 , H01L2924/15312 , H01L2924/16152 , H01L2924/00
摘要： An assembly including a heat dissipation device having an attachment surface, a substrate having an attachment surface, and a plurality of metal balls extending between the heat dissipation device attachment surface and the substrate attachment surface. The assembly may include at least one microelectronic die disposed between the heat dissipation device attachment surface and the substrate attachment surface.
摘要翻译： 一种组件，包括具有附接表面的散热装置，具有附接表面的基板和在散热装置附接表面和基板附接表面之间延伸的多个金属球。 组件可以包括设置在散热装置附接表面和基板附接表面之间的至少一个微电子管芯。
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公开(公告)号：US07304381B2
公开(公告)日：2007-12-04
申请号：US11461803
申请日：2006-08-02
IPC分类号： H01L23/34
CPC分类号： H01L23/40 , H01L23/4006 , H01L23/4093 , H01L2023/4062 , H01L2023/4087 , H01L2224/16225 , H01L2224/32225 , H01L2224/32245 , H01L2224/73204 , H01L2224/73253 , H01L2924/00014 , H01L2924/16251 , H01L2924/19105 , H01L2924/19106 , H01L2924/00012 , H01L2224/0401
摘要： In some embodiments, an integrated circuit package includes a substrate and a heat spreader coupled to the substrate by fasteners. Thermal interface material thermally couples the die to the heat spreader. The heat spreader is provided over the die and is attached to the substrate with fasteners rather than a sealant-adhesive. Some examples of suitable fasteners may include rivets, barbed connectors, and gripping clips.
摘要翻译： 在一些实施例中，集成电路封装包括基板和通过紧固件联接到基板的散热器。 热界面材料将模具热耦合到散热器上。 散热器设置在模具上并且用紧固件而不是密封剂粘合剂附接到基板。 合适的紧固件的一些示例可以包括铆钉，带倒钩的连接器和夹紧夹。
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公开(公告)号：US06892927B2
公开(公告)日：2005-05-17
申请号：US10423117
申请日：2003-04-24
IPC分类号： B23K20/00 , B23K20/10 , B23K20/24 , H01L21/607 , B23K37/00 , B23K1/06 , B23K5/20 , B23K31/02
CPC分类号： H01L24/85 , B23K20/005 , B23K20/10 , B23K20/24 , H01L24/45 , H01L24/48 , H01L24/78 , H01L2224/05624 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/48624 , H01L2224/48724 , H01L2224/78301 , H01L2224/85181 , H01L2224/85205 , H01L2924/01006 , H01L2924/01013 , H01L2924/01033 , H01L2924/01039 , H01L2924/0106 , H01L2924/01079 , H01L2924/12042 , H01L2924/14 , H01L2924/00014 , H01L2924/00 , H01L2924/00015
摘要： A method of bonding a wire to a bond pad on an electronic or photonic device is provided. A section of the wire is held within a bond head of the wirebonding apparatus. A laser beam is directed onto the bond pad. Energy of the laser beam heats the bond pad to the temperature that is higher than the temperature of the device. The bond head is subsequently moved toward the device to bring a portion of the wire into contact with the bond pad. Ultrasonic energy is provided to an interface between the portion of the wire and the bond pad.
摘要翻译： 提供了将电线键合到电子或光子器件上的接合焊盘的方法。 线的一部分保持在引线接合装置的接合头内。 激光束被引导到接合焊盘上。 激光束的能量将接合焊盘加热到高于器件温度的温度。 接合头随后朝向该装置移动以使一部分电线与接合焊盘接触。 超声能量被提供到线的部分和接合垫之间的界面。
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10.发明授权Method to compensate for stress between heat spreader and thermal interface material 有权弥补散热器和热界面材料之间应力的方法公开(公告)号：US06748350B2
公开(公告)日：2004-06-08
申请号：US09963438
申请日：2001-09-27
IPC分类号： G06G748
CPC分类号： H01L23/3675 , H01L23/34 , H01L2224/73204 , H01L2224/73253 , H01L2924/16152
摘要： A device and method identify and compensate for tensile and/or shear stress due to heat-caused expansion and contraction between an integrated heat spreader and thermal interface material. This device and method may change the shape of the integrated heat spreader based upon the identification of location(s) of high tensile and/or shear stress so that additional thermal interface material may be deposited between the integrated heat spreader and a die in corresponding locations. Utilizing this method and device, heat is efficiently transferred from the die to the integrated heat spreader.
摘要翻译： 一种装置和方法识别和补偿由于集成散热器和热界面材料之间的热引起的膨胀和收缩引起的拉伸和/或剪切应力。 该装置和方法可以基于识别高拉伸和/或剪切应力的位置来改变集成散热器的形状，使得额外的热界面材料可以沉积在集成的散热器和相应位置的模具之间 。 利用该方法和装置，将热量从模具有效地传递到集成散热器。
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